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1. 发明申请

US20050199392A1 Method and apparatus for positioning a downhole tool 有权
标题翻译：用于定位井下工具的方法和装置
公开(公告)号：US20050199392A1
公开(公告)日：2005-09-15
申请号：US10796548
申请日：2004-03-09
申请人： Michael Connell , Stephen Tilghman
发明人： Michael Connell , Stephen Tilghman
IPC分类号： E21B47/04 , E21B47/00
CPC分类号： E21B47/044
摘要： A tool positioning assembly for positioning downhole tools at desired locations within a wellbore. The current invention further provides methods for using a tool positioning assembly. The tool positioning assembly and methods for using the same reduce the number of downhole trips required to perform downhole operations.
摘要翻译：一种用于将井下工具定位在井眼内的所需位置的工具定位组件。本发明还提供了使用工具定位组件的方法。工具定位组件及其使用方法减少了执行井下作业所需的井下跳闸次数。

2. 发明授权

US07557337B2 Micro-lens configuration for small lens focusing in digital imaging devices 有权
标题翻译：微透镜配置用于小型透镜聚焦在数字成像设备中
公开(公告)号：US07557337B2
公开(公告)日：2009-07-07
申请号：US11257041
申请日：2005-10-25
申请人： Tongbi Jiang , Michael Connell , Jin Li
发明人： Tongbi Jiang , Michael Connell , Jin Li
IPC分类号： H01J3/14
CPC分类号： H01L27/14627 , B33Y80/00
摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.
摘要翻译：一种改进的图像传感器，其中由一个或多个微透镜组成的第一微透镜阵列位于空腔上方，使得入射光聚焦在图像传感器的光传感器上。第一微透镜阵列可以将入射光准直并聚焦到图像传感器的光传感器上，或者可以校准入射光并将其引导到第二微透镜阵列，然后将第二微透镜阵列聚焦到光传感器上。还提供了一种制造改进的图像传感器的方法，其中腔和第一微透镜阵列通过使用牺牲材料形成。

3. 发明申请

US20060038112A1 Micro-lens configuration for small lens focusing in digital imaging devices 有权
公开(公告)号：US20060038112A1
公开(公告)日：2006-02-23
申请号：US11257039
申请日：2005-10-25
申请人： Tongbi Jiang , Michael Connell , Jin Li
发明人： Tongbi Jiang , Michael Connell , Jin Li
IPC分类号： H01L27/00
CPC分类号： H01L27/14627 , B33Y80/00
摘要： An improved image sensor wherein a first micro-lens array comprised of one or more micro-lenses is positioned over a cavity such that incoming light is focused on the photo sensors of the image sensor. The first micro-lens array may collimate and focus incoming light onto the photo sensors of the image sensor, or may collimate incoming light and direct it to a second micro-lens array which then focuses the light onto the photo sensors. A method of fabricating the improved image sensor is also provided wherein the cavity and first micro-lens array are formed by use of a sacrificial material.

4. 发明申请

US20060042792A1 Methods and apparatus for locating a lateral wellbore 审中-公开
标题翻译：用于定位侧井眼的方法和装置
公开(公告)号：US20060042792A1
公开(公告)日：2006-03-02
申请号：US10924673
申请日：2004-08-24
申请人： Michael Connell
发明人： Michael Connell
IPC分类号： E21B47/00 , E21B43/32
CPC分类号： E21B41/0035 , E21B23/002
摘要： The present invention relates generally to lateral wellbore operations, and more particularly, to downhole tools that include a logging tool for locating a lateral wellbore and associated methods. In some embodiments, the present invention discloses a method for use in lateral wellbore operations that includes entering a lateral wellbore from a primary wellbore with a tool comprising a logging tool, and verifying entry into the lateral wellbore using the logging tool. In yet other embodiments, the present invention discloses methods of locating lateral wellbores from a primary wellbore, and downhole tools that comprise logging tools, such as casing collar locators, radiation detection logging tools, or combinations thereof.
摘要翻译：本发明一般涉及侧井眼操作，更具体地涉及井下工具，其包括用于定位侧井筒的测井工具和相关联的方法。在一些实施例中，本发明公开了一种在侧井眼操作中使用的方法，其包括使用包括测井工具的工具从主井眼输入侧井筒，并使用测井工具验证进入侧井筒。在其他实施例中，本发明公开了从主井筒定位侧向井筒的方法，以及包括测井工具的井下工具，例如套管定位器，辐射检测测井工具或其组合。

