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    • 5. 发明授权
    • Magnetic tunnel junctions
    • 磁隧道结
    • US09553259B2
    • 2017-01-24
    • US15000620
    • 2016-01-19
    • Micron Technology, Inc.
    • Manzar Siddik
    • G11B5/127H01L43/10H01L43/02H01L43/08
    • H01L43/10G11B5/127G11C11/161H01L43/02H01L43/08
    • A magnetic tunnel junction comprises a conductive first magnetic electrode comprising magnetic recording material. A conductive second magnetic electrode is spaced from the first electrode and comprises magnetic reference material. A non-magnetic tunnel insulator material is between the first and second electrodes. The magnetic recording material of the first electrode comprises a first crystalline magnetic region, in one embodiment comprising Co and Fe. In one embodiment, the first electrode comprises a second amorphous region comprising amorphous XN, where X is one or more of W, Mo, Cr, V, Nb, Ta, Al, and Ti. In one embodiment, the first electrode comprises a second region comprising Co, Fe, and N.
    • 磁性隧道结包括包含磁记录材料的导电第一磁性电极。 导电的第二磁电极与第一电极间隔开并且包括磁性参考材料。 非磁性隧道绝缘体材料位于第一和第二电极之间。 第一电极的磁记录材料包括第一结晶磁性区域,在一个实施方案中包括Co和Fe。 在一个实施例中,第一电极包括包含非晶XN的第二非晶区域,其中X是W,Mo,Cr,V,Nb,Ta,Al和Ti中的一种或多种。 在一个实施例中,第一电极包括包含Co,Fe和N的第二区域。
    • 6. 发明申请
    • METHODS OF FORMING A MAGNETIC ELECTRODE OF A MAGNETIC TUNNEL JUNCTION AND METHODS OF FORMING A MAGNETIC TUNNEL JUNCTION
    • 形成磁性隧道结的磁电极的方法和形成磁性隧道结的方法
    • US20160308123A1
    • 2016-10-20
    • US14687317
    • 2015-04-15
    • Micron Technology, Inc.
    • Manzar SiddikWitold KulaGurtej S. Sandhu
    • H01L43/12H01L43/10H01L43/08
    • H01L43/12G11C11/161H01L43/08H01L43/10
    • A method of forming a magnetic electrode of a magnetic tunnel junction comprises forming non-magnetic MgO-comprising material over conductive material of the magnetic electrode being formed. An amorphous metal is formed over the MgO-comprising material. Amorphous magnetic electrode material comprising Co and Fe is formed over the amorphous metal. The amorphous magnetic electrode material is devoid of B. Non-magnetic tunnel insulator material comprising MgO is formed directly against the amorphous magnetic electrode material. The tunnel insulator material is devoid of B. After forming the tunnel insulator material, the amorphous Co and Fe-comprising magnetic electrode material is annealed at a temperature of at least about 250° C. to form crystalline Co and Fe-comprising magnetic electrode material from an MgO-comprising surface of the tunnel insulator material. The crystalline Co and Fe-comprising magnetic electrode material is devoid of B. Other method and non-method embodiments are disclosed.
    • 形成磁性隧道结的磁极的方法包括在形成的磁极的导电材料上形成非磁性的含MgO材料。 在包含MgO的材料上形成无定形金属。 包含Co和Fe的非晶磁性电极材料形成在无定形金属上。 无定形磁极材料不含B.直接与非晶磁性电极材料形成包含MgO的非磁性隧道绝缘体材料。 隧道绝缘体材料没有B.在形成隧道绝缘体材料之后,在至少约250℃的温度下对包含无定形Co和Fe的磁性电极材料进行退火以形成含Co和Fe的结晶的电极材料 从隧道绝缘体材料的包含MgO的表面。 含有Co和Fe的结晶的电极材料不含B。公开了其它方法和非方法的实施方案。
    • 8. 发明申请
    • SEMICONDUCTOR DEVICES, MAGNETIC TUNNEL JUNCTIONS, AND METHODS OF FABRICATION THEREOF
    • 半导体器件,磁性隧道结及其制造方法
    • US20160211440A1
    • 2016-07-21
    • US14597903
    • 2015-01-15
    • Micron Technology, Inc.
    • Manzar SiddikWitold KulaSuresh Ramarajan
    • H01L43/08G11C11/16H01L43/12H01L43/02H01L43/10
    • H01L43/08G11C11/161H01L43/12
    • A semiconductor device comprises an array of magnetic cell structures each comprising a magnetic tunnel junction over an electrode on a substrate. Each of the magnetic tunnel junctions includes a magnetic material over the substrate, a first tunnel barrier material over the magnetic material, a second tunnel barrier material over the annealed first tunnel barrier material, and another magnetic material over the second tunnel barrier material. Each magnetic tunnel junction is configured to exhibit a tunnel magnetoresistance greater than or equal to about 180% at a resistance area product of less than about 8 ohm μm2. The semiconductor device also includes another electrode over the another magnetic material. Semiconductor devices including the magnetic tunnel junctions, methods of forming the magnetic tunnel junctions, and methods of forming semiconductor devices including the magnetic tunnel junctions are disclosed.
    • 半导体器件包括磁性单元结构的阵列,每个磁性单元结构包括在衬底上的电极上的磁性隧道结。 每个磁性隧道结包括在该基底上的磁性材料,在该磁性材料上方的第一隧道阻挡材料,该退火的第一隧道屏障材料上方的第二隧道阻挡材料,以及该第二隧道屏障材料上的另一种磁性材料。 每个磁性隧道结被配置为在小于约8欧姆·μm2的电阻面积产生大于或等于约180%的隧道磁阻。 半导体器件还包括在另一磁性材料上的另一电极。 公开了包括磁隧道结的半导体器件,形成磁隧道结的方法,以及形成包括磁性隧道结的半导体器件的方法。