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1. 发明申请

US20120273183A1 COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
标题翻译：用于移动电子系统的冷却泵送系统
公开(公告)号：US20120273183A1
公开(公告)日：2012-11-01
申请号：US13546612
申请日：2012-07-11
申请人： Michel Bruno , Thomas Brunschwiler , Urs Kloter , Ryan J. Linderman , Erich Ruetsche
发明人： Michel Bruno , Thomas Brunschwiler , Urs Kloter , Ryan J. Linderman , Erich Ruetsche
IPC分类号： F28F27/00
CPC分类号： H05K7/20272 , H05K7/20872
摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass. A gear member is operatively connected between the mass and the force transfer member.
摘要翻译：用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。齿轮构件可操作地连接在质量块和力传递构件之间。

2. 发明申请

US20100044005A1 COOLANT PUMPING SYSTEM FOR MOBILE ELECTRONIC SYSTEMS 审中-公开
标题翻译：用于移动电子系统的冷却泵送系统
公开(公告)号：US20100044005A1
公开(公告)日：2010-02-25
申请号：US12194973
申请日：2008-08-20
申请人： Michel Bruno , Thomas Brunschwiler , Urs Kloter , Ryan J. Linderman , Erich Ruetsche
发明人： Michel Bruno , Thomas Brunschwiler , Urs Kloter , Ryan J. Linderman , Erich Ruetsche
IPC分类号： B60H1/32
CPC分类号： H05K7/20272 , H05K7/20872
摘要： A coolant pumping system for a mobile electronic system includes a coolant reservoir containing a coolant, a heat exchanger member fluidly connected to the coolant reservoir, and a mass moveably mounted to the mobile electronic system. The mass is moved along at least one axis in response to at least one of accelerations and orientation changes of the mobile electronic system. The coolant system further includes a force transfer member operatively connected between the mass and the coolant reservoir. The force transfer member urges the coolant from the coolant reservoir through the heat exchanger member in response to movements of the mass.
摘要翻译：用于移动电子系统的冷却剂泵送系统包括容纳冷却剂的冷却剂储存器，流体连接到冷却剂储存器的热交换器部件和可移动地安装到移动电子系统的质量块。响应于移动电子系统的加速度和取向变化中的至少一个，质量沿着至少一个轴线移动。冷却剂系统还包括可操作地连接在质量块和冷却剂储存器之间的力传递构件。力传递构件响应于质量块的移动而促使来自冷却剂储存器的冷却剂通过热交换器构件。

3. 发明授权

US07532475B2 Semiconductor chip assembly with flexible metal cantilevers 失效
标题翻译：具有柔性金属悬臂的半导体芯片组件
公开(公告)号：US07532475B2
公开(公告)日：2009-05-12
申请号：US11394007
申请日：2006-03-30
申请人： Bruno Michel , Thomas J. Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Urs Kloter
发明人： Bruno Michel , Thomas J. Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Urs Kloter
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H01L23/3733 , H01L23/433 , H01L23/4338 , H01L2924/0002 , H01L2924/00
摘要： A stress release thermal interface is provided for preventing the building up of stress between chip and heat sink surfaces in a multi-chip module (MCM) while maintaining reliable thermal and mechanical contact. The interface achieves enhanced thermal conduction by using flexible, interlocking posts attached to the surfaces of the chip and the heat sink.
摘要翻译：提供了一种应力释放热界面，用于在保持可靠的热和机械接触的同时，防止多芯片模块（MCM）中芯片和散热片表面之间的应力增大。该接口通过使用附接到芯片和散热器表面的柔性互锁柱来实现增强的热传导。

4. 发明申请

US20100053890A1 COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET 有权
标题翻译：电子元件系统柜的冷却系统
公开(公告)号：US20100053890A1
公开(公告)日：2010-03-04
申请号：US12202619
申请日：2008-09-02
申请人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
发明人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781
摘要： An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.
摘要翻译：电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。所述至少一个泵被选择性地操作以将供应的冷却剂循环到多个冷却剂储存器中的每一个。

