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1. 发明授权

US08141769B2 Process for repairing a component comprising a directional microstructure by setting a temperature gradient during the laser heat action, and a component produced by such a process 失效
标题翻译：通过在激光加热动作期间设定温度梯度来修复包括定向微结构的部件的工艺，以及通过这种工艺制造的部件
公开(公告)号：US08141769B2
公开(公告)日：2012-03-27
申请号：US11989214
申请日：2005-07-22
申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
发明人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
IPC分类号： B23K26/34 , B23K31/02
CPC分类号： B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
摘要： In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
摘要翻译：在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化要修理的位置。

2. 发明授权

US07967183B2 Repair soldering method for repairing a component which comprises a base material with an oriented microstructure 失效
标题翻译：用于修复包括具有取向微结构的基材的部件的修补焊接方法
公开(公告)号：US07967183B2
公开(公告)日：2011-06-28
申请号：US10588024
申请日：2005-01-28
申请人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
发明人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
IPC分类号： B23K31/02
CPC分类号： F01D5/005 , B23K1/0008 , B23K1/0018 , B23K1/002 , B23K1/005 , B23K2101/001 , B23P6/007
摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
摘要翻译：本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。

3. 发明申请

US20100000976A1 Process for Repairing a Component Comprising a Directional Microstructure by Setting a Temperature Gradient During the Laser Heat Action, and a Component Produced by Such a Process 失效
标题翻译：通过在激光热作用期间设定温度梯度来修复包含定向微结构的组分的方法和由这种方法产生的组分
公开(公告)号：US20100000976A1
公开(公告)日：2010-01-07
申请号：US11989214
申请日：2005-07-22
申请人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
发明人： Michael Ott , Uwe Paul , Robert Singer , Andreas Volek
IPC分类号： B23K15/00 , B23K31/02 , B23K26/34
CPC分类号： B23P6/007 , B23K1/0018 , B23K1/002 , B23K1/0056 , B23K2101/001
摘要： In one aspect, a repair method for repairing components comprising a base material with a directed microstructure is provided. The repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material. A solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure, a temperature gradient, i.e., for instance a temperature variation from a higher temperature to a lower temperature, is thereby produced in the region of the location to be repaired.
摘要翻译：在一个方面，提供了一种用于修复包括具有定向微结构的基材的部件的修复方法。以这样的方式进行修复，即修理的位置相应地具有像周围的基材的定向微观结构。在要修复的位置的区域中施加焊料，并且通过热暴露将其焊接到部件，从而在以下区域中产生温度梯度，即例如从较高温度到较低温度的温度变化要修理的位置。

4. 发明申请

US20070228108A1 Repair Soldering Method for Repairing a Component Which Comprises a Base Material with an Oriented Microstructure 失效
标题翻译：用于修复包含具有定向微结构的基材的组分的修复焊接方法
公开(公告)号：US20070228108A1
公开(公告)日：2007-10-04
申请号：US10588024
申请日：2005-01-28
申请人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
发明人： Dirk Goldschmidt , Matthias Oechsner , Michael Ott , Uwe Paul , Ursula Pickert , Eckart Schumann , Beate Seiler , Robert Singer , Jan Steinbach , Andreas Volek , Volker Vosberg
IPC分类号： B23K31/02
CPC分类号： F01D5/005 , B23K1/0008 , B23K1/0018 , B23K1/002 , B23K1/005 , B23K2101/001 , B23P6/007
摘要： The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.
摘要翻译：本发明涉及一种用于修复包括具有定向微结构的基材的部件的方法，其中所述修复点包括相应定向的微结构作为周围的基材。根据本发明的方法，焊料被施加在要修复的点的区域中，并且通过由器件产生的加热效应被焊接到部件上。在加热效果期间产生温度梯度，即近似温度特性，所述温度特性在要修复的点的区域中从高温到低温。

