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1. 发明申请

US20070087950A1 Method and system for using a two-phases substrate cleaning compound 有权
标题翻译：使用两相基板清洗剂的方法和系统
公开(公告)号：US20070087950A1
公开(公告)日：2007-04-19
申请号：US11519354
申请日：2006-09-11
申请人： Mikhail Korolik , Erik Freer , John de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
发明人： Mikhail Korolik , Erik Freer , John de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
IPC分类号： B08B3/00 , B08B7/00 , C11D7/32
CPC分类号： C11D11/0047 , B08B7/02 , C11D1/146 , C11D3/2079 , C11D9/02 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/6708 , H01L21/67086
摘要： Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.
摘要翻译：提供了清除化合物，设备和从基材表面除去污染物的方法。提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。清洁化合物还包括分散在粘性液体中的多个固体组分，多个固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

2. 发明申请

US20060128600A1 Cleaning compound and method and system for using the cleaning compound 有权
标题翻译：清洁剂及使用清洁剂的方法和系统
公开(公告)号：US20060128600A1
公开(公告)日：2006-06-15
申请号：US11347154
申请日：2006-02-03
申请人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
发明人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
IPC分类号： B08B3/02 , C11D3/20
CPC分类号： H01L21/02052 , B08B7/02 , C11D3/2079 , C11D9/02 , C11D9/26 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/425 , G03F7/426 , H05K3/26
摘要： A cleaning compound is provided. The cleaning compound includes about 0.1 weight percent to about 10 weight percent of a fatty acid dispersed in water. The cleaning compound includes an amount of a base sufficient to bring a pH of the fatty acid water solution to about a level where above about 50% of the dispersed fatty acid is ionized. A method for cleaning a substrate, a system for cleaning a substrate, and a cleaning solution prepared by a process are also provided.
摘要翻译：提供清洁化合物。清洁化合物包括分散在水中的约0.1重量％至约10重量％的脂肪酸。清洁化合物包括一定量的足以使脂肪酸水溶液的pH达到大约50％的分散脂肪酸被离子化的水平的碱。还提供了清洁基板的方法，用于清洁基板的系统以及通过工艺制备的清洁溶液。

3. 发明申请

US20070079848A1 Method and apparatus for removing contamination from substrate 失效
标题翻译：去除基材污染的方法和装置
公开(公告)号：US20070079848A1
公开(公告)日：2007-04-12
申请号：US11336215
申请日：2006-01-20
申请人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker , Clint Thomas , John Parks
发明人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker , Clint Thomas , John Parks
IPC分类号： C23G1/00 , B08B7/00 , B08B7/04 , B08B3/00 , B08B3/12
CPC分类号： H01L21/02057 , B05D3/10 , B08B7/02 , C11D1/04 , C11D3/042 , C11D3/044 , C11D3/18 , C11D3/2079 , C11D3/222 , C11D3/225 , C11D3/3765 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0004 , C11D17/0013 , C11D17/0017 , C11D17/003 , C11D17/041 , C23G1/00 , C23G1/18 , G03F7/42 , G03F7/423 , H01L21/02052 , H01L21/02096 , H01L21/31133 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086
摘要： A cleaning material is disposed over a substrate. The cleaning material includes solid components dispersed within a liquid medium. A force is applied to the solid components within the liquid medium to bring the solid components within proximity to contaminants present on the substrate. The force applied to the solid components can be exerted by an immiscible component within the liquid medium. When the solid components are brought within sufficient proximity to the contaminants, an interaction is established between the solid components and the contaminants. Then, the solid components are moved away from the substrate such that the contaminants having interacted with the solid components are removed from the substrate.
摘要翻译：清洁材料设置在基板上。清洁材料包括分散在液体介质中的固体组分。将力施加到液体介质中的固体组分以使固体组分接近存在于基底上的污染物。施加到固体组分的力可以通过液体介质中的不混溶组分施加。当固体组分被充分接近污染物时，在固体组分和污染物之间建立了相互作用。然后，将固体组分从衬底移开，使得与固体组分相互作用的污染物从衬底上除去。

