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    • 7. 发明授权
    • Adjustment of Josephson junctions by ion implantation
    • 通过离子注入调整约瑟夫逊结
    • US4490901A
    • 1985-01-01
    • US491944
    • 1983-05-05
    • Gregory J. ClarkRobert E. DrakeStanley I. Raider
    • Gregory J. ClarkRobert E. DrakeStanley I. Raider
    • H01L39/24H01L39/22H01L21/265
    • H01L39/2493Y10S505/922
    • A method for trimming the zero voltage Josephson current of a tunnel junction including the steps of measuring the I-V characteristics of the completed junctions to quantify the change in I.sub.o necessary to meet the design requirements, placing the tested Josephson junctions on a metal block which is mounted in the sample chamber of an ion implanter structure which is pumped to 1.10.sup.-6 Torr. The junctions, kept at room temperature and oriented at a direction nearly normal to the ion beam, are implanted with magnetically analyzed ions of energies 50 keV to 2300 keV. Spatial uniformity of the ion implant beam is .+-.2% over a sample. Uniform spatial implantation over a large area sample is obtained by either sweeping of the beam across the sample, or restoring the sample through a stationary beam, determining the required ion dose to effect trimming from calibration curves, remeasuring the I-V characteristics after implantation to confirm that the required I.sub.o trim was effected, and then completing the fabrication of the Josephson device according to standard processing.
    • 一种用于修整隧道结的零电压约瑟夫森电流的方法,包括以下步骤:测量完整结点的IV特性,以量化满足设计要求所必需的Io的变化,将测试的约瑟夫逊结放置在安装的金属块上 在离子注入机结构的样品室中泵送到1.10-6乇。 在室温下保持并且以几乎垂直于离子束的方向取向的结,用能量为50keV至2300keV的磁分析离子注入。 离子注入光束的空间均匀性比样品高+/- 2%。 通过扫描样品上的束或者通过静止光束恢复样品,确定所需的离子剂量以实现校准曲线的修剪,重新测量植入后的IV特性以确认 实现所需的修整,然后根据标准处理完成约瑟夫逊装置的制造。
    • 8. 发明授权
    • Soft probe for providing high speed on-wafer connections to a circuit
    • 软探针,用于提供与电路的高速晶圆连接
    • US4894612A
    • 1990-01-16
    • US249101
    • 1988-09-23
    • Robert E. DrakeSadeg M. FarisRoy M. PattZhi-Yuan Shen
    • Robert E. DrakeSadeg M. FarisRoy M. PattZhi-Yuan Shen
    • G01R1/067G01R1/073
    • G01R1/06772G01R1/07342
    • Miniature soft probes are used to provide a high speed connection to circuits on a wafer. The probe contains a co-planar line on a soft substrate which provides a flexibility for secure contacts. A miniature coaxial line is directly connected to the coplanar line with a zero degree angle. This configuration makes the probe very small and result in high performance. A planar link between two ground planes eliminates any unwanted odd mode. The probes have high speed and wideband transmission lines with interfaces which have speed in the picoseconds and bandwidths in the hundreds of gigahertz. The probes have multi-functional capabilities, such as high impedance buffering and DC blocking, due to printed circuits which constitute a portion of the probe. The printed circuits are produced by a thin film photolithic process. These probes are best suited for on-wafer tests, diagnostics and measurements as well as interfacing on-wafer circuits with other electronic or electro-optical systems.
    • 微型软探头用于提供与晶片上电路的高速连接。 探针在柔性衬底上包含一个共面线,为安全接触提供了灵活性。 微型同轴线直接连接到零角度的共面线上。 该配置使得探头非常小并且导致高性能。 两个接地平面之间的平面连接消除了任何不想要的奇数模式。 这些探头具有高速和宽带传输线,其接口具有皮秒的速度和数百千兆赫兹的带宽。 由于构成探头的一部分的印刷电路,探头具有多功能功能,例如高阻抗缓冲和直流阻塞。 印刷电路通过薄膜光刻工艺制造。 这些探头最适用于晶圆上的测试,诊断和测量,以及与其他电子或电光系统的晶圆上电路接口。