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1. 发明申请

US20060250781A1 Electronic module and method for the production thereof 有权
公开(公告)号：US20060250781A1
公开(公告)日：2006-11-09
申请号：US10562252
申请日：2004-06-04
申请人： Michael Bauer , Wolfram Eurskens , Rudolf Kerter , Heinz Pape , Peter Strobe , Stephan Stoeckl
发明人： Michael Bauer , Wolfram Eurskens , Rudolf Kerter , Heinz Pape , Peter Strobe , Stephan Stoeckl
IPC分类号： H05K1/09
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/15192 , H01L2924/15311 , H05K1/0284 , H05K3/105 , H05K3/46 , H05K2201/0215 , H05K2201/0257 , H05K2201/0919 , H05K2201/10446 , H05K2203/102 , H05K2203/108 , H05K2203/1131 , H05K2203/1136
摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.

2. 发明授权

US07602614B2 Electronic module and method for the production thereof 有权
标题翻译：电子模块及其制造方法
公开(公告)号：US07602614B2
公开(公告)日：2009-10-13
申请号：US10562252
申请日：2004-06-04
申请人： Michael Bauer , Wolfram Eurskens , Rudolf Kerler , Heinz Pape , Peter Strobel , Stephan Stoeckl
发明人： Michael Bauer , Wolfram Eurskens , Rudolf Kerler , Heinz Pape , Peter Strobel , Stephan Stoeckl
IPC分类号： H05K7/00
CPC分类号： H05K1/184 , H01L2224/16227 , H01L2224/16235 , H01L2224/48227 , H01L2224/73207 , H01L2225/0651 , H01L2225/06517 , H01L2225/06572 , H01L2924/15192 , H01L2924/15311 , H05K1/0284 , H05K3/105 , H05K3/46 , H05K2201/0215 , H05K2201/0257 , H05K2201/0919 , H05K2201/10446 , H05K2203/102 , H05K2203/108 , H05K2203/1131 , H05K2203/1136
摘要： An electronic module and a method for the production thereof is disclosed. In one embodiment, the electronic module has a plurality of components arranged on a wiring block. The wiring block has a plurality of outer sides and has in its volume lines interconnecting contact pads on the outer sides. The contact pads are electrically connected to component connections of the components.
摘要翻译：公开了电子模块及其制造方法。在一个实施例中，电子模块具有布置在接线块上的多个部件。布线块具有多个外侧，并且其体积线将外侧的接触焊盘互连。接触垫电连接到部件的部件连接。

3. 发明授权

US07276785B2 Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof 有权
标题翻译：具有要分割的电子模块的电子模块，面板及其制造方法
公开(公告)号：US07276785B2
公开(公告)日：2007-10-02
申请号：US10934549
申请日：2004-09-07
申请人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
发明人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
IPC分类号： H01L23/02
CPC分类号： H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
摘要翻译：本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接，其布置在组件层之间并连接到未覆盖区域。此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

4. 发明申请

US20050052830A1 Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof 有权
标题翻译：具有要分割的电子模块的电子模块，面板及其制造方法
公开(公告)号：US20050052830A1
公开(公告)日：2005-03-10
申请号：US10934549
申请日：2004-09-07
申请人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
发明人： Michael Bauer , Wolfram Eurskens , Gerold Gruendler , Rudolf Kerler , Heinz Pape , Peter Strobel
IPC分类号： H01L25/065 , H01L25/16 , H05K5/00
CPC分类号： H01L24/97 , H01L25/0652 , H01L25/16 , H01L2224/48091 , H01L2224/48465 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01052 , H01L2924/01057 , H01L2924/01068 , H01L2924/01075 , H01L2924/01082 , H01L2924/12041 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.
摘要翻译：本发明涉及一种具有电子部件的电子模块，它们以垂直交错的部件层布置，它们通过接触凸块或接合连接件和通孔互连件在各个部件层内未被覆盖的区域彼此导电连接，其布置在组件层之间并连接到未覆盖区域。此外，本发明涉及一种用于制造电子模块的方法，无论是在面板中还是作为单独的部件。

