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1. 发明授权

US08448468B2 Mask and method for sealing a glass envelope 有权
公开(公告)号：US08448468B2
公开(公告)日：2013-05-28
申请号：US12157515
申请日：2008-06-11
申请人： Michelle Nicole Haase Pastel , Brian Paul Strines
发明人： Michelle Nicole Haase Pastel , Brian Paul Strines
IPC分类号： C03B23/203
CPC分类号： C03B23/203 , H01L51/5246 , H01L51/56
摘要： A mask for laser sealing a temperature and environmentally sensitive element, such as an OLED device, surrounded by a frit wall between first and second substrates. The mask is opaque and has a transparent elongate transmission region. The width of the transmission region may be substantially equal to the width of the frit wall. A strip of opaque mask material extends approximately along a longitudinal center line of the elongate transmission region. The mask is located between a laser and the first or second substrate. The laser emits a generally circular beam having a diameter that is larger than the width of the frit wall and is directed through the transmission region in the mask, such that opaque portions of the mask block portions the laser beam and the transparent transmission region allows a portion of the laser beam to pass through the mask and impinge upon the frit wall to melt the frit wall, thereby joining the first and second substrates and hermetically sealing the element therebetween. A process and system for sealing such an element between a first substrate and a second substrate separated by at least one frit wall employing such mask.

2. 发明授权

US08025975B2 Frit-containing pastes for producing sintered frit patterns on glass sheets 有权
标题翻译：含玻璃料的糊料，用于在玻璃板上生产烧结玻璃料图案
公开(公告)号：US08025975B2
公开(公告)日：2011-09-27
申请号：US12228449
申请日：2008-08-13
申请人： John W Botelho , Edward Arthur Cuellar , Michelle Nicole Haase Pastel , Lu Zhang
发明人： John W Botelho , Edward Arthur Cuellar , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： B32B17/06 , B32B5/16
CPC分类号： C03C8/14 , C03C8/16 , H01L51/5246 , Y10T428/24926 , Y10T428/25 , Y10T428/252 , Y10T428/26 , Y10T428/2991 , Y10T428/2996
摘要： Pastes for use in producing sintered frit patterns (14) on glass sheets (12), such as the glass sheets used as covers for OLED (18) display devices (10), are provided. The pastes include glass particles, filler particles, and a vehicle. The sizes of the filler and/or glass particles are reduced compared to prior art pastes. Reductions in porosity and surface roughness of sintered frits produced using the pastes, as well as improvements in the available process window for producing OLED packages and the hermeticity and strength of those packages, are reported.
摘要翻译：提供了用于生产玻璃板（12）上的烧结玻璃料图案（14）的糊料，例如用作OLED（18）显示装置（10）的盖的玻璃板。糊料包括玻璃颗粒，填料颗粒和载体。与现有技术的糊料相比，填料和/或玻璃颗粒的尺寸减小。报道了使用糊料产生的烧结玻璃料的孔隙率和表面粗糙度的降低以及用于生产OLED封装的可用工艺窗口的改进以及这些封装的气密性和强度。

3. 发明授权

US08198807B2 Hermetically-sealed packages for electronic components having reduced unused areas 有权
标题翻译：用于电子元件的密封封装，减少了未使用的面积
公开(公告)号：US08198807B2
公开(公告)日：2012-06-12
申请号：US12072792
申请日：2008-02-28
申请人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
发明人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： H01L51/50
CPC分类号： H01L21/67005 , H01L51/5246
摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).
摘要翻译：提供用于电子部件（例如OLED）的密封封装。封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a））和Dsecond（32b）约为100微米。未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。

