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1. 发明授权

US09165587B2 System and method for dual-sided sputter etch of substrates 有权
标题翻译：用于衬底双面溅射蚀刻的系统和方法
公开(公告)号：US09165587B2
公开(公告)日：2015-10-20
申请号：US12329457
申请日：2008-12-05
申请人： Michael S. Barnes , Terry Bluck
发明人： Michael S. Barnes , Terry Bluck
IPC分类号： C23F1/00 , H01L21/306 , C23C14/00 , C25B11/00 , C25B13/00 , G11B5/84 , G11B5/855 , H01J37/34
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks. A movable electrode is utilized to perform sputter etch. The electrode moves to near or at slight contact to the substrate so as to couple RF energy to the disk. The material to be etched may be metal, e.g., Co/Pt/Cr or similar metals. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched. An isolation valve is disposed between the two chambers and the disk carrier moves the disks between the chambers. The carrier may be a linear drive carrier, using, e.g., magnetized wheels and linear motors.
摘要翻译：提供用于蚀刻图案化介质盘的系统。利用可动电极进行溅射蚀刻。电极移动到接近或稍微接触到衬底，以将RF能量耦合到盘。待蚀刻的材料可以是金属，例如Co / Pt / Cr或类似的金属。衬底垂直地保持在载体中，并且两侧被连续蚀刻。也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。隔离阀设置在两个腔室之间，圆盘托架使腔室间移动。载体可以是线性驱动载体，使用例如磁化轮和线性马达。

2. 发明授权

US08349196B2 System and method for commercial fabrication of patterned media 有权
标题翻译：用于商业制作图案化介质的系统和方法
公开(公告)号：US08349196B2
公开(公告)日：2013-01-08
申请号：US12329462
申请日：2008-12-05
申请人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
发明人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
IPC分类号： B44C1/22
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
摘要翻译：提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。模块化系统可以被定制以执行特定的处理顺序，使得图案化的介质盘被制造而不从真空环境中移除盘。在一些顺序中，磁性堆叠被蚀刻，而另一些蚀刻则在形成磁性堆叠之前进行。在另外的序列中，使用离子注入而没有蚀刻步骤。为了蚀刻可移动的非接触电极用于进行溅射蚀刻。阴极移动到与衬底接近但不接触的接近距离，以将RF能量耦合到盘。衬底垂直地保持在载体中，并且两侧被连续蚀刻。也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。

3. 发明申请

US20090159104A1 METHOD AND APPARATUS FOR CHAMBER CLEANING BY IN-SITU PLASMA EXCITATION 审中-公开
标题翻译：用于通过现场等离子体激发进行室清洁的方法和装置
公开(公告)号：US20090159104A1
公开(公告)日：2009-06-25
申请号：US11960442
申请日：2007-12-19
申请人： Judy Huang , Michael S. Barnes , Terry Bluck
发明人： Judy Huang , Michael S. Barnes , Terry Bluck
IPC分类号： B08B6/00 , B08B13/00
CPC分类号： C23C16/4405 , H01J37/32082 , H01J37/32192 , H01J37/32862
摘要： A substrate processing chamber for processing substrates such as semiconductor wafers, flat panel substrate, solar panels, etc., includes mechanism for in-situ plasma clean. The chamber body has at least one plasma source opening provided on its sidewall. A movable substrate holder is situated within the chamber body, the substrate holder assumes a first position wherein the substrate is positioned below the plasma source opening for in-situ plasma cleaning of the chamber, and a second position wherein the substrate is positioned above the plasma source opening for substrate processing. A plasma energy source is coupled to the plasma source opening.
摘要翻译：用于处理诸如半导体晶片，平板基板，太阳能电池板等基板的基板处理室包括用于原位等离子体清洗的机构。腔体具有设置在其侧壁上的至少一个等离子体源开口。可移动衬底保持器位于腔室主体内，衬底保持器采取第一位置，其中衬底位于等离子体源开口下方用于腔室的原位等离子体清洗，以及第二位置，其中衬底位于等离子体的上方源开口用于基板处理。等离子体能源耦合到等离子体源开口。

