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1. 发明申请

US20130154130A1 METHOD FOR COATING AN OPTOELECTRONIC CHIP-ON-BOARD MODULE AND OPTOELECTRONIC CHIP-ON-BOARD MODULE 有权
标题翻译：用于涂覆光电板块模块和光电板块模块的方法
公开(公告)号：US20130154130A1
公开(公告)日：2013-06-20
申请号：US13819983
申请日：2011-08-29
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： H01L33/54 , H01L31/0203
CPC分类号： H01L33/54 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/24 , H01L23/3121 , H01L27/1446 , H01L27/15 , H01L31/0203 , H01L31/02325 , H01L33/56 , H01L2924/0002 , H01L2933/005 , H05K1/0274 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/0175 , H05K2201/09909 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/0126 , H01L2924/00
摘要： A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.
摘要翻译：提供了一种用于涂覆光电芯片模块的方法，其包括具有一个或多个光电子部件的平坦基板，其具有由一个或多个硅氧烷构成的透明的耐紫外线和耐温涂层。还提供了相应的光电芯片组模块和具有多个光电芯片模块的系统。该方法包括以下步骤：a）将待涂覆的基材预热至第一温度; b）在预热的基底上施加包围待涂覆的基底的表面积或部分区域的坝，所述坝由在第一温度下固化的第一可热固化的高反应性硅树脂制成; c）用液体第二硅胶填充由大坝封闭的基板的表面积或部分区域; 和d）固化第二硅氧烷。

2. 发明授权

US09093622B2 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board module 有权
标题翻译：涂覆光电芯片模块和光电芯片模块的方法
公开(公告)号：US09093622B2
公开(公告)日：2015-07-28
申请号：US13819983
申请日：2011-08-29
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： H01L33/54 , H01L21/56 , H01L23/24 , H01L23/31 , H05K3/28 , H01L31/0203 , H01L31/0232 , F21K99/00 , F21Y101/02 , H01L33/56 , H05K1/02
CPC分类号： H01L33/54 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/24 , H01L23/3121 , H01L27/1446 , H01L27/15 , H01L31/0203 , H01L31/02325 , H01L33/56 , H01L2924/0002 , H01L2933/005 , H05K1/0274 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/0175 , H05K2201/09909 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/0126 , H01L2924/00
摘要： A method is provided for coating an optoelectronic chip-on-board module, including a flat substrate populated with one or more optoelectronic components, having a transparent, UV-resistant, and temperature-resistant coating made of one or more silicones. A corresponding optoelectronic chip-on-board module and a system having multiple optoelectronic chip-on-board modules are also provided. The method includes the following steps: a) preheating the substrate to be coated to a first temperature; b) applying on the preheated substrate a dam that encloses a surface area or partial area of the substrate to be coated, the dam being made of a first, heat-curable, highly reactive silicone that cures at the first temperature; c) filling the surface area or partial area of the substrate enclosed by the dam with a liquid second silicone; and d) curing the second silicone.
摘要翻译：提供了一种用于涂覆光电芯片模块的方法，其包括具有一个或多个光电子部件的平坦基板，其具有由一个或多个硅氧烷构成的透明的耐紫外线和耐温涂层。还提供了相应的光电芯片组模块和具有多个光电芯片模块的系统。该方法包括以下步骤：a）将待涂覆的基材预热至第一温度; b）在预热的基底上施加包围待涂覆的基底的表面积或部分区域的坝，所述坝由在第一温度下固化的第一可热固化的高反应性硅树脂制成; c）用液体第二硅胶填充由大坝封闭的基板的表面积或部分区域; 和d）固化第二硅氧烷。

3. 发明授权

US08956922B2 Coating method for an optoelectronic chip-on-board module 有权
标题翻译：光电芯片模块的涂覆方法
公开(公告)号：US08956922B2
公开(公告)日：2015-02-17
申请号：US13818868
申请日：2011-08-29
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： H01L21/00 , H01L33/54 , F21K99/00 , H01L21/56 , H01L23/31 , H05K3/28 , H01L31/0203 , F21Y101/02 , H01L25/075 , H01L33/60
CPC分类号： H01L31/0203 , F21K9/00 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/3121 , H01L25/0753 , H01L25/13 , H01L31/02322 , H01L31/02325 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316 , H01L2924/00
摘要： A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.
摘要翻译：提出了一种用于涂覆光电芯片组件模块的方法，该模块包括平坦衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选择的至少一个次级光学布置的光电子部件。通过以下步骤，将由硅树脂制成的透明耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸达到或超过衬底的外部尺寸; （b）将基板插入模具中，其中光电子部件完全浸入硅树脂中，并且基板的表面完全接触硅树脂或基板至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

