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1. 发明申请

US20060260932A1 Apparatus and method for depositing and planarizing thin films of semiconductor wafers 失效
标题翻译：用于沉积和平坦化半导体晶片的薄膜的装置和方法
公开(公告)号：US20060260932A1
公开(公告)日：2006-11-23
申请号：US11494997
申请日：2006-07-28
申请人： Mike Ravkin , John Boyd , Yezdi Dordi , Fred Redeker , John deLarios
发明人： Mike Ravkin , John Boyd , Yezdi Dordi , Fred Redeker , John deLarios
IPC分类号： C25D17/00
CPC分类号： C25D17/10 , C25D5/026 , C25D5/22 , C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/67028 , H01L21/67034 , H01L21/67051
摘要： An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
摘要翻译：提供了一种用于在晶片的表面上沉积金属层的电镀设备。在一个示例中，能够被充电作为阳极的接近头放置在紧邻晶片表面的位置。在晶片和邻近头之间提供电镀液以产生局部金属电镀。

2. 发明申请

US20070084485A1 METHOD AND APPARATUS FOR CLEANING A SEMICONDUCTOR SUBSTRATE 有权
标题翻译：用于清洁半导体衬底的方法和装置
公开(公告)号：US20070084485A1
公开(公告)日：2007-04-19
申请号：US11612371
申请日：2006-12-18
申请人： Erik Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
发明人： Erik Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
IPC分类号： B08B3/00
CPC分类号： B08B7/00 , B08B3/00 , B08B7/02 , C11D9/02 , C11D11/0047 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/31133 , H01L21/67028 , H01L21/6708 , H01L21/67086
摘要： A method for cleaning a substrate is provided. The method initiates with disposing a fluid layer having solid components therein to a surface of the substrate. A shear force directed substantially parallel to the surface of the substrate and toward an outer edge of the substrate is then created. The shear force may result from a normal or tangential component of a force applied to a solid body in contact with the fluid layer in one embodiment. The surface of the substrate is rinsed to remove the fluid layer. A cleaning system and apparatus are also provided.
摘要翻译：提供一种清洗基板的方法。该方法通过将其中具有固体组分的流体层设置在基底的表面来启动。然后产生基本上平行于衬底的表面并朝向衬底的外边缘的剪切力。在一个实施例中，剪切力可以由施加到与流体层接触的固体的力的正常或切向分量产生。漂洗基材的表面以除去流体层。还提供清洁系统和装置。

3. 发明申请

US20070084483A1 METHOD AND APPARATUS FOR CLEANING A SEMICONDUCTOR SUBSTRATE 失效
标题翻译：用于清洁半导体衬底的方法和装置
公开(公告)号：US20070084483A1
公开(公告)日：2007-04-19
申请号：US11612352
申请日：2006-12-18
申请人： Erik Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
发明人： Erik Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred Redeker
IPC分类号： B08B7/00 , B08B3/00
CPC分类号： H01L21/67092 , B08B3/00 , B08B7/00 , B08B7/02 , C11D9/02 , C11D11/0047 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/02057 , H01L21/02096 , H01L21/31133 , H01L21/67028 , H01L21/6708 , H01L21/67086 , Y10T137/4891
摘要： A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.
摘要翻译：提供一种清洗基板的方法。该方法通过将激活溶液施加到基底的表面来启动。活化溶液和基材的表面与固体清洁表面的表面接触。活化溶液被吸收到固体清洁元件的一部分中，然后基底或固体清洁表面相对于彼此移动以清洁基底的表面。还提供了一种用经历塑性变形的固体清洁元件来清洁基板的表面的方法。还提供了相应的清洁装置。

4. 发明申请

US20070000518A1 Method for removing material from semiconductor wafer and apparatus for performing the same 失效
标题翻译：从半导体晶片去除材料的方法及其执行方法
公开(公告)号：US20070000518A1
公开(公告)日：2007-01-04
申请号：US11174080
申请日：2005-06-30
申请人： Mikhail Korolik , Michael Ravkin , John deLarios , Fritz Redeker , John Boyd
发明人： Mikhail Korolik , Michael Ravkin , John deLarios , Fritz Redeker , John Boyd
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , G03F7/422 , H01L21/02063 , H01L21/02071 , H01L21/6704 , Y10S134/902
摘要： A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.
摘要翻译：压力保持在其中半导体晶片所处于的体积内的压力足以将前体流体的液体状态保持为非牛顿流体。前体流体靠近要从半导体晶片去除的材料设置，同时保持前体流体处于液态。在半导体晶片所在的体积中的压力降低，使得设置在体积内的晶片上的前体流体被转化成非牛顿流体。在转化成非牛顿流体期间，前体流体的膨胀和前体流体相对于晶片的移动导致所得到的非牛顿流体从半导体晶片中去除材料。

