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1. 发明申请

US20090134202A1 REFLOW APPARATUS AND METHOD 审中-公开
标题翻译：回流装置和方法
公开(公告)号：US20090134202A1
公开(公告)日：2009-05-28
申请号：US12324458
申请日：2008-11-26
申请人： Min-Ill KIM , Il-Young HAN , Ki-Kwon JEONG
发明人： Min-Ill KIM , Il-Young HAN , Ki-Kwon JEONG
IPC分类号： B23K37/00 , H05B6/04
CPC分类号： B23K3/0475 , B23K2101/40 , H01L2924/0002 , H05K3/3436 , H01L2924/00
摘要： Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a plurality of magazines is stored in the input stacker. The magazines stored in the input stacker are moved to the input module and are introduced into the heating unit by the moving unit. Solder balls provided on the processing objects within the heating unit are quickly processed using an induction heating method. The processing objects that have undergone a reflow process are loaded in a magazine on an output module of the unloader unit and are then stored in an output stacker.
摘要翻译：提供回流装置和方法。回流装置包括加载单元，加热单元，卸载单元和移动单元。装载单元具有输入模块和输入堆垛机。处理对象存储在杂志中的垂直堆栈中，并且多个杂志被存储在输入堆叠器中。存储在输入堆叠器中的杂志被移动到输入模块，并通过移动单元被引入加热单元。使用感应加热方法快速地处理设置在加热单元内的加工对象上的焊球。已经经历回流处理的处理对象被装载在卸载单元的输出模块的仓库中，然后存储在输出堆垛机中。

2. 发明申请

US20090127314A1 IN-LINE PACKAGE APPARATUSES AND METHODS 有权
标题翻译：在线包装设备和方法
公开(公告)号：US20090127314A1
公开(公告)日：2009-05-21
申请号：US12272867
申请日：2008-11-18
申请人： Min-Ill KIM , Jong-Gi Lee , Kwang-Yong Lee , Ki-Kwon Jeong
发明人： Min-Ill KIM , Jong-Gi Lee , Kwang-Yong Lee , Ki-Kwon Jeong
IPC分类号： B23K3/00
CPC分类号： B23K1/0016 , B23K1/002 , B23K2101/40 , H01L24/75 , H01L24/81 , H01L2224/48091 , H01L2224/81191 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/15311 , H01L2924/3025 , H01L2924/351 , H01L2924/00014 , H01L2924/00
摘要： An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.
摘要翻译：一种在线封装装置包括第一处理单元，输入存储单元，加热单元和输出存储单元。第一处理单元执行球连接处理或芯片安装处理。在第一处理单元中完成处理的处理对象被接收在盒中以便被垂直堆叠，并且每个具有一个或多个处理对象的多个杂志被存储在输入堆叠器中。加热单元通过感应加热方法对存储在输入堆叠器中的仓库中的处理对象进行回流处理。回收处理完成的处理对象被接收在仓库中，然后存储在输出堆垛机中。

3. 发明申请

US20080191364A1 APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY 审中-公开
标题翻译：用于堆叠半导体晶片的装置，使用其制造半导体封装的方法和制造的半导体封装
公开(公告)号：US20080191364A1
公开(公告)日：2008-08-14
申请号：US12102778
申请日：2008-04-14
申请人： Min-Ill KIM , Dong-Kuk KIM , Chang-Cheol MOON , Tae-Hoe HWANG , Jae-Young HONG
发明人： Min-Ill KIM , Dong-Kuk KIM , Chang-Cheol MOON , Tae-Hoe HWANG , Jae-Young HONG
IPC分类号： H01L23/498
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

4. 发明申请

US20070018295A1 APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY 有权
标题翻译：用于堆叠半导体晶片的装置，使用其制造半导体封装的方法和制造的半导体封装
公开(公告)号：US20070018295A1
公开(公告)日：2007-01-25
申请号：US11534924
申请日：2006-09-25
申请人： Min-Ill KIM , Dong-Kuk KIM , Chang-Cheol LEE , Tae-Hoe HWANG , Jae-Young HONG
发明人： Min-Ill KIM , Dong-Kuk KIM , Chang-Cheol LEE , Tae-Hoe HWANG , Jae-Young HONG
IPC分类号： H01L23/02 , B65B35/00
CPC分类号： H01L21/67132 , H01L24/73 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83 , H01L2224/94 , H01L2224/97 , H01L2225/0651 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01033 , H01L2924/01082 , H01L2924/15311 , Y10T156/1763 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/92247
摘要： The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.
摘要翻译：本发明涉及用于堆叠半导体芯片的装置，制造其使用的半导体封装的方法和由其制造的半导体封装。用于堆叠半导体芯片的装置可以包括用于支撑晶片的两个表，用于拾取半导体芯片的拾取器和用于垂直和水平地移动拾取器的拾取器传送单元。使用该半导体封装的半导体封装的制造方法可以容易且快速地堆叠半导体芯片，从而提高半导体封装制造的生产率。此外，将具有较厚膜的半导体芯片附着到具有较薄膜的另一半导体芯片上。更厚的半导体芯片可以保护较薄的半导体芯片免受诸如由拾取器引起的外部冲击而发生的诸如碎裂或翘曲的故障，从而提高封装的可靠性。

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