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1. 发明授权

US08071884B2 Flexible printed circuit board having curved edge 有权
标题翻译：具有弯曲边缘的柔性印刷电路板
公开(公告)号：US08071884B2
公开(公告)日：2011-12-06
申请号：US12106513
申请日：2008-04-21
申请人： Ming Wang , Dong-Qing He , Xiao-Hong Zhang , Cheng-Hsien Lin
发明人： Ming Wang , Dong-Qing He , Xiao-Hong Zhang , Cheng-Hsien Lin
IPC分类号： H05K1/11
CPC分类号： H05K1/118 , H05K1/0281 , H05K3/281 , H05K2201/09145
摘要： A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.
摘要翻译：柔性印刷电路板包括基底和覆盖物。基部包括与主要部分连接的主要部分和远端部分。远侧部分具有第一部分和第二暴露部分。覆盖层形成在基部上并覆盖远端部分的主要部分和第一部分。远端部分的第二暴露部分被覆盖物覆盖。覆盖物包括用作远端部分的第一部分和第二部分之间的界面的弯曲边缘。

2. 发明授权

US08049113B2 Printed circuit boards 有权
标题翻译：印刷电路板
公开(公告)号：US08049113B2
公开(公告)日：2011-11-01
申请号：US12047152
申请日：2008-03-12
申请人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
发明人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
摘要： The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
摘要翻译：印刷电路板技术领域本发明涉及印刷电路板。在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。导电层包括第一导电部分，连接部分和第二导电部分。连接部分包括第一端和第二端。第一端连接到第一导电部分; 第二端连接到第二导电部分。连接部的宽度从第一端到第二端逐渐减小。可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。

3. 发明申请

US20080283289A1 PRINTED CIRCUIT BOARDS 有权
标题翻译：印刷电路板
公开(公告)号：US20080283289A1
公开(公告)日：2008-11-20
申请号：US12047152
申请日：2008-03-12
申请人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
发明人： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC分类号： H05K1/02
CPC分类号： H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
摘要： The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
摘要翻译：印刷电路板技术领域本发明涉及印刷电路板。在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。导电层包括第一导电部分，连接部分和第二导电部分。连接部分包括第一端和第二端。第一端连接到第一导电部分; 第二端连接到第二导电部分。连接部的宽度从第一端到第二端逐渐减小。可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。

4. 发明授权

US07987586B2 Method for manufacturing printed circuit board having different thicknesses in different areas 有权
标题翻译：制造不同区域厚度不同的印刷电路板的方法
公开(公告)号：US07987586B2
公开(公告)日：2011-08-02
申请号：US12274190
申请日：2008-11-19
申请人： Dong-Qing He , Ming Wang , Yun-Li Zhu , Wen-Chin Lee
发明人： Dong-Qing He , Ming Wang , Yun-Li Zhu , Wen-Chin Lee
IPC分类号： H05K3/36
CPC分类号： H05K3/4691 , H05K3/386 , H05K3/4652 , H05K2201/0909 , H05K2201/09127 , H05K2203/063 , H05K2203/308 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.
摘要翻译：一种用于制造在不同区域中具有不同厚度的印刷电路板（PCB）的方法包括：提供具有限定两个假想边界线的两个横向不需要部分的第一基板，具有通孔的粘合剂层和具有用于安装电子元件; 在对应于安装区域的第一基板的中间不想要的部分中形成限定虚拟边界线的两个槽; 层叠第一和第二基板和粘合剂层，其中安装区域经由通孔暴露; 用填充材料填充两个槽和通孔，从而获得半成品PCB板; 沿着虚拟边界线切割半成品PCB板，以去除对应于两个横向不需要部分的两个横向不需要部分和第二基板的一部分; 并去除中间不需要的部分和填充材料。

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