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1. 发明授权

US4689721A Dual printed circuit board module 失效
标题翻译：双印刷电路板模块
公开(公告)号：US4689721A
公开(公告)日：1987-08-25
申请号：US848878
申请日：1986-04-07
申请人： Milton F. Damerow , Michael J. Kocin
发明人： Milton F. Damerow , Michael J. Kocin
IPC分类号： H05K1/14 , H05K3/32 , H05K5/00 , H05K7/20
CPC分类号： H01R23/70 , H01R12/722 , H01R12/73 , H05K1/144 , H05K2201/044
摘要： A dual printed circuit board module having two printed circuit boards mounted in an inwardly facing relationship on two thermal frame members that also function as structural and enclosing members. A connector mounted between and at one edge of the thermal frame members serves to establish electrical connections between the circuit boards and a backplane circuit panel to which the boards are to be connected. A flexible interconnect circuit, located near the same edge of the boards as the backplane connector, is used both to connect the boards to the connector and to provide board-to-board connections independently of the connector. This arrangement greatly facilitates assembly and testing of the module, reduces signal path lengths, and enhances the structural and thermal integrity of the module.
摘要翻译：一种双印刷电路板模块，具有两个印刷电路板，两个印刷电路板以向内的关系安装在也用作结构和封闭构件的两个热框架构件上。安装在热框架构件的一个边缘之间和在一个边缘处的连接器用于建立电路板与板连接到的背板电路板之间的电连接。位于与背板连接器相同的板的边缘附近的柔性互连电路用于将板连接到连接器，并且独立于连接器提供板对板连接。这种布置大大方便了模块的组装和测试，减少了信号路径长度，并且增强了模块的结构和热完整性。

2. 发明授权

US06320750B2 Sub-modular configurable avionics 有权
标题翻译：子模块化可配置航空电子设备
公开(公告)号：US06320750B2
公开(公告)日：2001-11-20
申请号：US09198755
申请日：1998-11-24
申请人： Barton G. Shaler , Donald A. Porter , Milton F. Damerow
发明人： Barton G. Shaler , Donald A. Porter , Milton F. Damerow
IPC分类号： H05K118
CPC分类号： H05K7/1409 , H01R12/721 , H01R13/658 , H05K1/117 , H05K1/144 , H05K1/189 , H05K3/0058 , H05K3/4691 , H05K2201/2009
摘要： A line replaceable module (LRM) configured with a plurality of mini-modules, each of which have relatively higher contact densities than currently available LRMs with the same form factor, for example, a Standard Electrical Module-Size E (SEM-E) form factor. The mini-modules are significantly less expensive than an entire module allowing such mini-modules to be disposable, eliminating relatively costly fault diagnostics and repair. Each mini-module includes a printed circuit board which includes a rigid primary portion, a rigid secondary portion and flexible portion interconnecting the primary and secondary portions. The rigid secondary portion may be configured to provide dual-sided interconnection to a backplane data bus. Use of the dual-sided rigid secondary portion provides for generous spacing for contact densities much higher than known contact densities for LRMs with the same form factor. The rigid primary portion carries the components forming the LRM. The use of the flexible portion provides compensation for tolerance variations as well as vibrational and thermal stress relative to connector systems used on known SEM-E LRMs.
摘要翻译：配置有多个小型模块的线路可更换模块（LRM），每个微型模块具有比具有相同形状因子的当前可用的LRM相对更高的接触密度，例如标准电气模块尺寸E（SEM-E）形式因子。微型模块比整个模块要便宜得多，允许这样的迷你模块是一次性的，消除了相对昂贵的故障诊断和维修。每个迷你模块包括印刷电路板，其包括刚性主要部分，刚性第二部分和互连主要部分和次要部分的柔性部分。刚性二次部分可以被配置为提供与背板数据总线的双面互连。使用双面刚性二次部分为具有相同形状因子的LRM的已知接触密度提供了大大的接触密度间隔。刚性主要部分携带形成LRM的部件。使用柔性部分相对于在已知的SEM-E LRM上使用的连接器系统，允许公差变化以及振动和热应力的补偿。

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