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1. 发明授权

US08389119B2 Composite thermal interface material including aligned nanofiber with low melting temperature binder 有权
公开(公告)号：US08389119B2
公开(公告)日：2013-03-05
申请号：US11881746
申请日：2007-07-26
申请人： Matthew Panzer , Kenneth E. Goodson , Xuejiao Hu , David Mann
发明人： Matthew Panzer , Kenneth E. Goodson , Xuejiao Hu , David Mann
IPC分类号： H01L23/373 , H01L23/42
CPC分类号： B32B37/02 , B32B2038/0092 , B32B2309/02 , B32B2309/105 , B32B2311/00 , B32B2313/04 , B82Y10/00 , B82Y30/00 , H01L23/373 , H01L2924/0002 , Y10T428/14 , Y10T428/24124 , Y10T428/24132 , Y10T428/24174 , Y10T428/249927 , Y10T428/30 , H01L2924/00
摘要： A thermal interface material includes a mechanically compliant vertically aligned nanofiber film and a binder material for joining the nanofibers of the film to the surfaces of two substrates. Preferably, the binder material comprises a non-hydrocarbon-based material such as a metallic eutectic with a melting temperature below a nanofiber thermal damage threshold temperature of the film. The film is grown on a substrate which is then bonded to another substrate by the binder material in an adhesion process that may include pressure and heat. Alternatively, the film may be released from the substrate to produce a stand-alone thermal tape which may later be placed between two substrates and bonded.

2. 发明申请

US20090068387A1 Composite thermal interface material including aligned nanofiber with low melting temperature binder 有权
标题翻译：复合热界面材料包括具有低熔点粘合剂的排列的纳米纤维
公开(公告)号：US20090068387A1
公开(公告)日：2009-03-12
申请号：US11881746
申请日：2007-07-26
申请人： Matthew Panzer , Kenneth E. Goodson , Xuejiao Hu , David Mann
发明人： Matthew Panzer , Kenneth E. Goodson , Xuejiao Hu , David Mann
IPC分类号： B32B7/00 , B32B37/00
CPC分类号： B32B37/02 , B32B2038/0092 , B32B2309/02 , B32B2309/105 , B32B2311/00 , B32B2313/04 , B82Y10/00 , B82Y30/00 , H01L23/373 , H01L2924/0002 , Y10T428/14 , Y10T428/24124 , Y10T428/24132 , Y10T428/24174 , Y10T428/249927 , Y10T428/30 , H01L2924/00
摘要： A thermal interface material includes a mechanically compliant vertically aligned nanofiber film and a binder material for joining the nanofibers of the film to the surfaces of two substrates. Preferably, the binder material comprises a non-hydrocarbon-based material such as a metallic eutectic with a melting temperature below a nanofiber thermal damage threshold temperature of the film. The film is grown on a substrate which is then bonded to another substrate by the binder material in an adhesion process that may include pressure and heat. Alternatively, the film may be released from the substrate to produce a stand-alone thermal tape which may later be placed between two substrates and bonded.
摘要翻译：热界面材料包括机械顺应的垂直排列的纳米纤维膜和用于将膜的纳米纤维连接到两个基底的表面的粘合剂材料。优选地，粘合剂材料包括非烃基材料，例如熔融温度低于膜的纳米纤维热损伤阈值温度的金属共晶。该膜在基材上生长，然后通过粘合剂材料在可能包括压力和热量的粘附过程中将其粘合到另一个基材上。或者，膜可以从基底释放以产生可以稍后放置在两个基底之间并结合的独立的热带。