5. 发明授权

US07872867B2 Cooling system for an electronic component system cabinet 有权
标题翻译：电子元件系统柜的冷却系统
公开(公告)号：US07872867B2
公开(公告)日：2011-01-18
申请号：US12202619
申请日：2008-09-02
申请人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
发明人： Thomas Brunschwiler , Ryan J. Linderman , Hugo E. Rothuizen , Reto Waelchli
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781
摘要： An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs.
摘要翻译：电子部件系统机柜包括多个电子部件系统托架以及安装在多个电子部件系统托架中的各个电子部件系统托架中的多个电子部件系统。电子部件系统柜还包括包括多个冷却剂储存器的冷却系统。多个冷却剂储存器中的每一个与多个电子元件系统托架中的至少一个相关联。冷却系统还包括流体地连接到多个冷却剂储存器中的每一个的至少一个泵。所述至少一个泵被选择性地操作以将供应的冷却剂循环到所述多个冷却剂储存器中的每一个。

6. 发明授权

US08796535B2 Thermal tracking for solar systems 有权
标题翻译：太阳能系统的热跟踪
公开(公告)号：US08796535B2
公开(公告)日：2014-08-05
申请号：US13250825
申请日：2011-09-30
申请人： Ryan J. Linderman
发明人： Ryan J. Linderman
IPC分类号： H01L31/042 , H02N6/00
CPC分类号： G05D3/105 , F24S50/20 , H01L31/048 , H01L31/0547 , H02S20/32 , Y02E10/47 , Y02E10/52
摘要： A thermal tracking system for a concentrating photovoltaic system is disclosed. The thermal tracking system comprises a photovoltaic receiver. The photovoltaic receiver comprises a photovoltaic laminate and a heat spreader. The thermal tracking system further comprises first and second thermal sensors coupled to the photovoltaic laminate and sensing two temperatures of the laminate. The thermal tracking system also comprises third and fourth thermal sensors positioned adjacent the heat spreader and sensing two temperatures near the heat spreader.
摘要翻译：公开了一种集中光伏系统的热跟踪系统。热跟踪系统包括光电接收器。光伏接收器包括光伏层压板和散热器。热跟踪系统还包括耦合到光伏层压板并感测层压板的两个温度的第一和第二热传感器。热跟踪系统还包括位于散热器附近的第三和第四热传感器，并感测散热器附近的两个温度。

7. 发明授权

US08528366B2 Heat-regulating glass bending apparatus and method 失效
标题翻译：热调玻璃弯曲设备及方法
公开(公告)号：US08528366B2
公开(公告)日：2013-09-10
申请号：US13335679
申请日：2011-12-22
申请人： Amine Berrada Sounni , Ryan J. Linderman
发明人： Amine Berrada Sounni , Ryan J. Linderman
IPC分类号： C03B23/025
CPC分类号： C03B23/0026 , C03B23/0235 , C03B23/0252 , C03B23/0258 , C03B35/207 , C03B40/005 , Y02P40/57
摘要： A sag-bending system is disclosed. The sag-bending system comprises a sag-bending glass support mold and a perimeter thermal manager. The support mold comprises a plurality of rib members extending in a first direction, each of the plurality of rib members having a curved upper surface shaped to form the collective upper surface having a position and shape to support a quadrilateral-shaped sag-bent glass sheet into a desired contour, each of the rib members further having a lower surface, and a plurality of support members extending in a second direction between at least two of the plurality of rib members, the second direction traverse to the first direction. The perimeter thermal manager is sized and positioned to surround, to extend at least partially over, and to extend at least partially under the periphery of the support mold.
摘要翻译：公开了一种下垂弯曲系统。下垂弯曲系统包括下弯弯曲玻璃支撑模具和周边热管理器。所述支撑模具包括沿第一方向延伸的多个肋构件，所述多个肋构件中的每一个具有弯曲的上表面，所述多个肋构件具有弯曲的上表面，所述弯曲的上表面被成形为形成所述集体上表面，所述上表面具有支撑四边形下垂弯曲玻璃成为期望的轮廓，每个肋构件还具有下表面，以及多个支撑构件，其在第二方向上在多个肋构件中的至少两个之间延伸，第二方向横穿第一方向。周边热管理器的尺寸和位置被设计成围绕，至少部分地延伸并且至少部分地延伸到支撑模具的外围。

