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1. 发明申请

US20050168999A1 LED light for loading dock 审中-公开
标题翻译：用于装载码头的LED灯
公开(公告)号：US20050168999A1
公开(公告)日：2005-08-04
申请号：US10946434
申请日：2004-09-21
申请人： Mathew Sommers , James Petroski , Matthew Mrakovich , Mark Mayer
发明人： Mathew Sommers , James Petroski , Matthew Mrakovich , Mark Mayer
IPC分类号： F21V21/02 , F21V21/26 , F21V21/30 , F21S8/00
CPC分类号： F21V21/30 , F21V21/02 , F21V21/26 , F21V29/507 , F21V29/763 , F21Y2105/10 , F21Y2115/10
摘要： An LED light assembly includes a fixture housing, and at least one LED disposed in the fixture housing. The fixture housing can mount to a bracket that mounts to a wall.
摘要翻译： LED灯组件包括固定器壳体和设置在灯具壳体中的至少一个LED。夹具外壳可安装到安装在墙壁上的支架上。

2. 发明申请

US20050207151A1 Parallel/series LED strip 有权
标题翻译：并联/串联LED条
公开(公告)号：US20050207151A1
公开(公告)日：2005-09-22
申请号：US10805931
申请日：2004-03-22
申请人： Srinath Aanegola , Mathew Sommers , Matthew Mrakovich , Christopher Bohler , Michael McCoy
发明人： Srinath Aanegola , Mathew Sommers , Matthew Mrakovich , Christopher Bohler , Michael McCoy
IPC分类号： F21S2/00 , F21S4/00 , F21V21/002
CPC分类号： F21V21/002 , F21S4/10 , F21Y2115/10
摘要： An LED light engine includes a flexible electrical cable and a plurality of LEDs. The flexible electrical cable includes first, second and third electrical conductors and an electrically insulating covering for the electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the first electrical conductor and a second lead of the first LED electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second electrical conductor and a second lead electrically connected to the third electrical conductor. A third LED includes first and second leads electrically connected to the second conductor. The third LED is interposed between the first LED and the second LED.
摘要翻译： LED光引擎包括柔性电缆和多个LED。柔性电缆包括第一，第二和第三电导体和电导体的电绝缘覆盖物。导体彼此基本平行地布置，其间具有绝缘材料。包括第一引线的第一LED电连接到第一电导体，并且第一LED的第二引线电连接到第二导体。第二LED包括电连接到第二电导体的第一引线和电连接到第三电导体的第二引线。第三LED包括电连接到第二导体的第一和第二引线。第三LED插在第一LED和第二LED之间。

3. 发明授权

US07114841B2 Parallel/series LED strip 有权
标题翻译：并联/串联LED条
公开(公告)号：US07114841B2
公开(公告)日：2006-10-03
申请号：US10805931
申请日：2004-03-22
申请人： Srinath K. Aanegola , Mathew Sommers , Matthew Mrakovich , Christopher L. Bohler , Michael McCoy
发明人： Srinath K. Aanegola , Mathew Sommers , Matthew Mrakovich , Christopher L. Bohler , Michael McCoy
IPC分类号： H01R33/00 , H02G3/04
CPC分类号： F21V21/002 , F21S4/10 , F21Y2115/10
摘要： An LED light engine includes a flexible electrical cable and a plurality of LEDs. The flexible electrical cable includes first, second and third electrical conductors and an electrically insulating covering for the electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the first electrical conductor and a second lead of the first LED electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second electrical conductor and a second lead electrically connected to the third electrical conductor. A third LED includes first and second leads electrically connected to the second conductor. The third LED is interposed between the first LED and the second LED.
摘要翻译： LED光引擎包括柔性电缆和多个LED。柔性电缆包括第一，第二和第三电导体和电导体的电绝缘覆盖物。导体彼此基本平行地布置，其间具有绝缘材料。包括第一引线的第一LED电连接到第一电导体，并且第一LED的第二引线电连接到第二导体。第二LED包括电连接到第二电导体的第一引线和电连接到第三电导体的第二引线。第三LED包括电连接到第二导体的第一和第二引线。第三LED插在第一LED和第二LED之间。

