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    • 7. 发明授权
    • Radio frequency tag with miniaturized resonant antenna
    • 射频标签带小型谐振天线
    • US06285342B1
    • 2001-09-04
    • US09423063
    • 1999-10-29
    • Michael John BradyDah-Weih DuanVenkata S. R. Kodukula
    • Michael John BradyDah-Weih DuanVenkata S. R. Kodukula
    • H01Q136
    • H01Q1/2225G06K19/07749H01Q1/22H01Q1/38H01Q23/00
    • An RF transponder is provided with a miniature resonant antenna that can fit on a small form factor the size of a button or coin. More particularly, the RF transponder comprises a substrate and an RF integrated circuit disposed thereon. An antenna is provided on the substrate and is electrically connected to the RF integrated circuit. The antenna has a contorted shape that permits it to fit into the limited available space on the substrate, while having an electrical length that is greater than a maximum length dimension of the substrate. Possible shapes for the antenna may include a meander antenna, a non-uniform meander antenna, a bent dipole antenna, a spiral antenna, a z-shaped dipole, a squeezed dipole antenna, or a combination of any of the antenna types. The RF transponder may further include at least one loading bar spaced from the antenna and/or at least one tuning stub coupled to the antenna.
    • RF发射机应答器具有微型谐振天线,其可以适应小尺寸的按钮或硬币的尺寸。 更具体地,RF应答器包括衬底和设置在其上的RF集成电路。 天线设置在基板上并电连接到RF集成电路。 天线具有扭曲的形状,其允许其适配到衬底上的有限可用空间中,同时具有大于衬底的最大长度尺寸的电长度。 天线的可能形状可以包括曲折天线,不均匀曲折天线,弯曲偶极天线,螺旋天线,z形偶极子,挤压偶极子天线或任何天线类型的组合。 RF应答器还可以包括与天线间隔开的至少一个加载条和/或耦合到天线的至少一个调谐短截线。
    • 10. 发明授权
    • Ultra-thin outline package for integrated circuit
    • 用于集成电路的超薄外形封装
    • US06518885B1
    • 2003-02-11
    • US09417635
    • 1999-10-14
    • Michael John BradyVenkata S. R. Kodukula
    • Michael John BradyVenkata S. R. Kodukula
    • G08B1314
    • H01L23/3121H01L23/13H01L24/48H01L33/486H01L2224/05599H01L2224/48091H01L2224/48227H01L2224/48228H01L2224/484H01L2224/85444H01L2224/85455H01L2924/00014H01L2924/01013H01L2924/01028H01L2924/01029H01L2924/01074H01L2924/01079H01L2924/014H01L2924/14H01L2924/181H01L2924/18165H01L2924/3011H01L2224/45099H01L2924/00012
    • The present invention is directed to an ultra-thin outline package for integrated circuits that is much smaller than conventional chip packaging structures. The ultra-thin outline package is particularly useful in fabricating RF or RFID transponders. In an embodiment of the invention, the ultra-thin outline package includes a substrate having an aperture. At least one conductive trace that includes upper and lower portions is disposed on respective upper and lower surfaces of the substrate. The substrate further comprises at least one via electrically connecting the conductive trace portions together. An integrated circuit is disposed in the aperture and is operatively coupled to the upper portion of the conductive trace. An encapsulant is provided in the aperture substantially covering the integrated circuit. The lower portion of the conductive trace is adapted for coupling of the ultra-thin outline package to a secondary substrate using conventional surface mounting techniques. The via connecting the upper and lower trace portions may be disposed either on at least one edge surface of the aperture or on at least one edge surface of the substrate. At least one wire bond electrically couples the integrated circuit to the conductive trace, and the encapsulant covers the integrated circuit and the wire bond. Using printed circuit board material for the substrate, the ultra-thin outline package achieves a vertical profile of approximately 0.3 to 0.375 mm (12 to 15 mils).
    • 本发明涉及一种比常规芯片封装结构小得多的用于集成电路的超薄外形封装。 超薄外形封装在制造RF或RFID应答器方面特别有用。 在本发明的一个实施例中,超薄外形封装包括具有孔径的基板。 包括上部和下部的至少一个导电迹线设置在基板的相应的上表面和下表面上。 衬底还包括至少一个通孔,将导电迹线部分电连接在一起。 集成电路设置在孔中并且可操作地耦合到导电迹线的上部。 密封剂设置在孔中,基本上覆盖集成电路。 导电迹线的下部适于使用常规的表面安装技术将超薄轮廓封装耦合到次级衬底。 连接上部和下部迹线部分的通孔可以设置在孔的至少一个边缘表面上或基板的至少一个边缘表面上。 至少一个引线键合将集成电路电耦合到导电迹线,并且密封剂覆盖集成电路和引线键合。 使用印刷电路板材料作为基板,超薄轮廓封装实现了大约0.3到0.375毫米(12到15密耳)的垂直轮廓。