5. 发明授权

US06995442B2 Total internal reflection (TIR) CMOS imager 有权
公开(公告)号：US06995442B2
公开(公告)日：2006-02-07
申请号：US10757589
申请日：2004-01-15
申请人： Tongbi Jiang , Michael Connell , Jin Li
发明人： Tongbi Jiang , Michael Connell , Jin Li
IPC分类号： H01L31/0232 , H01L21/00
CPC分类号： H01L27/14625 , H01L27/14621 , H01L27/14623 , H01L27/14643 , H01L27/14685
摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.

6. 发明申请

US20050248151A1 Coiled tubing connector 有权
标题翻译：卷管连接器
公开(公告)号：US20050248151A1
公开(公告)日：2005-11-10
申请号：US10841067
申请日：2004-05-07
申请人： Michael Connell
发明人： Michael Connell
IPC分类号： E21B17/04 , F16L13/14 , F16L33/20 , F16L55/00
CPC分类号： F16L13/141 , E21B17/04 , F16L33/20 , Y10T29/49913
摘要： A tubing connector comprising a rigid member having a first end and a second end; a crimping groove disposed about the rigid member; and a sleeve fixably attached to the rigid member and covering the crimping groove. A method for connecting a tubing section to a rigid member, the method comprising fixably attaching a sleeve over one end of the rigid member to cover a crimping groove disposed on the rigid member, disposing the tubing section over the sleeve, and plastically deforming the tubing section and sleeve to form a plurality of dimples that project into the crimping groove of the rigid member.
摘要翻译：一种管连接器，包括具有第一端和第二端的刚性构件; 围绕所述刚性构件设置的压接槽; 以及可固定地附接到刚性构件并覆盖压接槽的套筒。一种用于将管道部分连接到刚性构件的方法，所述方法包括将套筒固定地附接在刚性构件的一端上以覆盖设置在刚性构件上的压接槽，将管道部分设置在套筒上，并使管道塑性变形部分和套筒以形成突出到刚性构件的压接槽中的多个凹坑。

7. 发明申请

US20060170760A1 Method and apparatus for managing and distributing audio/video content 审中-公开
标题翻译：用于管理和分发音频/视频内容的方法和装置
公开(公告)号：US20060170760A1
公开(公告)日：2006-08-03
申请号：US11145620
申请日：2005-06-06
申请人： Tazwell Anderson , Michael Connell
发明人： Tazwell Anderson , Michael Connell
IPC分类号： H04N7/14
CPC分类号： H04N7/17318 , H04N7/181 , H04N21/21805 , H04N21/8133 , H04N21/84
摘要： A video content distribution and management system is provided that comprises an event content recorder recording video content associated with an event as an event recording. A workstation stores and edits the event recording to form a composite event review file that is passed to a system manager over a restricted access network. The workstation is located remote from a system manager. The system manager automatically routes the composite event review file to the workstation which enables a user to designate a video segment from the composite event review file. The workstation forms a video clip from the video segment and enables the user to add annotation information to the video clip to form an annotated video clip. The workstation conveys the annotated video clip to the system manager for redistribution.
摘要翻译：提供了一种视频内容分发和管理系统，其包括事件内容记录器，记录与事件相关联的视频内容作为事件记录。工作站存储和编辑事件记录，以形成复合事件审查文件，该文件通过受限访问网络传递给系统管理员。工作站位于远离系统管理器的位置。系统管理器自动将复合事件审查文件路由到工作站，使工作站能够从复合事件审查文件中指定视频段。工作站从视频段形成视频剪辑，并使用户能够向视频剪辑添加注释信息，以形成一个带注释的视频剪辑。工作站将注释的视频剪辑传送到系统管理器进行重新分配。