3. 发明授权

US07504453B2 Composite thermal interface material including particles and nanofibers 有权
标题翻译：复合热界面材料包括颗粒和纳米纤维
公开(公告)号：US07504453B2
公开(公告)日：2009-03-17
申请号：US11015218
申请日：2004-12-17
申请人： Xuejiao Hu , Linan Jiang , Kenneth E. Goodson
发明人： Xuejiao Hu , Linan Jiang , Kenneth E. Goodson
IPC分类号： C08K3/04
CPC分类号： B82Y30/00 , C08K7/02 , C08K2201/011 , Y10S977/773 , Y10S977/776 , Y10S977/813
摘要： A thermal interface material (TIM) including a mechanically compliant matrix material which contains thermally conductive particles and thermally conductive nanofibers is provided. Such a TIM provides enhanced thermal conductivity without excessive viscosity when the nanofiber volume concentration is above a threshold value for enhanced thermal conductivity.
摘要翻译：提供了包含导热颗粒和导热纳米纤维的机械柔性基质材料的热界面材料（TIM）。当纳米纤维体积浓度高于阈值以提高导热性时，这种TIM提供增强的导热性而不会过多的粘度。

4. 发明授权

US08084856B2 Thermal spacer for stacked die package thermal management 有权
标题翻译：用于堆叠管芯封装热管理的隔离层
公开(公告)号：US08084856B2
公开(公告)日：2011-12-27
申请号：US12748214
申请日：2010-03-26
申请人： Xuejiao Hu
发明人： Xuejiao Hu
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L25/0657 , H01L24/32 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06575 , H01L2225/06589 , H01L2924/14 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： In some embodiments, a thermal spacer for stacked die package thermal management is presented. In this regard, an apparatus is introduced having a top integrated circuit die, a bottom integrated circuit die, and a thermal spacer between the top and bottom integrated circuit dice, the thermal spacer comprising a heat conducting material and the thermal spacer overhanging and extending parallel with one outside edge of the bottom integrated circuit die. Other embodiments are also disclosed and claimed.
摘要翻译：在一些实施例中，提出了用于堆叠管芯封装热管理的热隔离件。在这方面，引入了一种装置，其具有顶部集成电路管芯，底部集成电路管芯和顶部和底部集成电路管芯之间的热隔离件，该热隔离件包括导热材料和热隔离件，其突出并平行延伸具有底部集成电路裸片的一个外部边缘。还公开并要求保护其他实施例。

5. 发明授权

US08054629B2 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US08054629B2
公开(公告)日：2011-11-08
申请号：US12286708
申请日：2008-09-30
申请人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20 , F28F7/00 , H01L23/34
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

6. 发明申请

US20100079955A1 Microfins for cooling an ultramobile device 有权
标题翻译：用于冷却超移动装置的微烯烃
公开(公告)号：US20100079955A1
公开(公告)日：2010-04-01
申请号：US12286708
申请日：2008-09-30
申请人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

7. 发明申请

US20110277980A1 MICROFINS FOR COOLING AN ULTRAMOBILE DEVICE 有权
标题翻译：用于冷却超声波装置的微晶
公开(公告)号：US20110277980A1
公开(公告)日：2011-11-17
申请号：US13189389
申请日：2011-07-22
申请人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
发明人： Zhihua Li , Cheng-Chieh Hsieh , Xuejiao Hu , Hakan Erturk , George Chen
IPC分类号： F28F7/00
CPC分类号： H05K7/20418 , H01L23/3677 , H01L23/373 , H01L23/3733 , H01L23/3735 , H01L23/3737 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： The present invention discloses a method of cooling an ultramobile device with microfins attached to an external wall of an enclosure surrounding the ultramobile device.
摘要翻译：本发明公开了一种用连接到围绕超移动装置的外壳的外壁的微结构冷却超移动装置的方法。