5. 发明申请

US20130061887A1 METHOD FOR REMOVING MATERIAL FROM SEMICONDUCTOR WAFER AND APPARATUS FOR PERFORMING THE SAME 有权
标题翻译：从半导体波导中去除材料的方法及其实施方法
公开(公告)号：US20130061887A1
公开(公告)日：2013-03-14
申请号：US13670305
申请日：2012-11-06
申请人： Mikhail Korolik , Michael Ravkin , John deLarios , Fritz C. Redeker , John M. Boyd
发明人： Mikhail Korolik , Michael Ravkin , John deLarios , Fritz C. Redeker , John M. Boyd
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , G03F7/422 , H01L21/02063 , H01L21/02071 , H01L21/6704 , Y10S134/902
摘要： A pressure is maintained within a volume within which a semiconductor wafer resides at a pressure that is sufficient to maintain a liquid state of a precursor fluid to a non-Newtonian fluid. The precursor fluid is disposed proximate to a material to be removed from the semiconductor wafer while maintaining the precursor fluid in the liquid state. The pressure is reduced in the volume within which the semiconductor wafer resides such that the precursor fluid disposed on the wafer within the volume is transformed into the non-Newtonian fluid. An expansion of the precursor fluid and movement of the precursor fluid relative to the wafer during transformation into the non-Newtonian fluid causes the resulting non-Newtonian fluid to remove the material from the semiconductor wafer.
摘要翻译：压力保持在其中半导体晶片所处于的体积内的压力足以将前体流体的液体状态保持为非牛顿流体。前体流体靠近要从半导体晶片去除的材料设置，同时保持前体流体处于液态。在半导体晶片所在的体积中的压力降低，使得设置在体积内的晶片上的前体流体被转化成非牛顿流体。在转化成非牛顿流体期间，前体流体的膨胀和前体流体相对于晶片的移动导致所得到的非牛顿流体从半导体晶片中去除材料。

6. 发明申请

US20060096048A1 System and method for a combined contact and non-contact wafer cleaning module 有权
标题翻译：组合接触和非接触式晶片清洗模块的系统和方法
公开(公告)号：US20060096048A1
公开(公告)日：2006-05-11
申请号：US11316780
申请日：2005-12-23
申请人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
发明人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
IPC分类号： B08B1/04
CPC分类号： B08B1/04 , H01L21/67046
摘要： A system and a method for cleaning and rinsing a wafer includes at least three rollers that are capable of supporting a wafer by an edge of the wafer. At least one of the rollers is driven and thereby capable of rotating the wafer. At least one of the rollers is a movable roller mounted on an actuator. The system and method also includes a first movable scrubbing roller capable of being moved away from and alternatively to the first side of the wafer. A second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer is also included. The second side of the wafer opposes the first side of the wafer. The system and method also includes at least one first side nozzle directed toward the first side of the wafer and at least one second side nozzle directed toward the second side of the wafer.
摘要翻译：用于清洁和漂洗晶片的系统和方法包括能够通过晶片的边缘支撑晶片的至少三个辊。驱动至少一个辊，从而能够使晶片旋转。至少一个辊是安装在致动器上的可动辊。该系统和方法还包括能够远离晶片的第一侧移动的第一可移动擦洗辊。还包括能够移动离开晶片的另一侧的第二可动擦洗辊。晶片的第二面与晶片的第一面相反。该系统和方法还包括朝向晶片的第一侧的至少一个第一侧喷嘴和朝向晶片的第二侧的至少一个第二侧喷嘴。

7. 发明授权

US08102014B2 Proximity head heating method and apparatus 有权
标题翻译：接近头加热方法和装置
公开(公告)号：US08102014B2
公开(公告)日：2012-01-24
申请号：US12886278
申请日：2010-09-20
申请人： Katrina Mikhaylichenko , John deLarios
发明人： Katrina Mikhaylichenko , John deLarios
IPC分类号： H01L21/66
CPC分类号： H01L21/67023 , B08B3/02 , C25D17/00 , C25D17/001 , C25D21/02 , H01L21/67028 , H01L21/6704 , H01L21/67051 , H01L21/67063 , H01L21/6708 , H01L21/67109
摘要： Provided is an apparatus and a method for heating fluid in a proximity head. A method for semiconductor wafer processing, includes providing liquid to a proximity head including a heating portion, heating the liquid within the heating portion of the proximity head and delivering the heated liquid to a surface of a semiconductor wafer for use in a wafer processing operation including forming a meniscus between the proximity head and the surface of the semiconductor wafer.
摘要翻译：提供了用于加热邻近头部中的流体的装置和方法。一种用于半导体晶片处理的方法，包括向包括加热部分的接近头部提供液体，加热邻近头部的加热部分内的液体并将加热的液体输送到晶片加工操作中使用的半导体晶片的表面，包括在接近头部和半导体晶片的表面之间形成弯液面。

