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1. 发明授权

US06657128B2 Hydrophobic properties of polymer housings 有权
公开(公告)号：US06657128B2
公开(公告)日：2003-12-02
申请号：US09771027
申请日：2001-01-29
申请人： Michael M. Ramarge , Thomas C. Hartman , David R. Miller , David Servies
发明人： Michael M. Ramarge , Thomas C. Hartman , David R. Miller , David Servies
IPC分类号： H01B1700
CPC分类号： H01B17/50
摘要： A housing for an electrical apparatus includes a sheath, at least one shed and a hydrophobic coating. The sheath includes a first electrically insulative material and an outer surface. The at least one shed includes a second electrically insulative material and an outer surface. The hydrophobic coating is applied to the outer surface of at least one of the sheath and the at least one shed. One of the first electrically insulative material and the second electrically insulative material includes an electrically insulative, polymeric material.

2. 发明授权

US06519129B1 Surge arrester module with bonded component stack 失效
标题翻译：带保护元件堆的浪涌避雷器模块
公开(公告)号：US06519129B1
公开(公告)日：2003-02-11
申请号：US09432147
申请日：1999-11-02
申请人： Michael M. Ramarge , David P. Bailey , Roger S. Perkins , Thomas C. Hartman , Alan P. Yerges , Ramon Puyane , David R. Miller
发明人： Michael M. Ramarge , David P. Bailey , Roger S. Perkins , Thomas C. Hartman , Alan P. Yerges , Ramon Puyane , David R. Miller
IPC分类号： H02H100
CPC分类号： H01C7/12
摘要： A surge arrester includes a stack of components having at least one varistor. Each component has end faces, at least one of which is mechanically bonded to an end face of another component such that the combined components of the stack define a single, monolithic structure that serves as both an electrically-active element and a mechanical support element of the surge arrester. The surge arrester also includes an insulative housing surrounding the stack of components. The stack of components is capable of withstanding current pulses having magnitudes of 65 kA and durations of 4/10 microseconds without significant degradation in operating performance of the stack of components.
摘要翻译：电涌放电器包括具有至少一个压敏电阻的组件堆叠。每个部件具有端面，其中至少一个机械地结合到另一部件的端面，使得该组合件的组合部件限定了单一的整体结构，其用作电活性元件和机械支撑元件避雷器。电涌放电器还包括围绕组件堆叠的绝缘壳体。组件堆叠能够耐受具有65kA的幅度和4/10微秒的持续时间的电流脉冲，而不会使组件堆的操作性能显着降低。

3. 发明授权

US06847514B2 Surge arrester module with bonded component stack 失效
标题翻译：带保护元件堆的浪涌避雷器模块
公开(公告)号：US06847514B2
公开(公告)日：2005-01-25
申请号：US10323677
申请日：2002-12-20
申请人： Michael M. Ramarge , David P. Bailey , Roger S. Perkins , Thomas C. Hartman , Alan P. Yerges , Ramon Puyane , David R. Miller
发明人： Michael M. Ramarge , David P. Bailey , Roger S. Perkins , Thomas C. Hartman , Alan P. Yerges , Ramon Puyane , David R. Miller
IPC分类号： H01C7/12 , H02H9/00
CPC分类号： H01C7/12
摘要： A surge arrester includes a stack of components having at least one varistor. Each component has end faces, at least one of which is mechanically bonded to an end face of another component such that the combined components of the stack define a single, monolithic structure that serves as both an electrically-active element and a mechanical support element of the surge arrester. The surge arrester also includes an insulative housing surrounding the stack of components. The stack of components is capable of withstanding current pulses having magnitudes of 65 kA and durations of {fraction (4/10)} microseconds without significant degradation in operating performance of the stack of components.
摘要翻译：电涌放电器包括具有至少一个压敏电阻的组件堆叠。每个部件具有端面，其中至少一个机械地结合到另一部件的端面，使得该组合件的组合部件限定了单一的整体结构，其用作电活性元件和机械支撑元件避雷器。电涌放电器还包括围绕组件堆叠的绝缘壳体。组件堆叠能够耐受具有65kA的电流脉冲和（分数（4/10微秒，而不会显着降低组件堆的操作性能）的持续时间。