5. 发明授权

US09068251B2 Alloy for directional solidification and component made of stem-shaped crystals 有权
标题翻译：用于定向凝固的合金和由杆状晶体制成的部件
公开(公告)号：US09068251B2
公开(公告)日：2015-06-30
申请号：US13502451
申请日：2009-10-20
申请人： Winfried Eβer , Dirk Goldschmidt , Christopher R. Hanslits , Michael Ott , Uwe Paul , Ursula Pickert , Russell G. Vogt
发明人： Winfried Eβer , Dirk Goldschmidt , Christopher R. Hanslits , Michael Ott , Uwe Paul , Ursula Pickert , Russell G. Vogt
IPC分类号： C22C19/05
CPC分类号： C22C19/055 , C22C19/051
摘要： A nickel-based superalloy is provided. Known nickel-based superalloys for producing components made of stem shaped single crystals do not provide sufficiently for grain boundary strength. The superalloy includes a low molybdenum content and very accurately adjusted values for elements having grain boundary strength and elements that precipitate in grain boundaries.
摘要翻译：提供镍基超级合金。已知的用于制造由茎形单晶制成的部件的镍基超级合金不能充分提供晶界强度。该超级合金包括低的钼含量和对晶界强度和在晶界析出的元素具有非常精确的调整值。

6. 发明申请

US20060249233A1 Heat treatment of alloys having elements for improving grain boundary strength 审中-公开
标题翻译：具有改善晶界强度的元素的合金的热处理
公开(公告)号：US20060249233A1
公开(公告)日：2006-11-09
申请号：US11314840
申请日：2005-12-21
申请人： Winfried Esser , Dirk Goldschmidt , Christopher Hanslits , Michael Ott , Uwe Paul , Ursula Pickert , Russell Vogt
发明人： Winfried Esser , Dirk Goldschmidt , Christopher Hanslits , Michael Ott , Uwe Paul , Ursula Pickert , Russell Vogt
IPC分类号： C22F1/10
CPC分类号： C22F1/10
摘要： Heat treatment of alloys having elements for improving grain boundary strength is disclosed. Components directly after castings often reveal low or no transverse grain boundary strength, so that cracks do appear and decrease the yield rate. The provided measures do not lead to low transverse grain boundary strength but maintains efficient grain boundary strength, so that the yield rate of components without cracks is increased.
摘要翻译：公开了具有改善晶界强度的元素的合金的热处理。直接铸件后的组分通常显示出低的或没有横向晶界强度，使裂纹确实出现并降低了产率。所提供的措施不会导致横向晶界强度低，而且保持有效的晶界强度，从而提高无裂纹的成分的产率。

7. 发明授权

US07892370B2 Heat treatment method for monocrystalline or directionally solidified structural components 失效
标题翻译：单晶或定向凝固结构组分的热处理方法
公开(公告)号：US07892370B2
公开(公告)日：2011-02-22
申请号：US11587897
申请日：2005-04-28
申请人： Michael Ott , Uwe Paul
发明人： Michael Ott , Uwe Paul
IPC分类号： C21D1/00 , C30B33/00
CPC分类号： C22F1/10 , C21D9/00 , C30B11/003 , C30B29/52 , C30B33/00
摘要： The invention relates to a heat treatment method for monocrystalline or directionally solidified structural components. Said method comprises a heat treatment which results in dissolving at least one crystalline phase of the material of the structural component, referred to in the following as component material. The inventive method is characterized by carrying out the heat treatment by heating the structural component to a dissolution temperature required for dissolving the crystalline phase only in at least one first component area in which the stresses within the component material do not exceed a predetermined value. In at least one second component area in which the stresses within the component material exceed the predetermined value the material is only heated to a temperature below the dissolution temperature.
摘要翻译：本发明涉及单晶或定向凝固结构组分的热处理方法。所述方法包括热处理，其导致以下结构组分的材料的至少一个结晶相溶解作为组分材料。本发明的方法的特征在于，通过将结构组分加热到仅将结晶相溶解在组分材料中的应力不超过预定值的至少一个第一组分区域中所需的溶解温度来进行热处理。在其中部件材料内的应力超过预定值的至少一个第二部件区域中，材料仅被加热到低于溶解温度的温度。