4. 发明申请

US20060128590A1 Method for removing contamination from a substrate and for making a cleaning solution 有权
公开(公告)号：US20060128590A1
公开(公告)日：2006-06-15
申请号：US11346894
申请日：2006-02-03
申请人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
发明人： Erik Freer , John de Larios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
IPC分类号： C23G1/00 , B08B5/04 , B08B3/00 , C11D17/00
CPC分类号： H01L21/02052 , B08B7/02 , C11D9/00 , C11D9/02 , C11D9/267 , C11D11/0047 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/42 , H01L21/02057 , H01L21/02096
摘要： A method is provided for removing contamination from a substrate. The method includes applying a cleaning solution having a dispersed phase, a continuous phase and particles dispersed within the continuous phase to a surface of the substrate. The method includes forcing one of the particles dispersed within the continuous phase proximate to one of the surface contaminants. The forcing is sufficient to overcome any repulsive forces between the particles and the surface contaminants so that the one of the particles and the one of the surface contaminants are engaged. The method also includes removing the engaged particle and surface contaminant from the surface of the substrate. A process to manufacture the cleaning material is also provided.

5. 发明授权

US08590550B2 Apparatus for cleaning contaminants from substrate 失效
标题翻译：从基材清洗污染物的设备
公开(公告)号：US08590550B2
公开(公告)日：2013-11-26
申请号：US12862091
申请日：2010-08-24
申请人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
发明人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
IPC分类号： B08B3/00
CPC分类号： C11D11/0047 , B08B7/02 , C11D1/146 , C11D3/2079 , C11D9/02 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/6708 , H01L21/67086
摘要： A substrate holder is defined to support a substrate. A rotating mechanism is defined to rotate the substrate holder. An applicator is defined to extend over the substrate holder to dispense a cleaning material onto a surface of the substrate when present on the substrate holder. The applicator is defined to apply a downward force to the cleaning material on the surface of the substrate. In one embodiment the cleaning material is gelatinous.
摘要翻译：衬底支架限定为支撑衬底。限定旋转机构以旋转衬底保持器。施加器限定为在衬底保持器上延伸以在存在于衬底保持器上时将清洁材料分配到衬底的表面上。施加器被限定为向衬底表面上的清洁材料施加向下的力。在一个实施方案中，清洁材料是凝胶状的。

6. 发明授权

US08242067B2 Two-phase substrate cleaning material 失效
标题翻译：两相基材清洗材料
公开(公告)号：US08242067B2
公开(公告)日：2012-08-14
申请号：US12862072
申请日：2010-08-24
申请人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
发明人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
IPC分类号： C11D1/04
CPC分类号： C11D11/0047 , B08B7/02 , C11D1/146 , C11D3/2079 , C11D9/02 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/6708 , H01L21/67086
摘要： A cleaning compound is disclosed for removing particulate contaminants from a semiconductor substrate surface. The cleaning compound includes a liquid and carboxylic acid solid components dispersed in a substantially uniform manner in the liquid. A concentration of the carboxylic acid solid components in the liquid exceeds a solubility limit of the carboxylic acid solid components in the liquid. In one embodiment, a concentration of the carboxylic acid solid components in the liquid is within a range extending from about 3 percent by weight to about 5 percent by weight. In one embodiment, the carboxylic acid solid components are defined by a carbon number of at least four. The carboxylic acid solid components are defined to interact with the particulate contaminants on the semiconductor substrate surface to remove the particulate contaminants from the semiconductor substrate surface. The cleaning compound is viscous and may be formed as a gel.
摘要翻译：公开了用于从半导体衬底表面去除微粒污染物的清洁化合物。清洁化合物包括以基本均匀的方式分散在液体中的液体和羧酸固体组分。液体中羧酸固体组分的浓度超过了液体中羧酸固体组分的溶解度极限。在一个实施方案中，液体中羧酸固体组分的浓度在约3重量％至约5重量％的范围内。在一个实施方案中，羧酸固体组分由至少四个的碳数定义。羧酸固体组分被定义为与半导体衬底表面上的颗粒污染物相互作用以从半导体衬底表面去除颗粒污染物。清洁化合物是粘稠的并且可以形成为凝胶。