4. 发明申请

US20090155555A1 Frit-containing pastes for producing sintered frit patterns on glass sheets 有权
标题翻译：含玻璃料的糊料，用于在玻璃板上生产烧结玻璃料图案
公开(公告)号：US20090155555A1
公开(公告)日：2009-06-18
申请号：US12228449
申请日：2008-08-13
申请人： John W. Botelho , Edward Arthur Cuellar , Michelle Nicole Haase Pastel , Lu Zhang
发明人： John W. Botelho , Edward Arthur Cuellar , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： B32B17/06 , C03C8/16
CPC分类号： C03C8/14 , C03C8/16 , H01L51/5246 , Y10T428/24926 , Y10T428/25 , Y10T428/252 , Y10T428/26 , Y10T428/2991 , Y10T428/2996
摘要： Pastes for use in producing sintered frit patterns (14) on glass sheets (12), such as the glass sheets used as covers for OLED (18) display devices (10), are provided. The pastes include glass particles, filler particles, and a vehicle. The sizes of the filler and/or glass particles are reduced compared to prior art pastes. Reductions in porosity and surface roughness of sintered frits produced using the pastes, as well as improvements in the available process window for producing OLED packages and the hermeticity and strength of those packages, are reported.
摘要翻译：提供了用于生产玻璃板（12）上的烧结玻璃料图案（14）的糊料，例如用作OLED（18）显示装置（10）的盖的玻璃板。糊料包括玻璃颗粒，填料颗粒和载体。与现有技术的糊料相比，填料和/或玻璃颗粒的尺寸减小。报道了使用糊料产生的烧结玻璃料的孔隙率和表面粗糙度的降低以及用于生产OLED封装的可用工艺窗口的改进以及这些封装的气密性和强度。

5. 发明授权

US08317562B2 Hermetically-sealed packages for electronic components having reduced unused areas 有权
公开(公告)号：US08317562B2
公开(公告)日：2012-11-27
申请号：US13473171
申请日：2012-05-16
申请人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
发明人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： H01J9/24
CPC分类号： H01L21/67005 , H01L51/5246
摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).

6. 发明申请

US20120225506A1 HERMETICALLY-SEALED PACKAGES FOR ELECTRONIC COMPONENTS HAVING REDUCED UNUSED AREAS 有权
标题翻译：具有减少未使用领域的电子元件的密封封装
公开(公告)号：US20120225506A1
公开(公告)日：2012-09-06
申请号：US13473171
申请日：2012-05-16
申请人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
发明人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： H01L51/56
CPC分类号： H01L21/67005 , H01L51/5246
摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).
摘要翻译：提供用于电子部件（例如OLED）的密封封装。封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a ）和Dsecond（32b）约为100微米。未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。

7. 发明申请

US20090218253A1 Hermetically-sealed packages for electronic components having reduced unused areas 有权
标题翻译：用于电子元件的密封封装，减少了未使用的面积
公开(公告)号：US20090218253A1
公开(公告)日：2009-09-03
申请号：US12072792
申请日：2008-02-28
申请人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
发明人： Kelvin Nguyen , Michelle Nicole Haase Pastel , Lu Zhang
IPC分类号： B65D85/00
CPC分类号： H01L21/67005 , H01L51/5246
摘要： Hermetically-sealed packages for electronic components, e.g., OLEDs, are provided. The packages have a first glass substrate (12), a second glass substrate (16), and a wall (14) that separates the first and second substrates (12,16) and hermetically seals the electronic component (18) between the substrates (12,16). The package has a reduced outer unused area characterized by distances Dfirst (32a) and Dsecond (32b) at least one of which, and, in certain embodiments, both of which are less than 200 microns, e.g., one or both of Dfirst (32a) and Dsecond (32b) is approximately 100 microns. The reduction in unused area can be used to increase viewing area, improve electrical lead design, and/or increase package strength through the use of a wider sintered frit wall (14).
摘要翻译：提供用于电子部件（例如OLED）的密封封装。封装具有第一玻璃基板（12），第二玻璃基板（16）和分隔第一和第二基板（12,16）并密封基板之间的电子部件（18）的壁（14） 12,16）。包装具有减小的外部未使用区域，其特征在于距离Dfirst（32a）和D second（32b），其中至少一个，并且在某些实施例中，它们都小于200微米，例如Dfirst（32a））和Dsecond（32b）约为100微米。未使用面积的减少可用于通过使用更宽的烧结玻璃料壁（14）来增加观察面积，改善电气引线设计和/或增加封装强度。

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