4. 发明申请

US20090151872A1 LOW COST HIGH CONDUCTANCE CHAMBER 审中-公开
标题翻译：低成本高性能室
公开(公告)号：US20090151872A1
公开(公告)日：2009-06-18
申请号：US11958235
申请日：2007-12-17
申请人： Tugrul Samir , Michael S. Barnes , Terry Bluck
发明人： Tugrul Samir , Michael S. Barnes , Terry Bluck
IPC分类号： H01B13/00 , B23P17/04 , C23C16/54
CPC分类号： H01L21/67017 , H01L21/6719 , Y10T29/49
摘要： A process chamber having high conductance and a method of manufacturing the process chamber are disclosed. The process chamber is machined from a single piece of aluminum where a process cavity and a pump cavity are created by intersecting cylinders. A substrate opening is also created at a bottom of the process cavity to provide conduit for services, such as cooling gas and electrical connections. A large undercut area is formed at a top of the pump cavity between the pump cavity and the process cavity. The undercut extends past the process chamber centerline at the process cavity. A circular saw is used to remove material and create a plenum which extends beyond the process cavity centerline.
摘要翻译：公开了具有高电导性的处理室和制造处理室的方法。处理室由单片铝加工，其中通过相交的圆柱体形成工艺腔和泵腔。在工艺空腔的底部还形成衬底开口，以提供诸如冷却气体和电气连接等服务的导管。在泵腔和处理腔之间的泵腔的顶部形成有大的底切区域。底切延伸经过过程腔中心线。使用圆锯去除材料并形成延伸超过工艺腔中心线的气室。

5. 发明申请

US20080066678A1 Apparatus and methods for transporting and processing substrates 有权
标题翻译：用于运输和处理基板的装置和方法
公开(公告)号：US20080066678A1
公开(公告)日：2008-03-20
申请号：US11523101
申请日：2006-09-19
申请人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
发明人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
IPC分类号： C23C16/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.
摘要翻译：描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理处理室。

6. 发明授权

US09524896B2 Apparatus and methods for transporting and processing substrates 有权
标题翻译：用于运输和处理基板的装置和方法
公开(公告)号：US09524896B2
公开(公告)日：2016-12-20
申请号：US12368241
申请日：2009-02-09
申请人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
发明人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
IPC分类号： H01L21/677 , C23C14/56 , C23C16/54 , H01L21/67
CPC分类号： H01L21/67745 , C23C14/568 , C23C16/54 , C23C16/545 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67196 , H01L21/67201 , H01L21/67709
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.
摘要翻译：描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。

7. 发明授权

US08303764B2 Apparatus and methods for transporting and processing substrates 有权
公开(公告)号：US08303764B2
公开(公告)日：2012-11-06
申请号：US13042407
申请日：2011-03-07
申请人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
发明人： Terry Bluck , Kevin P. Fairbairn , Michael S. Barnes , Christopher T. Lane
IPC分类号： C23F1/00 , H01L21/306 , H01L21/677 , C23C16/00 , C23C14/00
CPC分类号： H01L21/67184 , H01L21/67173 , H01L21/67196 , H01L21/67201 , H01L21/67745
摘要： There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