8. 发明授权

US07743449B2 System and method for a combined contact and non-contact wafer cleaning module 有权
标题翻译：组合接触和非接触式晶片清洗模块的系统和方法
公开(公告)号：US07743449B2
公开(公告)日：2010-06-29
申请号：US11316780
申请日：2005-12-23
申请人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
发明人： Katrina Mikhaylichenko , Michael Ravkin , John deLarios
IPC分类号： B08B1/04
CPC分类号： B08B1/04 , H01L21/67046
摘要： A system and a method for cleaning and rinsing a wafer includes at least three rollers that are capable of supporting a wafer by an edge of the wafer. At least one of the rollers is driven and thereby capable of rotating the wafer. At least one of the rollers is a movable roller mounted on an actuator. The system and method also includes a first movable scrubbing roller capable of being moved away from and alternatively to the first side of the wafer. A second movable scrubbing roller capable of being moved away from and alternatively to a second side of the wafer is also included. The second side of the wafer opposes the first side of the wafer. The system and method also includes at least one first side nozzle directed toward the first side of the wafer and at least one second side nozzle directed toward the second side of the wafer.
摘要翻译：用于清洁和漂洗晶片的系统和方法包括能够通过晶片的边缘支撑晶片的至少三个辊。驱动至少一个辊，从而能够使晶片旋转。至少一个辊是安装在致动器上的可动辊。该系统和方法还包括能够远离晶片的第一侧移动的第一可移动擦洗辊。还包括能够移动离开晶片的另一侧的第二可动擦洗辊。晶片的第二面与晶片的第一面相反。该系统和方法还包括朝向晶片的第一侧的至少一个第一侧喷嘴和朝向晶片的第二侧的至少一个第二侧喷嘴。

9. 发明授权

US06857435B2 Method and apparatus for cooling a resonator of a megasonic transducer 失效
标题翻译：用于冷却兆声波换能器的谐振器的方法和装置
公开(公告)号：US06857435B2
公开(公告)日：2005-02-22
申请号：US10803118
申请日：2004-03-16
申请人： John M. Boyd , John deLarios , Carl Woods
发明人： John M. Boyd , John deLarios , Carl Woods
IPC分类号： B08B3/02 , B08B3/12 , C25F5/00
CPC分类号： B08B3/12 , B08B3/02 , B08B2203/0288 , Y10S134/902
摘要： A method for cleaning a semiconductor substrate with a sonic cleaner is provided. The method initiates by introducing a cooling fluid into an inner jacket region of a sonic cleaner to cool a sonic resonator positioned within the inner jacket region. Then, a cleaning agent is introduced into an outer jacket region of the sonic cleaner to clean a semiconductor substrate. Next, a cooling fluid/cleaning agent interface is defined at an orifice location between the inner jacket region and the outer jacket region. Then, sonic energy from the resonator is transmitted to the cleaning agent through the interface at the orifice. Next, the cleaning agent is applied to the semiconductor substrate.
摘要翻译：提供了一种用声波清洁器清洗半导体衬底的方法。该方法通过将冷却流体引入到声音清洁器的内护套区域中来冷却位于内护套区域内的声波谐振器。然后，将清洁剂引入到声音清洁器的外护套区域中以清洁半导体衬底。接下来，在内护套区域和外护套区域之间的孔口部位处限定冷却流体/清洁剂界面。然后，来自谐振器的声能通过孔口处的界面传递到清洁剂。接下来，将清洁剂施加到半导体衬底。

10. 发明申请

US20130048021A1 Apparatus for Cleaning a Semiconductor Substrate 失效
标题翻译：用于清洁半导体衬底的装置
公开(公告)号：US20130048021A1
公开(公告)日：2013-02-28
申请号：US13661929
申请日：2012-10-26
申请人： Erik M. Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
发明人： Erik M. Freer , John deLarios , Katrina Mikhaylichenko , Michael Ravkin , Mikhail Korolik , Fred C. Redeker
IPC分类号： B08B3/08
CPC分类号： H01L21/67092 , B08B3/00 , B08B7/00 , B08B7/02 , C11D9/02 , C11D11/0047 , C11D17/0017 , C23G1/18 , G03F7/423 , H01L21/02052 , H01L21/02057 , H01L21/02096 , H01L21/31133 , H01L21/67028 , H01L21/6708 , H01L21/67086 , Y10T137/4891
摘要： A method for cleaning a substrate is provided. The method initiates with applying an activation solution to a surface of the substrate. The activation solution and the surface of the substrate are contacted with a surface of a solid cleaning surface. The activation solution is absorbed into a portion of the solid cleaning element and then the substrate or the solid cleaning surface is moved relative to each other to clean the surface of the substrate. A method for cleaning the surface of the substrate with a solid cleaning element that experiences plastic deformation is also provided. Corresponding cleaning apparatuses are also provided.
摘要翻译：提供一种清洗基板的方法。该方法通过将激活溶液施加到基底的表面来启动。活化溶液和基材的表面与固体清洁表面的表面接触。活化溶液被吸收到固体清洁元件的一部分中，然后基底或固体清洁表面相对于彼此移动以清洁基底的表面。还提供了一种用经历塑性变形的固体清洁元件来清洁基板的表面的方法。还提供了相应的清洁装置。

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