4. 发明授权

US09188289B2 LED lamp for homogeneously illuminating hollow bodies 有权
标题翻译： LED灯用于均匀照明中空体
公开(公告)号：US09188289B2
公开(公告)日：2015-11-17
申请号：US13637661
申请日：2011-03-25
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： F21V21/00 , F21S4/00 , F21K99/00 , F21Y101/02 , F21Y111/00
CPC分类号： F21K9/00 , F21Y2107/30 , F21Y2115/10
摘要： A lighting device is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules, which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module has a plurality of light-emitting LEDs. The lighting device is characterized by at least one pair of the adjacent chip-on-board LED modules being arranged at an angle greater than 0° with respect to the surface normals of the modules.
摘要翻译：提供照明装置用于均匀照明弯曲的，不均匀的或多面体的表面。照明装置具有至少成对地彼此相邻布置的多个扁平的板上LED模块。每个芯片上的LED模块具有多个发光LED。照明装置的特征在于至少一对相邻的板上LED模块相对于模块的表面法线以大于0°的角度布置。

5. 发明申请

US20140339440A1 OPTOELECTRONIC MODULE COMPRISING A LENS SYSTEM 有权
标题翻译：包含镜头系统的光电模块
公开(公告)号：US20140339440A1
公开(公告)日：2014-11-20
申请号：US14232298
申请日：2012-07-06
申请人： Susanne Schadt , Michael Peil , Harald Maiweg , Florin Oswald , Marcus Krauel
发明人： Susanne Schadt , Michael Peil , Harald Maiweg , Florin Oswald , Marcus Krauel
IPC分类号： H01L27/146 , H01L33/58 , G02B13/00 , H01L27/15
CPC分类号： H01L27/14627 , G02B13/0085 , G02B19/0014 , G02B19/0066 , H01L25/0753 , H01L27/156 , H01L33/54 , H01L33/58 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： The invention relates to an optoelectronic module (112), more particularly to an optoelectronic chip-on-board module (114). The optoelectronic module (112) comprises a substrate (116), wherein the substrate (116) has a planar design. Furthermore, the optoelectronic module (112) comprises a plurality of optoelectronic components (118) that are arranged on the substrate (116). Furthermore, the optoelectronic module (112) comprises a lens system (122) having a plurality of lenses (124). The lens system (122) comprises at least two lenses (124) with different directivities.
摘要翻译：本发明涉及一种光电子模块（112），更具体地涉及一种光电芯片模块（114）。光电子模块（112）包括衬底（116），其中衬底（116）具有平面设计。此外，光电子模块（112）包括布置在衬底（116）上的多个光电子部件（118）。此外，光电子模块（112）包括具有多个透镜（124）的透镜系统（122）。透镜系统（122）包括具有不同方向性的至少两个透镜（124）。

6. 发明授权

US09640579B2 Optoelectronic module comprising a lens system 有权
公开(公告)号：US09640579B2
公开(公告)日：2017-05-02
申请号：US14232298
申请日：2012-07-06
申请人： Susanne Schadt , Michael Peil , Harald Maiweg , Florin Oswald , Marcus Krauel
发明人： Susanne Schadt , Michael Peil , Harald Maiweg , Florin Oswald , Marcus Krauel
IPC分类号： F21S8/00 , H01L27/146 , H01L25/075 , H01L33/58 , G02B19/00 , G02B13/00 , H01L27/15 , H01L33/54
CPC分类号： H01L27/14627 , G02B13/0085 , G02B19/0014 , G02B19/0066 , H01L25/0753 , H01L27/156 , H01L33/54 , H01L33/58 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： The invention relates to an optoelectronic module, more particularly to an optoelectronic chip-on-board module. The optoelectronic module comprises a substrate, wherein the substrate has a planar design. Furthermore, the optoelectronic module comprises a plurality of optoelectronic components that are arranged on the substrate. Furthermore, the optoelectronic module comprises a lens system having a plurality of lenses. The lens system comprises at least two lenses with different directivities.

7. 发明授权

US09360200B2 Cooling device for cylindrical, coupleable LED modules 有权
标题翻译：圆柱形，可耦合LED模块的冷却装置
公开(公告)号：US09360200B2
公开(公告)日：2016-06-07
申请号：US13810315
申请日：2011-07-05
申请人： Michael Peil , Florin Oswald , Harald Maiweg , Bernd Willer
发明人： Michael Peil , Florin Oswald , Harald Maiweg , Bernd Willer
IPC分类号： F21V7/20 , F21V29/00 , F21K99/00 , F21V29/02 , F21V29/58 , F21Y101/02 , F21Y111/00
CPC分类号： F21V29/51 , F21K9/20 , F21V29/02 , F21V29/30 , F21V29/58 , F21V29/85 , F21Y2107/30 , F21Y2115/10
摘要： A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.
摘要翻译：提供一种装置和方法，用于控制LED灯的LED灯或LED模块的温度，特别是用于冷却温度，例如用于固化光固化管。该装置包括：流体供应管线和连接到供应管线的多个热交换器; 相对于热传递耦合到每个热交换器的多个LED; 和流体回流管线。流体供应和返回管线以流体密封的方式通过在流体供应源和返回管线的端部中或端部处的L形件和T形件的各种组合彼此连接，使得流体从LED流出在空间上分离的方式中，流体供应和返回管线具有至少两个彼此平行的流体连接，热交换器被布置在流体连接中或构成流体连接。

