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    • 4. 发明授权
    • Mechanical landing pad formed on the underside of a MEMS device
    • 机械着陆垫形成在MEMS器件的下侧
    • US06764936B2
    • 2004-07-20
    • US09912150
    • 2001-07-23
    • Michael J. DanemanBehrang BehinMeng-Hsiung Kiang
    • Michael J. DanemanBehrang BehinMeng-Hsiung Kiang
    • H01L2144
    • G02B26/085B81B3/0008B81B3/001B81B3/0051G02B26/0833G02B26/0841
    • A device having a landing pad structure on an underside of a device and method for fabricating same. The device is formed from a device layer with at least one landing pad protruding from an underside thereof. The landing pad is attached to the device layer by a plug passing through an opening in the device layer. The device may be attached to the device layer by one or more compliant flexures, which allow the device to rotate in and out of a plane defined by the device layer. The landing pads are fabricated by forming one or more vias through the device layer. An underlying sacrificial layer is then partially etched to form one or more depressions at locations corresponding to locations of the vias in the device layer. The vias and depressions are then filled with a landing pad material to form a structure having one or more landing pads protruding from an underside of the device layer. The sacrificial layer is subsequently removed to release the device. Particular embodiments of both methods may be applied to fabricating microelectromechanical systems (MEMS) especially MEMS mirrors. The various embodiments are well suited to use with silicon on insulator (SOI) substrates.
    • 一种在装置的下侧具有着陆垫结构的装置及其制造方法。 该装置由具有从其下侧突出的至少一个着陆板的装置层形成。 着陆垫通过穿过装置层中的开口的塞子附接到装置层。 该装置可以通过一个或多个柔顺的挠曲件附接到装置层,这允许装置在由装置层限定的平面内进出。 通过形成穿过器件层的一个或多个通孔来制造着陆焊盘。 然后将底层牺牲层部分地蚀刻以在对应于器件层中的通孔的位置的位置处形成一个或多个凹陷。 通孔和凹陷然后用着陆垫材料填充以形成具有从装置层的下侧突出的一个或多个着陆垫的结构。 随后去除牺牲层以释放该装置。 两种方法的特定实施例可以应用于制造微机电系统(MEMS),特别是MEMS镜。 各种实施例非常适合于与绝缘体上硅(SOI)衬底一起使用。
    • 6. 发明授权
    • Capacitive sensing scheme for digital control state detection in optical switches
    • 光开关中数字控制状态检测的电容感测方案
    • US06788520B1
    • 2004-09-07
    • US09724948
    • 2000-11-28
    • Behrang BehinMichael J. DanemanMeng-Hsiung KiangKam-Yin LauTimothy E. Beerling
    • Behrang BehinMichael J. DanemanMeng-Hsiung KiangKam-Yin LauTimothy E. Beerling
    • G02B2608
    • G02B6/358G02B6/3512G02B6/3546G02B6/357G02B6/359
    • Disclosed is an apparatus and method for detecting whether rotatable MEMS elements are in the “on” or “off” position. Embodiments of the invention have application in devices switches that employ mirrors that move between an “on” or “off” position, wherein they reflect light from an input fiber into an output fiber in the “on” position, and allow the light to pass in the “off” position. Electrodes are positioned in the device such that the mirrors are close to, and therefor capacitively coupled to, a different electrode depending on whether they are in the “on” or “off” position. This invention is especially useful for switches that already employ electrodes for electrostatic clamping of mirrors in one or more positions, since those same electrodes can be used both to electrostatically clamp the mirrors and to sense their position. The method described in this invention comprises sensing of the capacitance between the mirrors and the one or more electrodes used to clamp the mirrors in its one or more position in order to detect which of the positions the mirrors are clamped in. Furthermore, the magnitude of the capacitances can be monitored to detect improper clamping.
    • 公开了一种用于检测可旋转MEMS元件是处于“开”还是“关”位置的装置和方法。 本发明的实施例可应用于使用在“开”或“关”位置之间移动的反射镜的装置开关中,其中它们将来自输入光纤的光反射到处于“开”位置的输出光纤,并允许光通过 在“关”位置。 电极被定位在设备中,使得反射镜接近并因此电容耦合到不同的电极,这取决于它们是处于“开”还是“关”位置。 本发明对于已经使用用于在一个或多个位置中的反射镜的静电夹持的电极的开关特别有用,因为这些相同的电极可以用于静电夹紧反射镜并感测其位置。 本发明描述的方法包括检测反射镜之间的电容和用于将反射镜夹持在其一个或多个位置中的一个或多个电极,以便检测反射镜夹在哪一个位置。此外, 可以监控电容以检测不正确的夹紧。
    • 7. 发明授权
    • Mechanical landing pad formed on the underside of a MEMS device
    • 机械着陆垫形成在MEMS器件的下侧
    • US06586841B1
    • 2003-07-01
    • US09546432
    • 2000-04-10
    • Michael J. DanemanBehrang BehinMeng-Hsiung Kiang
    • Michael J. DanemanBehrang BehinMeng-Hsiung Kiang
    • H01L2940
    • G02B26/085B81B3/0008B81B3/001B81B3/0051G02B26/0833G02B26/0841
    • A device having a landing pad structure on an underside of a device and method for fabricating same. The device is formed from a device layer with at least one landing pad protruding from an underside thereof. The landing pad is attached to the device layer by a plug passing through an opening in the device layer. The device may be attached to the device layer by one or more compliant flexures, which allow the device to rotate in and out of a plane defined by the device layer. The landing pads are fabricated by forming one or more vias through the device layer. An underlying sacrificial layer is then partially etched to form one or more depressions at locations corresponding to locations of the vias in the device layer. The vias and depressions are then filled with a landing pad material to form a structure having one or more landing pads protruding from an underside of the device layer. The sacrificial layer is subsequently removed to release the device. Particular embodiments of both methods may be applied to fabricating microelectromechanical systems (MEMS) especially MEMS mirrors. The various embodiments are well suited to use with silicon on insulator (SOI) substrates.
