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1. 发明授权

US08636340B2 Printheads and method for assembling printheads 有权
标题翻译：打印头和组装打印头的方法
公开(公告)号：US08636340B2
公开(公告)日：2014-01-28
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, Jr. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/25
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

2. 发明申请

US20120236076A1 PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS 有权
标题翻译：用于组装原理的标题和方法
公开(公告)号：US20120236076A1
公开(公告)日：2012-09-20
申请号：US13046845
申请日：2011-03-14
申请人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
发明人： Michael J. Dixon , Jiandong Fang , Richard Earl Corley, JR. , Jeanne Marie Saldanha Singh , Frank E. Anderson , Xiaoming Wu
IPC分类号： B41J2/145 , B23P17/00
CPC分类号： B41J2/1628 , B41J2/1603 , B41J2/1623 , B41J2/1629 , B41J2/1631 , B41J2/1642
摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.
摘要翻译：公开了一种用于打印机的打印头，其包括多个排出芯片单元。多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。打印头还包括多个支撑单元。多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。另外公开了一种组装打印头的方法。

3. 发明申请

US20110316930A1 MODULAR MICRO-FLUID EJECTION DEVICE 审中-公开
标题翻译：模块化微流体喷射装置
公开(公告)号：US20110316930A1
公开(公告)日：2011-12-29
申请号：US12825851
申请日：2010-06-29
申请人： Richard E. Corley , Michael J. Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
发明人： Richard E. Corley , Michael J. Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/145 , B21D53/76
CPC分类号： B41J2/15 , B41J2/155 , B41J2202/19 , Y10T29/49401
摘要： A modular micro-fluid ejection device includes a carrier frame supporting pluralities of micro-fluid ejection modules. Each of the modules has a plate of nozzles defining a plane. Adjacent nozzle plates are substantially coplanar and registered with one another across the entirety of the carrier frame. Methods to mount the modules to the frame include, first, temporarily mounting one module and then another, and then permanently mounting both with a durable adhesive. Manufacturing systems include suction devices to hold a first module in place on a fixture while later modules are suctioned and registered to each other. Once set in place, a carrier frame is commonly contacted to the modules and the suction to released. Adhesives between the frame and modules cause the modules to separate from the fixture and transfer to the frame. All remain properly registered upon transfer.
摘要翻译：模块化微流体喷射装置包括支撑多个微流体喷射模块的载体框架。每个模块具有限定平面的喷嘴板。相邻的喷嘴板基本上共面并且在整个载体框架上相互对准。将模块安装到框架上的方法包括：首先临时安装一个模块，然后临时安装一个模块，然后用耐用的粘合剂永久地安装两个模块。制造系统包括抽吸装置，以将第一模块保持在固定装置上的适当位置，而稍后模块被抽吸并彼此登记。一旦设置到位，通常将载体框架与模块接触并且抽吸被释放。框架和模块之间的粘合剂导致模块与夹具分离并传输到框架。转让后，所有人都保持妥善的登记。

4. 发明授权

US07018503B2 Manufacturing method for ink jet pen 有权
公开(公告)号：US07018503B2
公开(公告)日：2006-03-28
申请号：US10408543
申请日：2003-04-07
申请人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
发明人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
IPC分类号： B32B7/14
CPC分类号： B41J2/1607 , B41J2/14024 , B41J2/1601 , B41J2/1623 , B41J2002/14362 , B41J2202/20 , Y10T29/42 , Y10T29/49083 , Y10T29/4913 , Y10T29/49401
摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.

5. 发明授权

US06612032B1 Manufacturing method for ink jet pen 有权
标题翻译：喷墨笔的制造方法
公开(公告)号：US06612032B1
公开(公告)日：2003-09-02
申请号：US09495168
申请日：2000-01-31
申请人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
发明人： Ashok Murthy , Richard Earl Corley, Jr. , Kris Ann Reeves , Jeanne Marie Saldanha Singh , Paul Timothy Spivey
IPC分类号： B21D5376
CPC分类号： B41J2/1607 , B41J2/14024 , B41J2/1601 , B41J2/1623 , B41J2002/14362 , B41J2202/20 , Y10T29/42 , Y10T29/49083 , Y10T29/4913 , Y10T29/49401
摘要： The invention relates to a method for attaching a semiconductor chip to an ink jet pen body and improved construction techniques therefor. According to the method a first adhesive have a cure time greater than about 15 minutes is dispensed in a predetermined pattern in one or more chip pockets of an ink jet pen body. Beads containing a second adhesive are dispensed in two or more discrete locations around an inside perimeter of each chip pocket. A semiconductor chip having chip edges is attached to the second adhesive in each of the chip pockets and the first adhesive is cured using heat or radiation. Use of a dual adhesive system improves the alignment of the semiconductor chips relative to one another until the first adhesive is completely cured.
摘要翻译：本发明涉及一种将半导体芯片附着到喷墨笔体上的方法及其改进的施工技术。根据该方法，第一粘合剂具有大于约15分钟的固化时间以预定图案分配在喷墨笔体的一个或多个芯片袋中。包含第二粘合剂的珠粒分配在每个芯片袋的内周边周围的两个或更多个离散位置。具有芯片边缘的半导体芯片被附接到每个芯片槽中的第二粘合剂，并且第一粘合剂使用热或辐射固化。使用双粘合剂系统改善了半导体芯片相对于彼此的对准，直到第一粘合剂完全固化。