8. 发明申请

US20130193592A1 Coating Method for an Optoelectronic Chip-on-Board Module 有权
标题翻译：光电芯片模块的涂覆方法
公开(公告)号：US20130193592A1
公开(公告)日：2013-08-01
申请号：US13818868
申请日：2011-08-29
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： H01L33/54 , H01L31/0203
CPC分类号： H01L31/0203 , F21K9/00 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/3121 , H01L25/0753 , H01L25/13 , H01L31/02322 , H01L31/02325 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316 , H01L2924/00
摘要： A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.
摘要翻译：提出了一种用于涂覆光电芯片组件模块的方法，该模块包括平坦衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选择的至少一个次级光学布置的光电子部件。通过以下步骤，将由硅树脂制成的透明耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸达到或超过衬底的外部尺寸; （b）将基底插入模具中，其中光电子部件完全浸入硅树脂中，并且基底的表面完全接触硅树脂或基底至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

9. 发明申请

US20130114263A1 COOLING DEVICE FOR CYLINDRICAL, COUPLEABLE LED MODULES 有权
标题翻译：用于圆柱形，可耦合LED模块的冷却装置
公开(公告)号：US20130114263A1
公开(公告)日：2013-05-09
申请号：US13810315
申请日：2011-07-05
申请人： Michael Peil , Florin Oswald , Harald Maiweg , Bernd Willer
发明人： Michael Peil , Florin Oswald , Harald Maiweg , Bernd Willer
IPC分类号： F21V29/00
CPC分类号： F21V29/51 , F21K9/20 , F21V29/02 , F21V29/30 , F21V29/58 , F21V29/85 , F21Y2107/30 , F21Y2115/10
摘要： A device and method are provided for controlling the temperature, in particular for cooling, of an LED lamp or LED modules of an LED lamp, e.g., for curing a light-cured pipe. The device includes: a fluid supply line and multiple heat exchangers connected to the supply line; multiple LEDs coupled to each heat exchanger with respect to heat transfer; and a fluid return line. The fluid supply and return lines are connected to each other in a fluid-tight manner by various combinations of L-pieces and T-pieces in or at the ends of the fluid supply and the return lines, so that the fluid flows from the LEDs in a spatially separated way and the fluid supply and return lines have at least two parallel fluid connections to each other, the heat exchangers being arranged in the fluid connections or constituting the fluid connections.
摘要翻译：提供一种装置和方法，用于控制LED灯的LED灯或LED模块的温度，特别是用于冷却温度，例如用于固化光固化管。该装置包括：流体供应管线和连接到供应管线的多个热交换器; 相对于热传递耦合到每个热交换器的多个LED; 和流体回流管线。流体供应和返回管线以流体密封的方式通过在流体供应源和返回管线的端部中或端部处的L形件和T形件的各种组合彼此连接，使得流体从LED流出在空间上分离的方式中，流体供应和返回管线具有至少两个彼此平行的流体连接，热交换器被布置在流体连接中或构成流体连接。

10. 发明申请

US20130010460A1 LED LAMP FOR HOMOGENEOUSLY ILLUMINATING HOLLOW BODIES 有权
标题翻译： LED灯用于均匀照射中空体
公开(公告)号：US20130010460A1
公开(公告)日：2013-01-10
申请号：US13637661
申请日：2011-03-25
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： F21V21/00 , F21V7/00 , F21V5/04 , F21V11/00 , F21V29/00
CPC分类号： F21K9/00 , F21Y2107/30 , F21Y2115/10
摘要： A lighting device (40-40″, 45-45″, 50-50″, 60, 80, 93-93″) is provided for the uniform illumination of curved, uneven, or polyhedral surfaces. The lighting device has a plurality of flat chip-on-board LED modules (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-71′″, 811-818), which are arranged adjacent to each other at least in pairs. Each chip-on-board LED module (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-811-818) has a plurality of light-emitting LEDs (4, 4′, 14, 14′, 24, 34, 64, 72). The lighting device (40-40″, 45-45″, 50-50″, 60, 80, 93-93″) is characterized by at least one pair of the adjacent chip-on-board LED modules (1, 11, 11′, 21, 31, 41-41″, 46-46″, 51-51″, 61-61″, 71-71′″, 811-818) being arranged at an angle greater than 0° with respect to the surface normals of the modules.
摘要翻译：提供照明装置（40-40“，45-45”，50-50“，60,80,93-93”）用于均匀照明弯曲的，不均匀的或多面体的表面。照明装置具有多个扁平的板上LED模块（1,11,11'，21,31,41-41“，46-46”，51-51“，61-61”，71-71 '，811-818），它们至少成对地彼此相邻布置。每个芯片上的LED模块（1,11,11'，21,31,41-41“，46-46”，51-51“，61-61”，71-811-818）具有多个发光LED（4,4'，14,14'，24,34,64,72）。照明装置（40-40“，45-45”，50-50“，60,80,93-93”）的特征在于至少一对相邻的板上LED模块（1,11， 11'，21,31,41-41“，46-46”，51-51“，61-61”，71-71“”，811-818）以相对于表面法线的模块。

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