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    • 2. 发明授权
    • Back-illuminated type solid-state image pickup apparatus with peripheral circuit unit
    • 具有外围电路单元的背照式固态摄像装置
    • US08098312B2
    • 2012-01-17
    • US12404675
    • 2009-03-16
    • Mie MatsuoSachiyo Ito
    • Mie MatsuoSachiyo Ito
    • H04N3/14H04N5/225
    • H01L27/14636H01L27/14618H01L27/14627H01L27/1464H01L27/14643H01L2924/0002H04N5/2257H04N5/374H01L2924/00
    • A solid-state image pickup apparatus includes an image pickup pixel unit in which a plurality of pixels each including a photoelectric conversion element and a field-effect transistor are arranged on a semiconductor substrate so that a light-receiving surface is disposed at a first surface side of the semiconductor substrate; a peripheral circuit unit provided at a periphery of the image pickup pixel unit of the semiconductor substrate; and a multilayered wiring layer in which a plurality of wiring layers for driving the field-effect transistor of the image pickup pixel unit are laminated at a second surface side of the semiconductor substrate, wherein a wiring in each of the wiring layers constituting the multilayered wiring layer is disposed so that a coverage of the wiring located at least in the image pickup pixel unit of the semiconductor substrate reaches 100%, viewed from the second surface side.
    • 固态图像拾取装置包括:图像拾取像素单元,其中包括光电转换元件和场效应晶体管的多个像素布置在半导体衬底上,使得光接收表面设置在第一表面 侧; 设置在半导体衬底的摄像像素单元的周围的外围电路单元; 以及多层布线层,其中用于驱动图像拾取像素单元的场效应晶体管的多个布线层层叠在半导体基板的第二表面侧,其中构成多层布线的每个布线层中的布线 从第二表面侧观察,使至少位于半导体衬底的摄像像素单元中的配线的覆盖范围达到100%。
    • 3. 发明授权
    • Back-illuminated type solid-state image pickup device and camera module using the same
    • 背照式固态摄像装置及使用其的相机模块
    • US07859073B2
    • 2010-12-28
    • US12166810
    • 2008-07-02
    • Mie MatsuoYusuke Kohyama
    • Mie MatsuoYusuke Kohyama
    • H01L31/0203
    • H01L27/14618H01L24/24H01L27/1464H01L2224/13H01L2224/48091H01L2224/48465H01L2924/12043H04N5/2257H01L2924/00014H01L2924/00
    • The present invention provides a solid-state image pickup device including an image pickup pixel section which is provided on a semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor are arranged, and a peripheral circuit section for the image pickup pixel section. An interconnect layer driving the field-effect transistor in the image pickup pixel section is formed on a first surface side of the semiconductor substrate. A light receiving surface of the photoelectric conversion element is located on a second surface side of the semiconductor substrate. The solid-state image pickup device includes a first terminal exposed from the second surface side of the semiconductor substrate, and a second terminal electrically connected to the first terminal and connectable to an external device on the first surface side of the semiconductor substrate.
    • 本发明提供了一种固态摄像装置,包括:设置在半导体衬底上的摄像像素部分,其中配置有多个具有光电转换元件和场效应晶体管的像素;以及外围电路 图像拾取像素部分。 驱动图像拾取像素部中的场效应晶体管的互连层形成在半导体衬底的第一表面侧上。 光电转换元件的光接收表面位于半导体衬底的第二表面侧。 固态摄像装置包括从半导体衬底的第二表面侧露出的第一端子和与第一端子电连接并可连接到半导体衬底的第一表面侧上的外部器件的第二端子。