8. 发明申请

US20090107592A1 Heat treatment of alloys having elements for improving grain boundary strength 审中-公开
标题翻译：具有改善晶界强度的元素的合金的热处理
公开(公告)号：US20090107592A1
公开(公告)日：2009-04-30
申请号：US10641995
申请日：2003-08-15
申请人： Winfried Esser , Dirk Goldschmidt , Michael Ott , Uwe Paul , Ursula Pickert , Christopher R. Hanslits , Russel G. Vogt
发明人： Winfried Esser , Dirk Goldschmidt , Michael Ott , Uwe Paul , Ursula Pickert , Christopher R. Hanslits , Russel G. Vogt
IPC分类号： C22F1/10
CPC分类号： C22C19/056 , C30B29/52 , C30B33/02
摘要： Heat treatment of alloys having elements for improving grain boundary strengthComponents directly after castings often reveal a low or no transverse grain boundary strength, so that cracks do appear and decrease the yield rate.The inventive measures does not lead to low transverse grain boundary strength but maintains a efficient grain boundary strength, so that the yield rate of components without cracks is increased.
摘要翻译：具有改善晶界强度的元素的合金的热处理直接在铸件之后的组分通常显示出低的或没有横向晶界强度，使得出现裂纹并降低产率。本发明的措施不会导致低的横向晶界强度，而是保持有效的晶界强度，从而增加了没有裂纹的组分的产率。

9. 发明申请

US20080202650A1 Heat Treatment Method For Monocrystalline or Directionally Solidified Structural Components 失效
标题翻译：单晶或定向凝固结构部件的热处理方法
公开(公告)号：US20080202650A1
公开(公告)日：2008-08-28
申请号：US11587897
申请日：2005-04-28
申请人： Michael Ott , Uwe Paul
发明人： Michael Ott , Uwe Paul
IPC分类号： C22F1/00
CPC分类号： C22F1/10 , C21D9/00 , C30B11/003 , C30B29/52 , C30B33/00
摘要： The invention relates to a heat treatment method for monocrystalline or directionally solidified structural components. Said method comprises a heat treatment which results in dissolving at least one crystalline phase of the material of the structural component, referred to in the following as component material. The inventive method is characterized by carrying out the heat treatment by heating the structural component to a dissolution temperature required for dissolving the crystalline phase only in at least one first component area in which the stresses within the component material do not exceed a predetermined value. In at least one second component area in which the stresses within the component material exceed the predetermined value the material is only heated to a temperature below the dissolution temperature.
摘要翻译：本发明涉及单晶或定向凝固结构组分的热处理方法。所述方法包括热处理，其导致以下结构组分的材料的至少一个结晶相溶解作为组分材料。本发明的方法的特征在于，通过将结构组分加热到仅将结晶相溶解在组分材料中的应力不超过预定值的至少一个第一组分区域中所需的溶解温度来进行热处理。在其中部件材料中的应力超过预定值的至少一个第二部件区域中，材料仅被加热到低于溶解温度的温度。

10. 发明申请

US20120175027A1 Heat Treatment of Alloys Having Elements for Improving Grain Boundary Strength 审中-公开
标题翻译：具有提高晶粒边界强度的元素的合金的热处理
公开(公告)号：US20120175027A1
公开(公告)日：2012-07-12
申请号：US13427054
申请日：2012-03-22
申请人： Winfried Esser , Dirk Goldschmidt , Michael Ott , Uwe Paul , Ursula Pickert , Christopher Hanslits , Russell G. Vogt
发明人： Winfried Esser , Dirk Goldschmidt , Michael Ott , Uwe Paul , Ursula Pickert , Christopher Hanslits , Russell G. Vogt
IPC分类号： C22F1/10 , B22D27/04
CPC分类号： C22C19/056 , C30B29/52 , C30B33/02
摘要： A method of producing a component wherein a directionally solidified columnar grained cast superalloy material is heat treated such that a secondary phase of the alloy is only partly solved, thereby providing improved transverse stress rupture strength compared to fully solved alloys.
摘要翻译：一种制造方法，其中定向凝固的柱状晶粒铸造超耐热合金材料被热处理，使得合金的第二相仅部分溶解，从而与完全溶解的合金相比提供了改进的横向应力断裂强度。

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