4. 发明申请

US20080030981A1 Elongated Led Illumination Device 有权
标题翻译：延长LED照明装置
公开(公告)号：US20080030981A1
公开(公告)日：2008-02-07
申请号：US11659687
申请日：2005-08-04
申请人： Matthew Mrakovich , Ronald Brengartner , Mark Mayer , William Sekela
发明人： Matthew Mrakovich , Ronald Brengartner , Mark Mayer , William Sekela
IPC分类号： F21S4/00
CPC分类号： G09F13/22 , F21S4/22 , F21S4/28 , F21Y2115/10 , G02B6/001 , H05K2201/10106
摘要： An illumination device (10) for simulating neon lighting comprises an elongated light guide (14) and a light engine (12), operatively connected the elongated light guide (14). The light engine includes a plurality of LEDs (18). The light engine is positioned in relation to the light guide (14) such that light emanating from the light engine (12) passes through the light guide (14).
摘要翻译：用于模拟霓虹照明的照明装置（10）包括可操作地连接细长光导（14）的细长导光体（14）和光引擎（12）。光引擎包括多个LED（18）。光引擎相对于光导（14）定位，使得从光引擎（12）发出的光穿过光导（14）。

5. 发明授权

US07156686B1 Insulation displacement connection splice connector 失效
标题翻译：绝缘位移连接接头连接器
公开(公告)号：US07156686B1
公开(公告)日：2007-01-02
申请号：US11318744
申请日：2005-12-27
申请人： William Sekela , Mark Mayer , Matthew Mrakovich
发明人： William Sekela , Mark Mayer , Matthew Mrakovich
IPC分类号： H01R4/24
CPC分类号： H01R12/675 , F21V21/002 , H01R4/2429 , H01R25/147
摘要： A splice connector includes a first IDC terminal, a second IDC terminal, a body receiving the first and second IDC terminals, and a cover connected to the body such that the cover selectively slides with respect to the body in the first linear direction from first position to a second position. The body defines a first seat configured to receive an associated first cable and second seat configured to receive an associated second cable that is to be electrically connected to the associated first cable. The first and second IDC terminals each include a portion that extends into a region adjacent a respective wire seat. The cover is configured to cooperate with the body where a portion of the cover engages a portion of the body at a third position between the first position and the second position such that in the third position movement of the cover with respect to the body in a second direction, which is opposite the first, is inhibited.
摘要翻译：接头连接器包括第一IDC端子，第二IDC端子，接收第一和第二IDC端子的主体以及连接到主体的盖，使得盖从第一位置沿第一线性方向相对于主体选择性地滑动到第二个位置。主体限定了构造成接收相关联的第一电缆和第二座椅的第一座椅，所述第二座椅被配置成接收将被电连接到相关联的第一电缆的相关联的第二电缆。第一和第二IDC端子各自包括延伸到相应的线座附近的区域中的部分。所述盖被构造成与所述主体配合，其中所述盖的一部分在所述第一位置和所述第二位置之间的第三位置处接合所述主体的一部分，使得在所述第三位置中所述盖相对于所述主体的移动与第一方向相反的第二方向被抑制。

6. 发明授权

US10340424B2 Light emitting diode component 有权
公开(公告)号：US10340424B2
公开(公告)日：2019-07-02
申请号：US14062169
申请日：2013-10-24
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： F21V7/00 , H01L33/44 , H01L33/50 , H01L33/54 , H01L25/075 , F21K9/64
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