5. 发明授权

US06215171B1 IC module 有权
标题翻译： IC模块
公开(公告)号：US06215171B1
公开(公告)日：2001-04-10
申请号：US09477443
申请日：2000-01-04
申请人： Heinz Pape
发明人： Heinz Pape
IPC分类号： H01L2900
CPC分类号： H01L25/16 , H01L23/50 , H01L24/45 , H01L24/48 , H01L2224/45144 , H01L2224/48471 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/13091 , H01L2924/14 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： An IC module has one or more integrated circuits and a package surrounding them. The IC module is distinguished by one or more additional electronic components being accommodated inside the package, in the immediate vicinity of the integrated circuit.
摘要翻译： IC模块具有一个或多个集成电路和围绕它们的封装。集成电路模块的特征在于一个或多个附加的电子元件被容纳在封装内，紧靠在集成电路附近。

6. 发明授权

US5982028A Semiconductor device with good thermal behavior 失效
标题翻译：半导体器件具有良好的热性能
公开(公告)号：US5982028A
公开(公告)日：1999-11-09
申请号：US608491
申请日：1996-02-28
申请人： Heinz Pape , Frank Hubrich
发明人： Heinz Pape , Frank Hubrich
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2224/83194 , H01L24/48 , H01L24/73 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/181
摘要： One embodiment of a semiconductor device includes a semiconductor chip having long sides. A system carrier is connected to the semiconductor chip and has an island. The island has an opening formed centrally therein over a large area. The opening is wider than the semiconductor chip on two of the long sides of the semiconductor chip. Another embodiment of a semiconductor device includes a semiconductor chip having corner regions. A system carrier is connected to the semiconductor chip and has an island with an opening formed therein. The semiconductor chip is joined to the island only in the corner regions.
摘要翻译：半导体器件的一个实施例包括具有长边的半导体芯片。系统载体连接到半导体芯片并具有岛。该岛具有大面积中央形成的开口。开口比半导体芯片的两个长边上的半导体芯片宽。半导体器件的另一实施例包括具有拐角区域的半导体芯片。系统载体连接到半导体芯片并且具有形成在其中的开口的岛。半导体芯片仅在拐角区域连接到岛上。

7. 发明授权

US07489023B2 Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device 有权
标题翻译：包括具有信号接触区域和供给接触区域的半导体芯片的半导体器件，以及用于制造半导体器件的方法
公开(公告)号：US07489023B2
公开(公告)日：2009-02-10
申请号：US11362509
申请日：2006-02-27
申请人： Heinz Pape
发明人： Heinz Pape
IPC分类号： H01L23/495
CPC分类号： H01L24/48 , H01L23/50 , H01L23/5286 , H01L24/05 , H01L24/06 , H01L24/45 , H01L24/49 , H01L2224/0401 , H01L2224/04042 , H01L2224/05551 , H01L2224/05552 , H01L2224/05554 , H01L2224/05556 , H01L2224/05639 , H01L2224/05644 , H01L2224/0603 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/48233 , H01L2224/48465 , H01L2224/48471 , H01L2224/48639 , H01L2224/48644 , H01L2224/48739 , H01L2224/4903 , H01L2224/49051 , H01L2224/4911 , H01L2224/73215 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/12041 , H01L2924/12044 , H01L2924/13091 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30107 , H01L2924/00 , H01L2224/48744 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.
摘要翻译：半导体器件包括半导体芯片，其中半导体芯片包括信号接触区域并提供接触区域。信号接触区域布置在半导体芯片的有源顶侧的边缘区域上，并且通过连接元件与半导体器件的外部信号外部连接电连接。半导体芯片的有源顶侧包括至少两个由环形图案化的金属箔制成的供电集合电极，它们设置在信号接触区域内并且以电绝缘的方式固定在顶侧上。供电集合电极通过内部连接元件电连接到半导体芯片的供电接触区域。

