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    • 2. 发明授权
    • Pressure sensor having a metal diaphragm responsive to pressure
    • 压力传感器具有响应于压力的金属隔膜
    • US07121144B2
    • 2006-10-17
    • US11019264
    • 2004-12-23
    • Michitoshi OnodaMichihiro MakitaTakeshi NinomiyaHirokazu Kubo
    • Michitoshi OnodaMichihiro MakitaTakeshi NinomiyaHirokazu Kubo
    • G01F7/08
    • G01L19/0645G01L19/143
    • A pressure sensor is composed of a cylindrical connector case firmly connected to a housing and a pressure-detecting chamber formed between the connector case and the housing. The pressure-detecting chamber is confined by a metal diaphragm, an outer peripheral portion of which is firmly held at a portion connecting the connector case and the housing. A relatively thick ring plate is connected to a mounting surface of the housing, and the outer peripheral portion of the metal diaphragm is sandwiched between the ring plate and a pushing plate placed on and connected to the ring plate. Thus, the pressure-detecting chamber containing a sensing element therein is surely sealed even if the housing is made of a material, such as aluminum, which is different from that of the metal diaphragm.
    • 压力传感器由牢固地连接到壳体的圆筒形连接器壳体和形成在连接器壳体和壳体之间的压力检测室组成。 压力检测室被金属隔膜限制,金属隔膜的外周部牢固地保持在连接壳体和壳体的部分。 相对厚的环板连接到壳体的安装表面,并且金属隔膜的外周部分夹在环板和放置在环板上并与环板连接的推板之间。 因此,即使壳体由与金属隔膜的材料不同的材料制成,也可以确保密封容纳有感应元件的压力检测室。
    • 4. 发明授权
    • Gas detecting sensor
    • 气体检测传感器
    • US4413502A
    • 1983-11-08
    • US352562
    • 1982-02-26
    • Minoru OhtaYutaka HattoriTomio KawakamiMichitoshi Onoda
    • Minoru OhtaYutaka HattoriTomio KawakamiMichitoshi Onoda
    • F02B75/02G01N27/12
    • G01N27/12F02B2075/027
    • A high sensitive and high responsive gas detecting sensor for detecting the partial pressure of oxygen gas in the exhaust gases is disclosed. The sensor is provided with a sensing element having an electrical characteristic in response to the partial pressure of oxygen gas, a ceramic base member which supports the sensing element so that the sensing element is exposed to the exhaust gases, and electric current conducting means for supplying an electric current to the sensing element. The sensing element is formed of alloy ceramic material composed of 20 to 60 mol percent of cobalt monoxide, 20 to 60 mol percent of magnesium monoxide and 10 to 50 mol percent of nickel monoxide. In the preferred embodiment, the base member is formed into a plate shape and the sensing element is formed on the base member like a film.
    • 公开了一种用于检测废气中氧气分压的高灵敏度和高响应性气体检测传感器。 传感器具有响应于氧气分压而具有电特性的感测元件,支撑感测元件以使感测元件暴露于废气的陶瓷基座部件,以及用于供给 到感测元件的电流。 传感元件由合金陶瓷材料形成,该合金陶瓷材料由20至60摩尔%的一氧化钴,20至60摩尔%的一氧化碳和10至50摩尔%的一氧化镍组成。 在优选实施例中,基底件形成为板状,并且感测元件像薄膜一样地形成在基底构件上。
    • 6. 发明授权
    • Method of bonding semiconductor substrates
    • 半导体衬底接合方法
    • US5383993A
    • 1995-01-24
    • US118784
    • 1993-09-10
    • Mitsutaka KatadaKazuhiro TsurutaSeiji FujinoMichitoshi Onoda
    • Mitsutaka KatadaKazuhiro TsurutaSeiji FujinoMichitoshi Onoda
    • H01L21/20H01L21/02
    • H01L21/2007Y10S148/012Y10S148/135Y10S148/159
    • In a method of bonding semiconductor substrates, a plurality of the semiconductor substrates are first prepared. Surfaces of the semiconductor substrates are mirror-polished. The mirror-polished surface of at least one of the semiconductor substrates is then provided with a hydrophilic property in such a way that an oxide layer is formed on the mirror-polished surface by exposing the mirror-polished surface to an atmosphere of at least one of an oxygen ion and an oxygen radical. A water molecule is then adhered to the mirror-polished surface. The semiconductor substrates then contact with each other through the mirror-polished surface. The contacted semiconductor substrates are then heated. According to such a method of bonding, the semiconductor substrates are strongly bonded to each other with hardly an unbonded region even if the semiconductor substrates are heated at a low temperature.
    • 在半导体基板的接合方法中,首先准备多个半导体基板。 对半导体衬底的表面进行镜面抛光。 然后,至少一个半导体基板的镜面抛光表面具有亲水特性,使得通过将镜面抛光表面暴露于至少一个的气氛中,在镜面抛光表面上形成氧化物层 的氧离子和氧自由基。 然后将水分子粘附到镜面抛光的表面上。 然后半导体衬底通过镜面抛光表面相互接触。 然后将接触的半导体衬底加热。 根据这样的接合方法,即使半导体基板在低温下被加热,半导体基板也几乎没有未结合区域而彼此牢固地结合。
    • 8. 发明授权
    • Gas detecting sensor
    • 气体检测传感器
    • US4453397A
    • 1984-06-12
    • US354794
    • 1982-03-04
    • Minoru OhtaYutaka HattoriTomio KawakamiMichitoshi Onoda
    • Minoru OhtaYutaka HattoriTomio KawakamiMichitoshi Onoda
    • G01N27/12
    • G01N27/122G01N27/12
    • A gas detecting sensor for precisely detecting the partial pressure of oxygen gas in the exhaust gases without being affected by the change of the temperature of the environment thereof, is disclosed. The sensor is provided with a ceramic base member, a film-shaped gas sensing element having a characteristic in response to the partial pressure of oxygen gas which is held by the base member so as to be exposed to the exhaust gases, a film shaped temperature sensing element having temperature coefficient of resistance substantially equal to that of the gas sensing element, which is held by the base member so as to be isolated from the exhaust gases, and an electric current wherein the gas and the temperature sensing elements are connected to each other in series to form an electric junction therebetween, from which output voltage is taken. In the preferred embodiment, the temperature sensing element is embedded within the base member and a heating member is further provided for maintaining both elements within a temperature range in which temperature coefficient of resistance of both elements are substantially equal to each other.
    • 公开了一种气体检测传感器,用于精确地检测废气中氧气的分压而不受其环境温度变化的影响。 传感器设置有陶瓷基体部件,膜状气体检测元件,其具有响应于由基底部件保持以暴露于废气的氧气分压的特性,膜状温度 感测元件,其温度系数电阻基本上等于由基底构件保持以与排气隔离的气体感测元件的电阻温度系数,以及电流,其中气体和温度感测元件连接到每个 串联地形成其间的电连接,从其输出电压。 在优选实施例中,温度感测元件嵌入在基座构件内,并且进一步提供加热构件,用于将两个元件保持在两个元件的电阻温度系数彼此基本相等的温度范围内。