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    • 9. 发明申请
    • SEMICONDUCTOR DEVICE HAVING HIGH PERFORMANCE CHANNEL
    • 具有高性能通道的半导体器件
    • US20120223330A1
    • 2012-09-06
    • US13039441
    • 2011-03-03
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • Sarit DharSei-Hyung RyuLin ChengAnant Agarwal
    • H01L29/161H01L21/22
    • H01L29/107H01L21/225H01L29/1608H01L29/66068H01L29/66477H01L29/66568
    • Semiconductor devices having a high performance channel and method of fabrication thereof are disclosed. Preferably, the semiconductor devices are Metal-Oxide-Semiconductor (MOS) devices, and even more preferably the semiconductor devices are Silicon Carbide (SiC) MOS devices. In one embodiment, a semiconductor device includes a SiC substrate of a first conductivity type, a first well of a second conductivity type, a second well of the second conductivity type, and a surface diffused channel of the second conductivity type formed at the surface of semiconductor device between the first and second wells. A depth and doping concentration of the surface diffused channel are controlled to provide increased carrier mobility for the semiconductor device as compared to the same semiconductor device without the surface diffused channel region when in the on-state while retaining a turn-on, or threshold, voltage that provides normally-off behavior.
    • 公开了具有高性能通道的半导体器件及其制造方法。 优选地,半导体器件是金属氧化物半导体(MOS)器件,并且甚至更优选半导体器件是碳化硅(SiC)MOS器件。 在一个实施例中,半导体器件包括第一导电类型的SiC衬底,第二导电类型的第一阱,第二导电类型的第二阱以及形成在第二导电类型的表面处的第二导电类型的表面扩散沟道 半导体器件在第一和第二阱之间。 控制表面扩散通道的深度和掺杂浓度,以便在处于导通状态同时保持导通状态或阈值时,与没有表面扩散沟道区的相同半导体器件相比,为半导体器件提供增加的载流子迁移率, 电压提供常态动作。