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1. 发明专利

JP2004290976A Method and device for applying adhesive 审中-公开
公开(公告)号：JP2004290976A
公开(公告)日：2004-10-21
申请号：JP2004198950
申请日：2004-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MIYAKE HIROYUKI , IKEDA OSAMU , SASAKI MASARU , INABA YUZURU , KINOU TOSHIYUKI
IPC分类号： B05D7/24 , B05C5/00 , B05C11/10 , B05D1/26
摘要： PROBLEM TO BE SOLVED: To improve a production efficiency of an electronic circuit board in a variety of aspects without jumboizing a device.
SOLUTION: A plurality of applicators 22, 23 having the identical application diameter are used in order to automatically apply an adhesive to a required position of an object 1 to which the adhesive is applied with application heads 7, 8 which can select and use a plurality of applicators 25-27 according to a predetermined program. The applicators 22, 23 having the identical application diameter are alternately used so that the number of uses within a range of specific units becomes identical among the applicators by making use of information of the program.
COPYRIGHT: (C)2005,JPO&NCIPI

2. 发明专利

JPH11276963A Device and method for viscous fluid application 失效
标题翻译： VISCOUS流体应用的装置和方法
公开(公告)号：JPH11276963A
公开(公告)日：1999-10-12
申请号：JP8731998
申请日：1998-03-31
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI MASARU , IIZUKA AKIRA , TERAYAMA EIICHIRO , INABA YUZURU
IPC分类号： H05K13/04 , B05C5/00 , B05C11/10
CPC分类号： B05C11/1034 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/92125 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a viscous fluid applying device and a method therefor in which a fixed applying diameter can be obtained with easy operation and tact loss is prevented from being produced, and moreover, the damage to the surface of a body to be coated can be reduced. SOLUTION: By rotating an adhesive agent applying member 2111 into which a screw part is inserted by a rotating device, a nozzle stopper 2114 provided on the adhesive agent applying member can be prevented from interfering with a wiring pattern of the surface of a circuit board. Furthermore, since when the adhesive agent applying member is rotated, the screw part is also rotated by being synchronized with it, the adhesive agent is prevented from being discharged from a nozzle due to the rotation of the adhesive agent applying member. Therefore, the applying diameter can be uniformalized. Moreover, since the rotation of the screw part is controlled according to the viscosity of the adhesive agent, applying with a desired applying diameter can be performed with easy operation.
摘要翻译：要解决的问题：提供一种粘性流体施加装置及其方法，其中可以容易地操作获得固定的施加直径，并且防止产生节拍损失，此外，对身体的表面的损害为涂层可以减少。解决方案：通过旋转通过旋转装置插入螺钉部分的粘合剂施加构件2111，可以防止设置在粘合剂施加构件上的喷嘴止动件2114干扰电路板表面的布线图案。此外，由于当粘合剂施加构件旋转时，螺杆部分也与其同步地旋转，所以防止粘合剂由于粘合剂施加构件的旋转而从喷嘴排出。因此，施加直径可以均匀化。此外，由于根据粘合剂的粘度来控制螺杆部的旋转，因此可以容易地进行施加所需的施加直径。

3. 发明专利

JP2004337857A Application method and apparatus for adhesive 审中-公开
公开(公告)号：JP2004337857A
公开(公告)日：2004-12-02
申请号：JP2004198949
申请日：2004-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MIYAKE HIROYUKI , IKEDA OSAMU , SASAKI MASARU , INABA YUZURU , KINOU TOSHIYUKI
IPC分类号： B05D7/24 , B05C5/00 , B05D1/26 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an application method and apparatus for adhesive for enhancing productivity of an electronic circuit substrate in various respects without making the apparatus large-sized. SOLUTION: Adhesive is automatically applied, with the use of B control means 33, to a required position on the object 1 to be coated by means of coating heads 7, 8 capable of selecting a plurality of coating diameters in accordance with a prescribed program stored in a memory means 31. In such a case, from the program, dimensional information of a component to be mounted on the coating position is obtained by utilizing the adhesive to be applied, the coating diameter is determined by the dimensional information and, by applying the adhesive in coating diameters required on all such occasions. Thus, the productivity of the electronic circuit substrate is enhanced in various respects without making the apparatus large-sized. COPYRIGHT: (C)2005,JPO&NCIPI