8. 发明授权

US5054032A Gas laser housing 失效
标题翻译：气体激光器
公开(公告)号：US5054032A
公开(公告)日：1991-10-01
申请号：US527873
申请日：1990-05-24
申请人： Hans Krueger , Wolfgang Welsch , Michael Schulz , Heinz Pape
发明人： Hans Krueger , Wolfgang Welsch , Michael Schulz , Heinz Pape
IPC分类号： H01S3/034
CPC分类号： H01S3/034
摘要： A gas laser housing having a housing and a metal cap attached thereto, includes a mirror mount attached to the metal cap. The mirror mount is provided with an annular region of reduced diameter affixed to the metal cap to absorb mechanical stresses and thereby prevents stress crack corrosion at the circumference of the housing tube.
摘要翻译：具有附接到其上的壳体和金属盖的气体激光器壳体包括附接到金属盖的反射镜安装座。反射镜安装件设置有缩小的直径的环形区域，固定到金属盖上以吸收机械应力，从而防止壳体管周围的应力裂纹腐蚀。

9. 发明授权

US4382272A Colored lamp 失效
标题翻译：彩色灯
公开(公告)号：US4382272A
公开(公告)日：1983-05-03
申请号：US201555
申请日：1980-10-28
申请人： Ferdinand Quella , Heinz Pape
发明人： Ferdinand Quella , Heinz Pape
IPC分类号： G09F13/22 , F21K2/00 , F21V9/16 , G09F13/04 , G09F13/20
CPC分类号： F21K2/00 , F21V9/16 , G09F13/20 , G09F2013/0472
摘要： A colored lamp is emitting colored light of a given range of wavelengths and particularly useful for interior and exterior lighting, for luminous advertising, for street lighting, for signal lights and for decorations characterized by a source of light and an arrangement for absorbing a light wave spectrum which has a shorter wavelength than the given range and for emitting light with a longer wavelength due to photo-luminescence with the arrangements including at least one body provided with a luminescent substance for absorbing the light and emitting the luminescent light. The body may be formed by a container of liquid, a bundle of optical fibers or a solid member which acts as a light concentrator in such a manner that the incident light is collected and conducted by means of a photo-luminescent scattering and subsequent total reflection at the boundary surfaces of the body, with the luminescent light being emitted in specific output locations.
摘要翻译：彩色灯泡正在发射给定波长范围的彩色光，特别适用于内部和外部照明，用于发光广告，街道照明，信号灯以及以光源为特征的装饰和用于吸收光波的装置光谱具有比给定范围更短的波长并且由于光发光而发射具有较长波长的光，其中所述布置包括至少一个设置有用于吸收光并发出发光的发光物质的主体。主体可以由液体容器，一束光纤或固体部件形成，其作为光集中器，使得入射光通过光致发光散射和随后的全反射被收集和传导在身体的边界表面，发光在特定的输出位置发射。

10. 发明授权

US4298802A Method and device for collecting light utilizing a light trap 失效
标题翻译：利用光阱收集光的方法和装置
公开(公告)号：US4298802A
公开(公告)日：1981-11-03
申请号：US125496
申请日：1980-02-28
申请人： Ferdinand Quella , Heinz Pape
发明人： Ferdinand Quella , Heinz Pape
IPC分类号： G02B6/00 , F21K2/00 , G02B6/42 , G02F1/13357 , H01L31/055 , H05B33/00 , G01J1/58
CPC分类号： G02F1/133617 , F21K2/00 , G02B6/4298 , H01L31/055 , Y02E10/52
摘要： A method and a device for collecting light characterized by a body which acts as a light trap, contains at least two different groups of fluorescent particles with each group having an absorption range and light emitting range which are different from the other groups, and has at least one light decoupling window to emit the fluorescent light therefrom.
摘要翻译：用于收集以物体为特征的光的方法和装置，其特征在于作为光阱的物体，其包含至少两个不同组的荧光颗粒，每组具有与其它组不同的吸收范围和发光范围，并具有至少一个光去耦窗口从其发射荧光。

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