6. 发明授权

US08500242B2 Micro-fluid ejection head 失效
标题翻译：微流体喷头
公开(公告)号：US08500242B2
公开(公告)日：2013-08-06
申请号：US12974725
申请日：2010-12-21
申请人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
发明人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
IPC分类号： B41J2/145
CPC分类号： B41J2/155
摘要： A micro-fluid ejection head for a printer is disclosed. The micro-fluid ejection head comprises a plurality of printhead modules. Each of the plurality of printhead modules comprises an ejection chip for ejecting fluid. The micro-fluid ejection head further comprises a support frame to mount the plurality of printhead modules for creating a lengthy array of the plurality of printhead modules. The support frame is electrically coupled with the plurality of printhead modules for allowing the plurality of printhead modules to receive data and electrical power.
摘要翻译：公开了一种用于打印机的微流体喷射头。微流体喷射头包括多个打印头模块。多个打印头模块中的每一个包括用于喷射流体的喷射芯片。微流体喷射头还包括支撑框架以安装多个打印头模块，用于创建多个打印头模块的冗长阵列。支撑框架与多个打印头模块电耦合，以允许多个打印头模块接收数据和电力。

7. 发明授权

US08622524B2 Laminate constructs for micro-fluid ejection devices 有权
标题翻译：用于微流体喷射装置的层压结构
公开(公告)号：US08622524B2
公开(公告)日：2014-01-07
申请号：US12788462
申请日：2010-05-27
申请人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Richard Corley , Michael John Dixon , Jiandong Fang , Jeanne Marie Saldanha Singh
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B41J2/14 , B41J2/14072 , B41J2/1601 , B41J2/1623 , B41J2/1626 , B41J2/1632 , B41J2/1634 , B41J2/1643 , B41J2002/14419 , B41J2002/14491 , B41J2202/20 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/00014
摘要： A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-wiring layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.
摘要翻译：微流体喷射头具有排出流体的喷射芯片。它连接到层压结构。该结构具有垂直配置的布线层，其布置有诸如碳纤维层之类的非布线层。布线层的上部电连接到排出芯片。上层还可以直接在表面上或凹陷的口袋中支撑芯片的平面下表面。两者可以与管芯接合，例如具有二氧化硅或氮化硼的管芯接合。在芯片的供墨槽和层叠结构之间存在流体连接。硅砖或其他材料也可以与两者流体互连。塑料歧管任选地支撑层压结构并且可以流体地连接到它。层叠体的布线层考虑地面，功率和各种接合垫。其他构造层考虑了预浸料或核心FR4层。

8. 发明申请

US20120154486A1 Micro-Fluid Ejection Head 失效
标题翻译：微流体喷射头
公开(公告)号：US20120154486A1
公开(公告)日：2012-06-21
申请号：US12974725
申请日：2010-12-21
申请人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
发明人： Frank Anderson , Jiandong Fang , Jeanne Marie Saldanha Singh , Mike Dixon , Bryan McKinley , Samuel Sexton
IPC分类号： B41J2/145
CPC分类号： B41J2/155
摘要： A micro-fluid ejection head for a printer is disclosed. The micro-fluid ejection head comprises a plurality of printhead modules. Each of the plurality of printhead modules comprises an ejection chip for ejecting fluid. The micro-fluid ejection head further comprises a support frame to mount the plurality of printhead modules for creating a lengthy array of the plurality of printhead modules. The support frame is electrically coupled with the plurality of printhead modules for allowing the plurality of printhead modules to receive data and electrical power.
摘要翻译：公开了一种用于打印机的微流体喷射头。微流体喷射头包括多个打印头模块。多个打印头模块中的每一个包括用于喷射流体的喷射芯片。微流体喷射头还包括支撑框架以安装多个打印头模块，用于创建多个打印头模块的冗长阵列。支撑框架与多个打印头模块电耦合，以允许多个打印头模块接收数据和电力。

9. 发明申请

US20110318882A1 METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE 审中-公开
标题翻译：使用喷涂粘合剂粘合到刚性基板上的芯片运动限制方法
公开(公告)号：US20110318882A1
公开(公告)日：2011-12-29
申请号：US13168219
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： H01L21/50
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要翻译：提供了一种以适合于在喷墨打印头中制造加热器芯片的精确对准将芯片结合到晶片的方法。该方法包括将粘合剂组合物喷涂在基材的表面上，将至少一个芯片对准并固定到涂覆有粘合剂组合物的基材上，将涂覆有至少一个涂有粘合剂组合物的芯片的基材暴露于辐射和加热，并进行热压接。该方法使用包含热活化粘合剂和光致酸产生剂的喷涂可涂层粘合剂组合物。

10. 发明授权

US08785524B2 Spray coatable adhesive for bonding silicon dies to rigid substrates 有权
标题翻译：用于将硅模具粘合到刚性基材上的喷涂可涂层粘合剂
公开(公告)号：US08785524B2
公开(公告)日：2014-07-22
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： C08K5/06 , C08K5/07 , C08L63/02
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译：公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

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