8. 发明授权

US08004832B2 Variable flow computer cooling system for a data center and method of operation 有权
标题翻译：数据中心的可变流量计算机冷却系统和操作方法
公开(公告)号：US08004832B2
公开(公告)日：2011-08-23
申请号：US12793905
申请日：2010-06-04
申请人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
发明人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
IPC分类号： G06F1/20 , G05D23/19 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772 , Y10S165/908
摘要： Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
摘要翻译：这里公开了具有多个液冷计算机系统的数据中心。计算机系统各自包括与冷板相连的处理器，其允许直接液体冷却处理器。冷板进一步布置成向处理器的不同部分提供适当的冷却流，从而较高的温度区域接收较大的冷却剂流速。流量被可变地调整以反映不同的活动水平。通过使离开计算机系统的冷却剂温度最大化，系统可以利用环境空气的自由冷却温度并且消除对冷却器的需要。还提供了一个与区域供热系统相结合的数据中心，从计算机系统提取的热量用于抵消碳排放，降低数据中心的总体拥有成本。

9. 发明授权

US07866173B2 Variable performance server system and method of operation 有权
标题翻译：可变性能服务器系统及操作方法
公开(公告)号：US07866173B2
公开(公告)日：2011-01-11
申请号：US12038904
申请日：2008-02-28
申请人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
发明人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
IPC分类号： F25D17/02 , H05K7/20
CPC分类号： G06F1/206 , G06F2200/201 , G06Q10/06 , H05K7/20836
摘要： Disclosed herein is a server system having a plurality of computer systems and a liquid cooling system. The computer systems are capable of operating in a first mode of operation at a first operating speed and a first temperature. The computer systems are further capable of operating in a second mode of operation at a second operating speed and a second temperature. The server system switches from the second mode and the first mode in response to a request for processing services rising above a first threshold. The server system further uses a cold battery to store coolant during times of low demand and releases coolant from said cold battery when the system switches to the first mode.
摘要翻译：这里公开了具有多个计算机系统和液体冷却系统的服务器系统。计算机系统能够以第一操作速度和第一温度在第一操作模式下操作。计算机系统还能够在第二操作速度和第二温度下以第二操作模式操作。服务器系统响应于处理服务的请求高于第一阈值而从第二模式和第一模式切换。服务器系统在低需求时进一步使用冷电池来储存冷却剂，并且当系统切换到第一模式时，从所述冷电池释放冷却剂。

10. 发明授权

US08107234B2 Variable flow computer cooling system for a data center and method of operation 有权
标题翻译：数据中心的可变流量计算机冷却系统和操作方法
公开(公告)号：US08107234B2
公开(公告)日：2012-01-31
申请号：US12793896
申请日：2010-06-04
申请人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
发明人： Thomas J. Brunschwiler , Ryan J. Linderman , Bruno Michel , Erich M. Ruetsche
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772 , Y10S165/908
摘要： Disclosed herein is a data center having a plurality of liquid cooled computer systems. The computer systems each include a processor coupled with a cold plate that allows direct liquid cooling of the processor. The cold plate is further arranged to provide adapted flow of coolant to different portions of the processor whereby higher temperature regions receive a larger flow rate of coolant. The flow is variably adjusted to reflect different levels of activity. By maximizing the coolant temperature exiting the computer systems, the system may utilize the free cooling temperature of the ambient air and eliminate the need for a chiller. A data center is further provided that is coupled with a district heating system and heat is extracted from the computer systems is used to offset carbon emissions and reduce the total cost of ownership of the data center.
摘要翻译：这里公开了具有多个液冷计算机系统的数据中心。计算机系统各自包括与冷板相连的处理器，其允许直接液体冷却处理器。冷板进一步布置成向处理器的不同部分提供适当的冷却流，从而较高的温度区域接收较大的冷却剂流速。流量被可变地调整以反映不同的活动水平。通过使离开计算机系统的冷却剂温度最大化，系统可以利用环境空气的自由冷却温度并且消除对冷却器的需要。还提供了一个与区域供热系统相结合的数据中心，从计算机系统中提取热量用于抵消碳排放，降低数据中心的总体拥有成本。

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