8. 发明申请

US20100169027A1 Analytical Equipment Enclosure Incorporating Phase Changing Materials 有权
标题翻译：分析设备外壳并入相变材料
公开(公告)号：US20100169027A1
公开(公告)日：2010-07-01
申请号：US12347368
申请日：2008-12-31
申请人： Xuejiao Hu , Alfred Feitisch
发明人： Xuejiao Hu , Alfred Feitisch
IPC分类号： G01N21/59 , G01K11/30
CPC分类号： G01N21/39 , G01N2201/022 , G01N2201/023 , G01N2201/0231
摘要： Thermally controlled enclosures that can be used with gas analyzers are described. The enclosures incorporate one or more phase changing materials that buffer ambient and internal heat loads to reduce the power consumption demand of mechanical or electronic heating apparatus. Maintenance of gas analyzer equipment at a consistent temperature can be important to achieving stable and reproducible results. Related systems, apparatus, methods, and/or articles are also described.
摘要翻译：描述了可用于气体分析仪的热控制外壳。外壳采用缓冲环境和内部热负荷的一种或多种相变材料，以减少机械或电子加热设备的功耗需求。在一致的温度下维护气体分析仪设备对于获得稳定和可重现的结果是重要的。还描述了相关系统，装置，方法和/或制品。

9. 发明申请

US20090004317A1 HIGH THERMAL CONDUCTIVITY MOLDING COMPOUND FOR FLIP-CHIP PACKAGES 审中-公开
标题翻译：用于卷芯片包装的高热导率模塑料
公开(公告)号：US20090004317A1
公开(公告)日：2009-01-01
申请号：US11772200
申请日：2007-06-30
申请人： Xuejiao Hu , Leonel R. Arana , Robert M. Nickerson , Rahul N. Manepalli , Dingying Xu
发明人： Xuejiao Hu , Leonel R. Arana , Robert M. Nickerson , Rahul N. Manepalli , Dingying Xu
IPC分类号： B28B5/00 , C09K5/00
CPC分类号： C09K5/14
摘要： A molding compound for use in an integrated circuit package comprises an epoxy and a thermally conductive filler material. The thermally conductive filler material comprises between 70% and 95% of the molding compound and has a thermal conductivity between 10 W/m-K and 3000 W/m-K.
摘要翻译：用于集成电路封装的模塑料包括环氧树脂和导热填料。该导热填料包含70％至95％的模塑料，其导热率在10W / m-K至3000W / m-K之间。

10. 发明授权

US07579686B2 Thermal interface material with hotspot heat remover 有权
标题翻译：热界面材料与热点除热器
公开(公告)号：US07579686B2
公开(公告)日：2009-08-25
申请号：US11618593
申请日：2006-12-29
申请人： Xuejiao Hu , Chia-Pin Chiu
发明人： Xuejiao Hu , Chia-Pin Chiu
IPC分类号： H01L23/10 , H01L23/34
CPC分类号： H01L23/42 , H01L23/367 , H01L23/4275 , H01L2924/0002 , H01L2924/00
摘要： The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material is described. In one embodiment, the heat spreader includes a surface having a structure extending a distance outward therefrom. The thermal interface material includes a first region having a first thickness and a second region having a second thickness, the first thickness being smaller than the second thickness. The structure extending a distance outward from the heat spreader is positioned on the first region of the thermal interface material. The total of the first thickness of the thermal interface material and the distance the structure extends outward from the surface of the heat spreader is substantially the same as the second thickness. In one aspect of certain embodiments, the first region of the thermal interface material and the structure on the heat spreader are in alignment with a hot spot on the die. Other embodiments are described and claimed.
摘要翻译：描述了包括通过热界面材料耦合到管芯的散热器的电子组件的形成。在一个实施例中，散热器包括具有向外延伸一定距离的结构的表面。热界面材料包括具有第一厚度的第一区域和具有第二厚度的第二区域，第一厚度小于第二厚度。从散热器向外延伸一定距离的结构位于热界面材料的第一区域上。热界面材料的第一厚度和结构从散热器表面向外延伸的距离的总和基本上与第二厚度相同。在某些实施方案的一个方面，热界面材料的第一区域和散热器上的结构与模具上的热点对准。描述和要求保护其他实施例。

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