4. 发明专利

JP2004290975A Applicator of adhesive 有权
公开(公告)号：JP2004290975A
公开(公告)日：2004-10-21
申请号：JP2004198948
申请日：2004-07-06
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： MIYAKE HIROYUKI , IKEDA OSAMU , SASAKI MASARU , INABA YUZURU , KINOU TOSHIYUKI
IPC分类号： B05C5/00 , B05C11/00
摘要： PROBLEM TO BE SOLVED: To provide an applicator of adhesive which enhances the efficiency of production of electronic circuit substrate in the various aspects without making the applicator large-sized.
SOLUTION: The applicator of adhesive is provided with tables 3, 4 which are located in the middle of conveyance path 2 and receive conveyed application objects 1, application heads 7, 8 which are arranged according to the tables 3, 4 and can apply the adhesive to a required position of the application objects 1 on the tables 3, 4 and positioning means 5, 6 which relatively move the tables 3, 4 and the application heads 7, 8 while at least accompanying the movement of the application heads 7, 8 and arrange the application heads 7, 8 so as to face each other on the required positions of the application objects 1 on the tables 3, 4 and its vicinity. Further, the applicator of adhesive is provided with a trial application auxiliary tool 41 which are used for trial application by the application heads 7, 8 while successively paying-out a roller tape 42 on the prescribed neighboring positions of the upstream side and downstream side in the conveyance direction of head positioning means 9, 10 and the tables 3, 4 and a supporting mechanism for moving the trial application auxiliary tool 41 to a stand-by position of the lower side, a use position of the same height and a tape replacement position of the upper side with respect to the application object conveyance level LV of the conveyance path 2.
COPYRIGHT: (C)2005,JPO&NCIPI

5. 发明专利

DE69902089T2 未知
公开(公告)号：DE69902089T2
公开(公告)日：2003-03-06
申请号：DE69902089
申请日：1999-03-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI TAKASHI , IIZUKA AKIRA , TERAYAMA EIICHIRO , INABA YUZURU
IPC分类号： B05C5/00 , B05C11/10 , H05K13/04 , B05C5/02 , F04D3/02
摘要： The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed. The rotation of the screw portion is controlled in accordance with a viscosity of the adhesive, thus achieving the application in a required application diameter through a simple operation.

6. 发明专利

DE69902089D1 未知
公开(公告)号：DE69902089D1
公开(公告)日：2002-08-14
申请号：DE69902089
申请日：1999-03-30
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI TAKASHI , IIZUKA AKIRA , TERAYAMA EIICHIRO , INABA YUZURU
IPC分类号： B05C5/00 , B05C11/10 , H05K13/04 , B05C5/02 , F04D3/02
摘要： The object of the present invention is to provide an apparatus and a method for applying a viscous fluid whereby a constant application diameter is achieved through a simple operation without a Tact loss while a surface of a member to be applied can be less damaged. An adhesive application member (2111) having a screw portion (2122) inserted therein is rotated by a rotating device (230), so that a nozzle stopper (2114) of the adhesive application member is prevented from interfering with a wiring pattern on a face of a circuit board. Moreover, the screw portion is rotated synchronously as well when the adhesive application member is rotated, thereby preventing the adhesive from being discharged out from the nozzle in consequence to the rotation of the adhesive application member. An application diameter can hence be uniformed. The rotation of the screw portion is controlled in accordance with a viscosity of the adhesive, thus achieving the application in a required application diameter through a simple operation.

7. 发明专利

JPH11244758A VISCID FLUID COATING APPARATUS 失效
公开(公告)号：JPH11244758A
公开(公告)日：1999-09-14
申请号：JP4714398
申请日：1998-02-27
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INABA YUZURU , CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI MASARU , IIZUKA AKIRA , TERAYAMA EIICHIRO
IPC分类号： B05D7/00 , B05C5/00 , H05K3/10 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a viscid fluid coating apparatus capable of properly maintaining the temperature of a viscid fluid at a proper value by a small type cooling apparatus and maintaining a highly reliable and high coating quality continuously for a long duration even in the case the ambient temperature of the apparatus is higher than the proper temperature of the visicid fluid. SOLUTION: In a viscid fluid coating apparatus comprising a front face open type tank holder 14 and a viscid fluid tank 15 held in the holder, a cover 8 for covering at least a lower part of the front face of the tank holder 14 is installed in the tank holder and a cooling space P for cooling the surrounding of the viscid fluid tank 15 is formed in the inside of the cover 8 and cooling air cooled to a prescribed temperature corresponding to the ambient temperature of the apparatus is supplied to the cooling space P.