4. 发明授权

US06840432B1 Solder application technique 有权
标题翻译：焊接应用技术
公开(公告)号：US06840432B1
公开(公告)日：2005-01-11
申请号：US10419071
申请日：2003-04-21
申请人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
发明人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
IPC分类号： B23K1/20 , B23K35/00 , B23K35/12 , H01C7/108 , B23K31/02
CPC分类号： B23K1/20 , B23K35/001 , B23K2101/36 , H01C7/108 , H01C7/12
摘要： A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
摘要翻译：将第一电气部件的端面与第二电气部件的端面接合的方法包括将第一金属层施加到第一电气部件的端面，以形成第一金属化层，并将第二金属层施加到第二电气部件的端面以形成第二金属化层。通过熔化可熔合金并将熔融的可熔合金推进到第一金属化层上，将第一熔融合金层施加到第一金属化层，并且通过熔化可熔合金将第二熔融合金层施加到第二金属化层上，并推进熔融的可熔合金到第二金属化层。该方法还包括将第一可熔合金层与第二熔融合金层接触。接下来，加热端面和可熔合金层以熔化可熔合金层。加热后，端面和熔融合金层被冷却以在端面之间形成结合。

5. 发明授权

US06279811B1 Solder application technique 失效
标题翻译：焊接应用技术
公开(公告)号：US06279811B1
公开(公告)日：2001-08-28
申请号：US09570404
申请日：2000-05-12
申请人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
发明人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
IPC分类号： B23K120
CPC分类号： B23K1/20 , B23K35/001 , B23K2101/36 , H01C7/108 , H01C7/12
摘要： A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
摘要翻译：将第一电气部件的端面与第二电气部件的端面接合的方法包括将第一金属层施加到第一电气部件的端面，以形成第一金属化层，并将第二金属层施加到第二电气部件的端面以形成第二金属化层。通过熔化可熔合金并将熔融的可熔合金推进到第一金属化层上，将第一熔融合金层施加到第一金属化层，并且通过熔化可熔合金将第二熔融合金层施加到第二金属化层上，并推进熔融的可熔合金到第二金属化层。该方法还包括使第一可熔合金层与第二熔融合金层接触。接下来，加热端面和可熔合金层以熔化可熔合金层。加热后，端面和熔融合金层被冷却以在端面之间形成结合。

6. 发明授权

US06575355B1 Solder application technique 失效
标题翻译：焊接应用技术
公开(公告)号：US06575355B1
公开(公告)日：2003-06-10
申请号：US09873335
申请日：2001-06-05
申请人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
发明人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman
IPC分类号： B23K3102
CPC分类号： B23K1/20 , B23K35/001 , B23K2101/36 , H01C7/108 , H01C7/12
摘要： A method of joining an end face of a first electric component to an end face of a second electric component includes applying a first metal layer to the end face of the first electric component to form a first metallized layer and applying a second metal layer to the end face of the second electric component to form a second metallized layer. A first fusible alloy layer is applied to the first metallized layer by melting a fusible alloy and propelling the melted fusible alloy onto the first metallized layer, and a second fusible alloy layer is applied to the second metallized layer by melting a fusible alloy and propelling the melted fusible alloy to the second metallized layer. The method further includes contacting the first fusible alloy layer to the second fusible alloy layer. Next, the end faces and fusible alloy layers are heated to melt the fusible alloy layers. After heating, the end faces and fusible alloy layers are cooled to form a bond between the end faces.
摘要翻译：将第一电气部件的端面与第二电气部件的端面接合的方法包括将第一金属层施加到第一电气部件的端面，以形成第一金属化层，并将第二金属层施加到第二电气部件的端面以形成第二金属化层。通过熔化可熔合金并将熔融的可熔合金推进到第一金属化层上，将第一熔融合金层施加到第一金属化层，并且通过熔化可熔合金将第二熔融合金层施加到第二金属化层上，并推进熔融的可熔合金到第二金属化层。该方法还包括使第一可熔合金层与第二熔融合金层接触。接下来，加热端面和可熔合金层以熔化可熔合金层。加热后，端面和熔融合金层被冷却以在端面之间形成结合。

7. 发明授权

US06735068B1 Electrical apparatus employing one or more housing segments 失效
标题翻译：采用一个或多个外壳段的电气设备
公开(公告)号：US06735068B1
公开(公告)日：2004-05-11
申请号：US09819900
申请日：2001-03-29
申请人： Thomas C. Hartman , Michael M. Ramarge
发明人： Thomas C. Hartman , Michael M. Ramarge
IPC分类号： H02H100
CPC分类号： H01C7/126
摘要： An electrical apparatus includes at least one housing segment and at least one MOV disk. The housing segment includes a sheath and defines a bore having a first opening at one end of the housing segment and a second opening at the opposite end of the housing segment. The MOV disk is positioned within the bore. An adhesive is positioned in the bore between the MOV disk and the housing segment and is configured to circumferentially bond the MOV disk to the housing segment.
摘要翻译：电气设备包括至少一个壳体段和至少一个MOV盘。壳体段包括护套并且限定了在壳体段的一端具有第一开口的孔，以及在壳体段的相对端处的第二开口。 MOV盘位于孔内。粘合剂位于MOV盘和壳体段之间的孔中，并且构造成将MOV盘周向地结合到壳体段。

