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    • 4. 发明授权
    • LED phosphor deposition
    • LED荧光粉沉积
    • US08247827B2
    • 2012-08-21
    • US12242274
    • 2008-09-30
    • Rene Peter Helbing
    • Rene Peter Helbing
    • H01L33/00H01L23/02H01L21/00H01L21/44H01L21/48H01L21/50
    • H01L33/54H01L25/0753H01L33/483H01L33/60H01L2924/0002H01L2924/00
    • LED phosphor deposition for use with LEDs. In an aspect, a method is provided for forming an encapsulation. The method includes determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation. In another aspect, an LED apparatus is provided that includes at least one LED chip and an encapsulation disposed on the at least one LED chip. The encapsulation is formed by determining a geometric shape for the encapsulation, selecting a dam material, applying the dam material to a substrate to form a boundary defining a region having the geometric shape, and filling the region with encapsulation material to form the encapsulation.
    • LED荧光体沉积用于LED。 在一方面,提供了形成封装的方法。 该方法包括确定用于封装的几何形状,选择坝材料,将坝材料施加到基底以形成限定具有几何形状的区域的边界,以及用封装材料填充该区域以形成封装。 在另一方面,提供一种LED装置,其包括设置在所述至少一个LED芯片上的至少一个LED芯片和封装。 通过确定用于封装的几何形状,选择坝材料,将坝材料施加到基底以形成限定具有几何形状的区域的边界,并用封装材料填充该区域以形成封装形成封装。
    • 8. 发明申请
    • Efficient LED Array
    • 高效LED阵列
    • US20120088321A1
    • 2012-04-12
    • US13327219
    • 2011-12-15
    • Rene Peter Helbing
    • Rene Peter Helbing
    • H01L33/60
    • H01L25/0753F21K9/23F21L4/027F21S6/00F21S8/08F21V29/70F21W2131/103F21Y2105/10F21Y2115/10H01L33/60H01L33/64H01L2224/48091H01L2224/48137H01L2924/00
    • An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
    • 高效的LED阵列。 一方面,一种LED装置包括具有反射表面的金属基板和直接安装在反射表面上以允许散热的LED芯片,并且其中至少一部分LED芯片彼此间隔开以允许光 以从位于LED芯片的部分之间的反射表面的一部分反射。 另一方面,一种方法包括配置金属基板以具有反射表面,以及将多个LED芯片直接安装到金属基板的反射表面以允许散热,并且其中至少一部分LED芯片为 彼此间隔开以允许光从位于LED芯片的部分之间的反射表面的一部分反射。
    • 10. 发明申请
    • EFFICIENT LED ARRAY
    • 高效LED阵列
    • US20100079990A1
    • 2010-04-01
    • US12240011
    • 2008-09-29
    • Rene Peter Helbing
    • Rene Peter Helbing
    • F21V11/00H01J9/00
    • H01L25/0753F21K9/23F21L4/027F21S6/00F21S8/08F21V29/70F21W2131/103F21Y2105/10F21Y2115/10H01L33/60H01L33/64H01L2224/48091H01L2224/48137H01L2924/00
    • An efficient LED array. In an aspect, an LED apparatus includes a metal substrate having a reflective surface, and LED chips mounted directly to the reflective surface to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips. In another aspect, a method includes configuring a metal substrate to have a reflective surface, and mounting a plurality of LED chips directly to the reflective surface of the metal substrate to allow for thermal dissipation, and wherein at least a portion of the LED chips are spaced apart from each other to allow light to reflect from a portion of the reflective surface that is located between the portion of the LED chips.
    • 高效的LED阵列。 一方面,一种LED装置包括具有反射表面的金属基板和直接安装在反射表面上以允许散热的LED芯片,并且其中至少一部分LED芯片彼此间隔开以允许光 以从位于LED芯片的部分之间的反射表面的一部分反射。 另一方面,一种方法包括配置金属基板以具有反射表面,以及将多个LED芯片直接安装到金属基板的反射表面以允许散热,并且其中至少一部分LED芯片为 彼此间隔开以允许光从位于LED芯片的部分之间的反射表面的一部分反射。