8. 发明申请

US20060159947A1 Fabrication of stacked microelectronic devices 有权
公开(公告)号：US20060159947A1
公开(公告)日：2006-07-20
申请号：US11386208
申请日：2006-03-22
申请人： Michael Connell , Tongbi Jiang
发明人： Michael Connell , Tongbi Jiang
IPC分类号： H01L21/44 , H01L21/50
CPC分类号： H01L21/6836 , H01L21/6835 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2221/68322 , H01L2221/68327 , H01L2224/274 , H01L2224/29007 , H01L2224/32014 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/8385 , H01L2225/0651 , H01L2225/06575 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/07802 , H01L2924/14 , Y10S438/976 , Y10T156/1082 , Y10T156/1092 , Y10T428/12535 , Y10T428/1443 , Y10T428/1457 , Y10T428/1471 , Y10T428/1495 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

9. 发明授权

US07037756B1 Stacked microelectronic devices and methods of fabricating same 有权
标题翻译：堆叠的微电子器件及其制造方法
公开(公告)号：US07037756B1
公开(公告)日：2006-05-02
申请号：US10369849
申请日：2003-02-19
申请人： Tongbi Jiang , Michael Connell
发明人： Tongbi Jiang , Michael Connell
IPC分类号： H01L21/50
CPC分类号： H01L24/32 , H01L24/33 , H01L25/0657 , H01L25/50 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73265 , H01L2224/8592 , H01L2225/0651 , H01L2225/06575 , H01L2225/06582 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/01087 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Certain methods of the invention permit spacerless manufacture of stacked microelectronic devices by mechanically supporting a second microelectronic component with a wire coating. This wire coating may be sufficiently adhesive to also mechanically bond the second microelectronic component to a first microelectronic component. Other embodiments of the invention provide spacerless stacked microelectronic devices wherein a second microelectronic component is mechanically supported by a wire coating.
摘要翻译：本发明的某些方法允许通过机械地支撑具有线涂层的第二微电子部件来不间断地制造堆叠的微电子器件。该线涂层可以是足够的粘合剂，以将第二微电子部件机械地结合到第一微电子部件。本发明的其它实施例提供了无间隔堆叠的微电子器件，其中第二微电子部件由线涂机械地支撑。

10. 发明授权

US07001795B2 Total internal reflection (TIR) CMOS imager 有权
标题翻译：全内反射（TIR）CMOS成像仪
公开(公告)号：US07001795B2
公开(公告)日：2006-02-21
申请号：US10373785
申请日：2003-02-27
申请人： Tongbi Jiang , Michael Connell , Jin Li
发明人： Tongbi Jiang , Michael Connell , Jin Li
IPC分类号： H01L21/00 , H01L31/0232
CPC分类号： H01L27/14625 , H01L27/14621 , H01L27/14623 , H01L27/14643 , H01L27/14685
摘要： The subject invention is directed to use of photoconductors as conductors of light to photo diodes in a CMOS chip, wherein said photoconductors are separated by at least one low refractive index material (i.e. air). The present invention offers advantages over previous CMOS imaging technology, including enhanced light transmission to photo diodes. The instant methods for producing a CMOS imaging device and CMOS imager system involve minimal power loss. Since no lens is required, the invention eliminates concerns about radius limitation and about damaging lenses during die attach, backgrind, and mount. The invention also provides little or no cross talk between photo diodes.
摘要翻译：本发明涉及使用光电导体作为CMOS芯片中的光导体的光导体，其中所述光导体由至少一种低折射率材料（即空气）分开。本发明提供了优于先前CMOS成像技术的优点，包括对光电二极管的增强的光传输。用于制造CMOS成像装置和CMOS成像器系统的即时方法涉及最小的功率损耗。由于不需要镜头，本发明消除了对于半径限制以及关于在芯片附着，后研磨和安装期间损坏的透镜的担忧。本发明还提供了很少或没有光二极管之间的串扰。

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