8. 发明申请

US20090145879A1 SYSTEM AND METHOD FOR COMMERCIAL FABRICATION OF PATTERNED MEDIA 有权
标题翻译：用于商业制图的制图和方法
公开(公告)号：US20090145879A1
公开(公告)日：2009-06-11
申请号：US12329462
申请日：2008-12-05
申请人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
发明人： Kevin P. Fairbairn , Michael S. Barnes , Terry Bluck , Ren Xu , Charles Liu , Ralph Kerns
IPC分类号： C23F1/00
CPC分类号： G11B5/84 , G11B5/855 , H01J37/3438
摘要： A system is provided for etching patterned media disks for hard drive. The modular system may be tailored to perform specific processes sequences so that a patterned media disk is fabricated without removing the disk from vacuum environment. In some sequence the magnetic stack is etched while in other the etch is performed prior to forming the magnetic stack. In a further sequence ion implantation is used without etching steps. For etching a movable non-contact electrode is utilized to perform sputter etch. The cathode moves to near contact distance to, but not contacting, the substrate so as to couple RF energy to the disk. The substrate is held vertically in a carrier and both sides are etched serially. That is, one side is etched in one chamber and then in the next chamber the second side is etched.
摘要翻译：提供了用于蚀刻用于硬盘驱动器的图案化介质盘的系统。模块化系统可以被定制以执行特定的处理顺序，使得图案化的介质盘被制造而不从真空环境中移除盘。在一些顺序中，磁性堆叠被蚀刻，而另一些蚀刻则在形成磁性堆叠之前进行。在另外的序列中，使用离子注入而没有蚀刻步骤。为了蚀刻可移动的非接触电极用于进行溅射蚀刻。阴极移动到与衬底接近但不接触的接近距离，以将RF能量耦合到盘。衬底垂直地保持在载体中，并且两侧被连续蚀刻。也就是说，在一个室中蚀刻一面，然后在下一个室中蚀刻第二面。

9. 发明授权

US08795466B2 System and method for processing substrates with detachable mask 有权
标题翻译：用可拆卸掩模处理基板的系统和方法
公开(公告)号：US08795466B2
公开(公告)日：2014-08-05
申请号：US12495724
申请日：2009-06-30
申请人： Michael S. Barnes , Terry Bluck
发明人： Michael S. Barnes , Terry Bluck
IPC分类号： H01L21/306
CPC分类号： H01L21/67173 , H01L21/67069 , H01L21/67207 , H01L21/67346 , H01L21/67712 , H01L31/18 , H05K3/143
摘要： Apparatus and methods are provided that enable processing of patterned layers on substrates using a detachable mask. Unlike prior art where the mask is formed directly over the substrate, according to aspects of the invention the mask is made independently of the substrate. During use, the mask is positioned in close proximity or in contact with the substrate so as to expose only portions of the substrate to processing, e.g., sputtering or etch. Once the processing is completed, the mask is moved away from the substrate and may be used for another substrate. The substrate may be cycled for a given number of substrates and then be removed for cleaning or disposal.
摘要翻译：提供了使用可拆卸掩模在基板上处理图案化层的装置和方法。与掩模直接形成在衬底上的现有技术不同，根据本发明的方面，掩模独立于衬底制成。在使用期间，掩模位于与衬底紧密接近或接触的位置，以便只暴露衬底的一部分以进行处理，例如溅射或蚀刻。一旦处理完成，掩模就从衬底移开并可用于另一衬底。衬底可以循环给定数量的衬底，然后被移除以进行清洁或处置。

10. 发明申请

US20080202924A1 Power Source Arrangement For Multiple-Target Sputtering System 审中-公开
标题翻译：多目标溅射系统的电源布置
公开(公告)号：US20080202924A1
公开(公告)日：2008-08-28
申请号：US12032525
申请日：2008-02-15
申请人： Terry Bluck , Patrick R. Ward , Michael S. Barnes
发明人： Terry Bluck , Patrick R. Ward , Michael S. Barnes
IPC分类号： C23C14/34
CPC分类号： H01J37/34 , H01J37/32009 , H01J37/32027 , H01J37/3444
摘要： An arrangement for concurrently powering a plurality of sputtering sources. A power supply is coupled to a charge accumulator. The charge accumulator is coupled to several sputtering sources via switching devices. The duty cycle of each switching device is used to individually control the power delivered to each sputtering source. In another arrangement, a power source is coupled to an impedance match circuit. The impedance match circuit is coupled to several sputtering sources via several balance elements. Each balance element is operated to individually control the power delivered to the sputtering source.
摘要翻译：用于同时供电多个溅射源的装置。电源耦合到电荷累加器。电荷累加器通过开关装置耦合到多个溅射源。每个开关装置的占空比用于单独地控制传送到每个溅射源的功率。在另一种布置中，电源耦合到阻抗匹配电路。阻抗匹配电路通过几个平衡元件耦合到多个溅射源。操作每个平衡元件以单独地控制传送到溅射源的功率。

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