8. 发明专利

JPH11220250A APPLICATION METHOD AND DEVICE OF ELECTRONIC COMPONENT ADHESIVE MATERIAL 失效
公开(公告)号：JPH11220250A
公开(公告)日：1999-08-10
申请号：JP2096598
申请日：1998-02-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： IIZUKA AKIRA , CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI MASARU , TERAYAMA EIICHIRO , INABA YUZURU
IPC分类号： B05D7/00 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide an application method and a device, wherein adhesive material can be applied to an area prescribed in diameter which is suitable for the type of electronic component mounted on a circuit board at a prescribed position. SOLUTION: Data as to adhesive material application diameters suitable for the type of each electronic component are stored in an application diameter memory 9, adhesive material discharged out of an application nozzle is applied as changed in amount, the application diameter of adhesive agent is image picked up by a recognition camera 2, relations between the application diameters and the amount of discharged adhesive material are stored as data in an application condition memory 12, and a processing part 7 stores the amount of adhesive material applied at a prescribed position in a discharge time memory 3 as the discharge time data of an application nozzle 1 referring to the application diameter memory 9 and the application condition memory 12 at each time, when the type of an electronic component mounted at a prescribed position is inputted through an input means 6. A drive control 8 controls the application of adhesive material at a prescribed position by the use of the discharge time data.

9. 发明专利

JPH119928A SUBSTRATE CLEANING DEVICE FOR COATING MACHINE 失效
公开(公告)号：JPH119928A
公开(公告)日：1999-01-19
申请号：JP16682997
申请日：1997-06-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI MASARU , IIZUKA AKIRA , TERAYAMA EIICHIRO , INABA YUZURU
IPC分类号： B08B5/04 , B01D46/42 , B05C11/10
摘要： PROBLEM TO BE SOLVED: To improve the quality of coating an adhesive and mounting a part by removing lead wire tailings and substrate shavings from the surface of the substrate to be supplied into a coating machine. SOLUTION: In the coating machine 21 comprising a coating head part 1 for coating a substrate, with a material a table part 3 for supporting the substrate, a loading part for loading the substrate and a control part 6, a cuttings suction hood 32 is disposed on the upper part of the loading part 9 and a substrate sensor for sensing the substrate present in the loading part 9 is also provided. In addition, the suction hood 32 is connected to a suction blower 32 through a cuttings capturing filter 38, and a means for controlling the activation of the suction blower 37 during the sensing of the substrate by the substrate sensor, is provided on the control part 6. Thus it is possible to remove cuttings of lead wires and a substrate from the surface of the substrate beforehand.

10. 发明专利

JPH09314015A VISCOUS FLUID COATING DEVICE 失效
公开(公告)号：JPH09314015A
公开(公告)日：1997-12-09
申请号：JP13292796
申请日：1996-05-28
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INABA YUZURU , CHIKAHISA NAOICHI , MIYAKE HIROYUKI , SASAKI MASARU , IIZUKA AKIRA , TERAYAMA EIICHIRO
IPC分类号： B05C5/00 , H05K3/34 , H05K13/08
摘要： PROBLEM TO BE SOLVED: To improve coating efficiency and to reduce the occurrence rate of coating defects caused by the up and down movement of a dispenser in a viscous fluid coating device coating process. SOLUTION: The device is constituted so as to have the dispenser 12 for the viscous fluid coating device, which is movable up and down with respect to a substrate, and to execute the movement of the dispenser 12 in the upward and downward direction by the rotation of a cum 9. In such a case, the device is constituted so as to reciprocally move the dispenser 12 in the upward and downward direction by alternately switching the rotating direction of the cum 9 in an optional angle not exceeding one revolution.

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