    • 一种在装置的下侧具有着陆垫结构的装置及其制造方法。 该装置由具有从其下侧突出的至少一个着陆板的装置层形成。 着陆垫通过穿过装置层中的开口的塞子附接到装置层。 该装置可以通过一个或多个柔顺的挠曲件附接到装置层,这允许装置在由装置层限定的平面内进出。 通过形成穿过器件层的一个或多个通孔来制造着陆焊盘。 然后将底层牺牲层部分地蚀刻以在对应于器件层中的通孔的位置的位置处形成一个或多个凹陷。 通孔和凹陷然后用着陆垫材料填充以形成具有从装置层的下侧突出的一个或多个着陆垫的结构。 随后去除牺牲层以释放该装置。 两种方法的特定实施例可以应用于制造微机电系统(MEMS),特别是MEMS镜。 各种实施例非常适合于与绝缘体上硅(SOI)衬底一起使用。
    • 8. 发明授权
    • Maintaining the state of a MEMS device in the event of a power failure
    • 在电源故障的情况下保持MEMS器件的状态
    • US06514781B2
    • 2003-02-04
    • US09900841
    • 2001-07-07
    • Mark W. ChangScott D. DaltonMichael J. DanemanTimothy BeerlingStephen F. PanykoGary M. Zalewski
    • Mark W. ChangScott D. DaltonMichael J. DanemanTimothy BeerlingStephen F. PanykoGary M. Zalewski
    • H01L2100
    • G02B26/0841
    • A method and apparatus for maintaining the state of a MEMS device in the event of a power failure are disclosed. The apparatus and method may be used with a MEMS device generally having one or more MEMS elements moveably coupled to a substrate that uses electrostatic clamping force to sustain the state of the MEMS element. According to the method, a capacitive or other charge-storing circuit is coupled between a clamping surface and an electrical ground. During normal operation, a clamping voltage is applied between the clamping surface and at least one MEMS element to retain the at least one MEMS element against the clamping surface. In the event of a power failure, the source of the clamping voltage and other circuit paths to ground are isolated from the clamping surface. The charge-storing circuit maintains an electric charge on the clamping surface. Leaky circuit paths to ground may be isolated from the clamping surface by an isolator element configured to electrically isolate the clamping surface in the event of a power failure. The isolator element may include an opto-isolator or a low leakage diode.
    • 公开了一种用于在电源故障的情况下保持MEMS装置的状态的方法和装置。 该装置和方法可以与通常具有一个或多个MEMS元件的MEMS器件一起使用,所述MEMS元件可移动地耦合到使用静电夹持力来维持MEMS元件的状态的基板。 根据该方法,电容或其他电荷存储电路耦合在夹紧表面和电接地之间。 在正常操作期间,钳位电压施加在夹紧表面和至少一个MEMS元件之间以将至少一个MEMS元件保持抵靠夹紧表面。 在电源故障的情况下,钳位电压的来源和其他到地的电路路径与夹紧表面隔离。 电荷存储电路在夹持表面上保持电荷。 泄漏电路到地的路径可以通过隔离器元件与夹紧表面隔离,隔离器元件被配置为在电源故障的情况下电隔离夹紧表面。 隔离元件可以包括光隔离器或低泄漏二极管。
    • 9. 发明授权
    • Fabrication and controlled release of structures using etch-stop trenches
    • 使用蚀刻停止沟槽的结构的制造和控制释放
    • US06887391B1
    • 2005-05-03
    • US09712420
    • 2000-11-13
    • Michael J. DanemanBehrang Behin
    • Michael J. DanemanBehrang Behin
    • B81B3/00B81C1/00C23F1/00H01L21/311
    • B81C1/00571B81B2203/0136
    • MEMS structures may be formed on a substrate by forming a series trenches filled with etch-stop material in the device layer, followed by an isotropic etch of the device material stopping on the etch-stop material. This approach provides a controlled release method where the exact timing of the isotropic release etch becomes non-critical. Further, using this method, structures with significant topology may be fabricated while keeping the wafer topology to a minimum during processing until the very end of the process. Using the method of this invention, features with large topology may be formed while keeping the wafer topology to a minimum until the very end of the process.
    • MEMS结构可以通过在器件层中形成填充有蚀刻停止材料的串联沟槽,然后在蚀刻停止材料上停止的器件材料的各向同性蚀刻,在衬底上形成。 这种方法提供了一种控制释放方法,其中各向同性释放蚀刻的精确定时变得非关键。 此外,使用这种方法,可以制造具有显着拓扑结构的结构,同时在处理期间将晶片拓扑保持最小,直到过程的最后结束。 使用本发明的方法,可以形成具有大拓扑结构的特征,同时将晶片拓扑保持在最小状态,直到处理结束。