7. 发明授权

US07799141B2 Method and system for using a two-phases substrate cleaning compound 有权
标题翻译：使用两相基板清洗剂的方法和系统
公开(公告)号：US07799141B2
公开(公告)日：2010-09-21
申请号：US11519354
申请日：2006-09-11
申请人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
发明人： Mikhail Korolik , Erik M. Freer , John M. de Larios , Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker
IPC分类号： B08B7/00
CPC分类号： C11D11/0047 , B08B7/02 , C11D1/146 , C11D3/2079 , C11D9/02 , C11D17/0013 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/6708 , H01L21/67086
摘要： Cleaning compounds, apparatus, and methods to remove contaminants from a substrate surface are provided. An exemplary cleaning compound to remove particulate contaminants from a semiconductor substrate surface is provided. The cleaning compound includes a viscous liquid with a viscosity between about 1 cP to about 10,000 cP. The cleaning compound also includes a plurality of solid components dispersed in the viscous liquid, the plurality of solid components interact with the particulate contaminants on the substrate surface to remove the particulate contaminants from the substrate surface.
摘要翻译：提供了清除化合物，设备和从基材表面除去污染物的方法。提供了从半导体衬底表面去除颗粒污染物的示例性清洁化合物。清洁化合物包括粘度在约1cP至约10,000cP之间的粘性液体。清洁化合物还包括分散在粘性液体中的多个固体组分，多个固体组分与基底表面上的颗粒污染物相互作用以从基底表面去除颗粒污染物。

8. 发明申请

US20090114249A1 System and method for contained chemical surface treatment 失效
标题翻译：含化学表面处理的系统和方法
公开(公告)号：US20090114249A1
公开(公告)日：2009-05-07
申请号：US11704435
申请日：2007-02-08
申请人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
发明人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
IPC分类号： B08B3/04
CPC分类号： H01L21/02057 , C25D5/34 , C25D7/12 , H01L21/288 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/76841
摘要： An apparatus, system and method for preparing a surface of a substrate using a proximity head includes applying a non-Newtonian fluid between the surface of the substrate and a head surface of the proximity head. The non-Newtonian fluid defines a containment wall along one or more sides between the head surface and the surface of the substrate. The one or more sides provided with the non-Newtonian fluid define a treatment region on the substrate between the head surface and the surface of the substrate. A Newtonian fluid is applied to the surface of the substrate through the proximity head, such that the applied Newtonian fluid is substantially contained in the treatment region defined by the containment wall. The contained Newtonian fluid aids in the removal of one or more contaminants from the surface of the substrate. In one example, the non-Newtonian fluid can also be used to create ambient controlled isolated regions, which can assist in controlled processing of surfaces within the regions. In an alternate example, a second non-Newtonian fluid is applied to the treatment region instead of the Newtonian fluid. The second non-Newtonian fluid acts on one or more contaminants on the surface of the substrate substantially removing them from the surface of the substrate.
摘要翻译：使用接近头来制备基底的表面的装置，系统和方法包括在基底的表面和邻近头的头表面之间施加非牛顿流体。非牛顿流体在头表面和基底表面之间沿着一个或多个侧面限定了容纳壁。设置有非牛顿流体的一个或多个侧面限定了头表面和基底表面之间的基底上的处理区域。通过邻近头将牛顿流体施加到基底的表面，使得所施加的牛顿流体基本上包含在由容纳壁限定的处理区域中。所含的牛顿流体有助于从基底表面去除一种或多种污染物。在一个示例中，非牛顿流体也可以用于创建环境控制的隔离区域，这可以有助于区域内的表面的受控处理。在替代示例中，将第二非牛顿流体施加到处理区域而不是牛顿流体。第二非牛顿流体作用于衬底表面上的一种或多种污染物，基本上将其从衬底的表面上除去。

