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1. 发明申请

US20070106898A1 Setting information notifying method and appliances applied thereto 审中-公开
标题翻译：设置应用于其的信息通知方法和装置
公开(公告)号：US20070106898A1
公开(公告)日：2007-05-10
申请号：US11415281
申请日：2006-05-02
申请人： Mika Mizutani , Yukiko Matsumoto , Takeshi Asahi
发明人： Mika Mizutani , Yukiko Matsumoto , Takeshi Asahi
IPC分类号： H04L9/00
CPC分类号： H04L9/0838 , H04L12/2803 , H04L63/06 , H04L63/0823 , H04L2209/60 , H04L2209/80 , H04W12/04 , H04W12/06
摘要： A setting information notifying method that enables safely and easily exchanging appliance setting information between appliances connected to a home network, the said method comprising steps of that: a portable data media is connected to a first appliance which provides a service in a communication network; the first appliance writes on the data media an appliance setting application which is used in notifying the appliance setting information to the other appliance, a host name of the first appliance, and a digital certification with a first cryptographic key; the data media is reconnected to a second appliance which uses the service of the first appliance; and the second appliance identifies a network address of the first appliance based on its host name, and establishes a cryptographic communication using the first cryptographic key over the communication network, and automatically sends the appliance setting information to the first appliance.
摘要翻译：一种设置信息通知方法，其能够在连接到家庭网络的设备之间安全且容易地交换设备设置信息，所述方法包括以下步骤：便携式数据媒体连接到在通信网络中提供服务的第一设备; 第一设备在数据介质上写入用于将设备设置信息通知给另一设备的设备设置应用程序，第一设备的主机名和具有第一加密密钥的数字认证; 数据介质被重新连接到使用第一设备的服务的第二设备; 并且所述第二设备基于其主机名来识别所述第一设备的网络地址，并且通过所述通信网络使用所述第一加密密钥建立加密通信，并且自动地将所述设备设置信息发送到所述第一设备。

2. 发明申请

US20100219532A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20100219532A1
公开(公告)日：2010-09-02
申请号：US12160387
申请日：2007-12-21
申请人： Kenji Yamasaki , Yutaka Yamada , Ayako Morita , Yukiko Matsumoto
发明人： Kenji Yamasaki , Yutaka Yamada , Ayako Morita , Yukiko Matsumoto
IPC分类号： H01L23/48
CPC分类号： H01L23/49575 , H01L23/4952 , H01L23/49541 , H01L24/06 , H01L24/45 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/45124 , H01L2224/48091 , H01L2224/48137 , H01L2224/484 , H01L2224/48699 , H01L2224/49113 , H01L2224/49174 , H01L2224/49431 , H01L2225/06562 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device includes: a first semiconductor chip having an upper face on which at least one first electrode pad is formed; a second semiconductor chip provided above the first semiconductor chip and having an upper face on which at least one second electrode pad is formed; a conductive film external to the first semiconductor chip and the second semiconductor chip; and a wire. The wire electrically connects the first electrode pad and the second electrode pad to each other via the conductive film.
摘要翻译：半导体器件包括：具有上表面的第一半导体芯片，其上形成有至少一个第一电极焊盘; 第二半导体芯片，设置在所述第一半导体芯片的上方，并具有上表面，至少一个第二电极焊盘形成在所述上表面上; 第一半导体芯片和第二半导体芯片之外的导电膜; 和电线。导线通过导电膜将第一电极焊盘和第二电极焊盘彼此电连接。

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