8. 发明授权

US06483685B1 Compliant joint between electrical components 失效
标题翻译：电气部件之间的兼容接头
公开(公告)号：US06483685B1
公开(公告)日：2002-11-19
申请号：US09577837
申请日：2000-05-25
申请人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman , Roger S. Perkins , Alan P. Yerges , Michael G. Scharrer , Lisa C. Sletson
发明人： Michael M. Ramarge , David P. Bailey , Thomas C. Hartman , Roger S. Perkins , Alan P. Yerges , Michael G. Scharrer , Lisa C. Sletson
IPC分类号： H02H900
CPC分类号： H01C7/12 , H02G13/00
摘要： An electrically-conductive and mechanically-compliant joint is formed between a pair of electrical components. The joint is positioned between a lower face of a first electrical component and an upper face of a second electrical component. The Young's modulus of the joint is less than approximately half that of the Young's modulus of the electrical components.
摘要翻译：导电和机械柔性接头形成在一对电气部件之间。接头位于第一电气部件的下表面和第二电气部件的上表面之间。接头的杨氏模量小于电气部件的杨氏模量的大约一半。

9. 发明授权

US07015786B2 Mechanical reinforcement to improve high current, short duration withstand of a monolithic disk or bonded disk stack 有权
公开(公告)号：US07015786B2
公开(公告)日：2006-03-21
申请号：US09940539
申请日：2001-08-29
申请人： Michael M. Ramarge , Thomas C. Hartman
发明人： Michael M. Ramarge , Thomas C. Hartman
IPC分类号： H01C7/10
CPC分类号： H01C7/102 , H01C7/126
摘要： A mechanical reinforcement for an electrical apparatus has at least one electrical element with an outer surface and a reinforcing structure attached to the outer surface. The electrical element may be a monolithic MOV disk or a bonded MOV disk stack. The monolithic element may, for example, have a rating greater than 6 kV. The reinforcing structure may be pre-impregnated fiber matrix that may be, for example, pre-impregnated with resin. The mechanical reinforcement provides improved high current durability to the electrical apparatus.

10. 发明授权

US06757963B2 Method of joining components using a silver-based composition 失效
标题翻译：使用银基组合物接合组分的方法
公开(公告)号：US06757963B2
公开(公告)日：2004-07-06
申请号：US10052249
申请日：2002-01-23
申请人： Alan M. Meier , David R. Miller , Kevin R. Dickson , Roger S. Perkins , Michael M. Ramarge
发明人： Alan M. Meier , David R. Miller , Kevin R. Dickson , Roger S. Perkins , Michael M. Ramarge
IPC分类号： H01C1700
CPC分类号： H01C7/123 , Y10T29/43 , Y10T29/49082 , Y10T29/49098 , Y10T29/49163
摘要： A surface of a first ceramic component is joined to a surface of a second ceramic component using a silver-based composition. The silver-based composition is a mixture of silver metal and a metal oxide and the metal in the metal oxide is a metal other than silver. The silver-based composition is applied to the surface of the first ceramic component and to the surface of the second ceramic component. The silver-based composition applied to the first ceramic component is contacted to the silver-based composition applied to the second ceramic component. The surfaces of the first and second ceramic components are heated to melt the applied silver-based compositions. The surfaces of the first and second ceramic components are cooled to form a bond between the first and second ceramic components.
摘要翻译：使用银基组合物将第一陶瓷部件的表面接合到第二陶瓷部件的表面。银基组合物是银金属和金属氧化物的混合物，并且金属氧化物中的金属是除银以外的金属。将银基组合物施加到第一陶瓷部件的表面和第二陶瓷部件的表面。施加到第一陶瓷组分的银基组合物与施加到第二陶瓷组分的银基组合物接触。加热第一和第二陶瓷组分的表面以熔化所施加的银基组合物。第一和第二陶瓷部件的表面被冷却以在第一和第二陶瓷部件之间形成结合。

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