7. 发明授权

US10244616B2 LED lighting assemblies with thermal overmolding 有权
公开(公告)号：US10244616B2
公开(公告)日：2019-03-26
申请号：US15164054
申请日：2016-05-25
申请人： Jeffrey Nall , Matthew Mrakovich
发明人： Jeffrey Nall , Matthew Mrakovich
IPC分类号： F21V3/00 , F21V5/00 , H05K1/02 , F21V9/30 , F21V3/10 , F21V29/00 , G09F9/33 , H05K3/28 , F21V23/00 , F21V29/70 , F21V29/85 , F21V23/02 , F21S4/10 , F21S4/20 , F21K9/90 , F21V3/02 , H05K1/18 , H05K3/32 , F21V3/12 , F21V31/04 , F21V3/04 , F21Y101/00 , F21Y115/10
摘要： One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

8. 发明授权

US09585239B2 Methods of manufacturing lighting assembly with thermal overmolding 有权
标题翻译：制造具有热过模制的照明装置的方法
公开(公告)号：US09585239B2
公开(公告)日：2017-02-28
申请号：US14268476
申请日：2014-05-02
申请人： Jeffrey Nall , Matthew Mrakovich
发明人： Jeffrey Nall , Matthew Mrakovich
IPC分类号： H05K3/30 , H05K1/02 , F21V29/00 , G09F9/33 , H05K3/28 , F21V9/16 , F21V23/00 , F21V29/70 , F21V29/85 , F21V23/02 , F21V31/04 , F21V3/04 , F21Y101/00 , F21Y101/02
CPC分类号： H05K1/0203 , F21K9/90 , F21S4/10 , F21S4/20 , F21V3/02 , F21V3/0481 , F21V3/10 , F21V3/12 , F21V9/16 , F21V9/30 , F21V23/001 , F21V23/005 , F21V23/007 , F21V23/023 , F21V29/004 , F21V29/70 , F21V29/85 , F21V31/04 , F21Y2101/00 , F21Y2115/10 , G09F9/33 , H05K1/0209 , H05K1/181 , H05K3/284 , H05K3/32 , H05K2201/0129 , H05K2201/0209 , H05K2201/10106 , H05K2203/1316 , Y10T29/4913 , Y10T29/49146
摘要： One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.
摘要翻译：一个或多个发光二极管二极管（LED）连接到印刷电路板。所连接的LED可通过印刷电路板的电路与电源连接。包覆成型材料在印刷电路板的靠近LED的至少部分上嵌入模制，以形成覆盖印刷电路板的靠近LED的至少部分的独立高导热材料。独立的高导热性材料的熔化温度大于约100℃，并具有大于或约1W / m·K的导热系数。在一些实施例中，自由高的导热材料是热塑性材料。

9. 发明授权

US07800121B2 Light emitting diode component 有权
标题翻译：发光二极管组件
公开(公告)号：US07800121B2
公开(公告)日：2010-09-21
申请号：US11312268
申请日：2005-12-20
申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
发明人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
IPC分类号： H01L29/22 , H01L29/227 , H01L27/15 , H01L29/267 , H01L29/24
CPC分类号： H01L25/0753 , F21K9/68 , F21V23/00 , H01L33/507 , H01L2224/48091 , H01L2924/01322 , H01L2924/00 , H01L2924/00014
摘要： In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
摘要翻译：在照明封装中，印刷电路板支撑至少一个发光管芯。透光罩设置在至少一个发光管芯上。荧光体设置在透光圆顶盖的内部或内部。荧光体响应于至少一个发光管芯的照射而输出转换的光。密封剂基本上填充由透光盖和印刷电路板限定的内部空间。

10. 外观设计

USD586500S1 Reflector for LED luminaire 有权
公开(公告)号：USD586500S1
公开(公告)日：2009-02-10
申请号：US29302958
申请日：2008-01-29
申请人： Mark J. Mayer , Matthew Mrakovich , Nicolo Machi
设计人： Mark J. Mayer , Matthew Mrakovich , Nicolo Machi

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