9. 发明授权

US07897213B2 Methods for contained chemical surface treatment 失效
标题翻译：含化学表面处理方法
公开(公告)号：US07897213B2
公开(公告)日：2011-03-01
申请号：US11704435
申请日：2007-02-08
申请人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
发明人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
IPC分类号： B05D5/00
CPC分类号： H01L21/02057 , C25D5/34 , C25D7/12 , H01L21/288 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/76841
摘要： An apparatus, system and method for preparing a surface of a substrate using a proximity head includes applying a non-Newtonian fluid between the surface of the substrate and a head surface of the proximity head. The non-Newtonian fluid defines a containment wall along one or more sides between the head surface and the surface of the substrate. The one or more sides provided with the non-Newtonian fluid define a treatment region on the substrate between the head surface and the surface of the substrate. A Newtonian fluid is applied to the surface of the substrate through the proximity head, such that the applied Newtonian fluid is substantially contained in the treatment region defined by the containment wall. The contained Newtonian fluid aids in the removal of one or more contaminants from the surface of the substrate. In one example, the non-Newtonian fluid can also be used to create ambient controlled isolated regions, which can assist in controlled processing of surfaces within the regions. In an alternate example, a second non-Newtonian fluid is applied to the treatment region instead of the Newtonian fluid. The second non-Newtonian fluid acts on one or more contaminants on the surface of the substrate substantially removing them from the surface of the substrate.
摘要翻译：使用接近头来制备基底的表面的装置，系统和方法包括在基底的表面和邻近头的头表面之间施加非牛顿流体。非牛顿流体在头表面和基底表面之间沿着一个或多个侧面限定了容纳壁。设置有非牛顿流体的一个或多个侧面限定了头表面和基底表面之间的基底上的处理区域。通过邻近头将牛顿流体施加到基底的表面，使得所施加的牛顿流体基本上包含在由容纳壁限定的处理区域中。所含的牛顿流体有助于从基底表面去除一种或多种污染物。在一个示例中，非牛顿流体也可以用于创建环境控制的隔离区域，这可以有助于区域内的表面的受控处理。在替代示例中，将第二非牛顿流体施加到处理区域而不是牛顿流体。第二非牛顿流体作用于衬底表面上的一种或多种污染物，基本上将其从衬底的表面上除去。

10. 发明申请

US20110061687A1 Apparatus for Contained Chemical Surface Treatment 审中-公开
标题翻译：含化学表面处理装置
公开(公告)号：US20110061687A1
公开(公告)日：2011-03-17
申请号：US12949762
申请日：2010-11-18
申请人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
发明人： Katrina Mikhaylichenko , Mike Ravkin , Fritz Redeker , John M. de Larios , Erik M. Freer , Mikhail Korolik
IPC分类号： B08B3/00
CPC分类号： H01L21/02057 , C25D5/34 , C25D7/12 , H01L21/288 , H01L21/67051 , H01L21/67057 , H01L21/6708 , H01L21/67086 , H01L21/76841
摘要： Apparatuses for preparing a surface of a substrate using a proximity head includes a carrier to hold and move the substrate along an axis and a proximity head having a head surface with a plurality of outlet ports defined thereon. The proximity head is defined to be positioned proximate and over the carrier and the surface of the substrate. A length of the head surface of the proximity head is defined to be greater than a diameter of the substrate and at least partially overlapping over the carrier when the substrate is present. The proximity head includes a first set of outlet ports in a first region defining a first applicator that is configured to apply a non-Newtonian fluid between a surface of the carrier and the head surface of the proximity head. A second set of outlet ports in a second region of the proximity head defines a second applicator that is configured to apply a first chemistry to the surface of the substrate when present. The second region is adjacent to the first region. A third set of outlet ports in a third region of the proximity head defines a third applicator that is configured to apply the non-Newtonian fluid between the head surface of the proximity head and the surface of the substrate when present. The third region is defined adjacent to the second region. A fourth set of outlet ports is defined in the second region of the proximity head to substantially remove the first chemistry from the surface of the substrate when present.
摘要翻译：用于使用接近头来制备基底表面的装置包括：载体，用于沿着轴保持和移动基底;以及接近头，具有头表面，其上限定有多个出口。接近头被限定为位于载体和基底的表面附近和上方。接近头部的头表面的长度被限定为大于衬底的直径，并且当衬底存在时至少部分地重叠在载体上。邻近头部包括在第一区域中的第一组出口端口，所述第一区域限定第一施用器，其被构造成在载体的表面和邻近头部的头部表面之间施加非牛顿流体。在邻近头部的第二区域中的第二组出口端口限定第二施加器，其被配置为当存在时将第一化学物质施加到衬底的表面。第二区域与第一区域相邻。接近头部的第三区域中的第三组出口限定了第三施加器，其被配置为当存在时将非牛顿流体施加在邻近头部的头部表面和基底表面之间。第三区域被定义为与第二区域相邻。第四组出口端口限定在邻近头部的第二区域中，以在存在时从衬底的表面基本上移除第一化学物质。

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