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    • 6. 发明申请
    • Electronic apparatus
    • 电子仪器
    • US20080024981A1
    • 2008-01-31
    • US11878616
    • 2007-07-25
    • Masumi SuzukiMichimasa AokiYosuke TsunodaMasuo OhnishiMasahiko Hattori
    • Masumi SuzukiMichimasa AokiYosuke TsunodaMasuo OhnishiMasahiko Hattori
    • H05K7/20
    • G06F1/203H01L2924/0002H01L2924/00
    • An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.
    • 电子部件在电子设备中产生热量。 电子元件的热量被传送到液体冷却单元中的热接收器的导热板。 热量从导热板传递到冷却剂。 冷却液的温度升高。 热交换器吸收冷却剂的热量。 冷却液冷却。 电子部件的热也传递到印刷电路板。 印刷电路板上的布线图案散布在印刷电路板上。 由于罐或/和泵被放置在印刷线路板外部的位置,因此不能将热量传递到罐或泵。 这导致防止罐或/和泵中的冷却剂的温度升高。 因此可以提高散热效率。
    • 7. 发明授权
    • Electronic apparatus
    • 电子仪器
    • US07672125B2
    • 2010-03-02
    • US11878616
    • 2007-07-25
    • Masumi SuzukiMichimasa AokiYosuke TsunodaMasuo OhnishiMasahiko Hattori
    • Masumi SuzukiMichimasa AokiYosuke TsunodaMasuo OhnishiMasahiko Hattori
    • H05K7/20F28F7/00
    • G06F1/203H01L2924/0002H01L2924/00
    • An electronic component generates heat in an electronic apparatus. The heat of the electronic component is transferred to a thermal conductive plate of a heat receiver in a liquid cooling unit. The heat is transferred to coolant from the thermal conductive plate. The temperature of the coolant rises. The heat exchanger absorbs heat of the coolant. The coolant gets cooled. The heat of the electronic component is also transferred to the printed wiring board. The heat spreads over the printed wiring board through a wiring pattern in the printed wiring board. Since the tank or/and pump is placed at a position outside the printed wiring board, the heat cannot be transferred to the tank or/and the pump. This results in prevention of rise in the temperature of the coolant in the tank or/and the pump. The efficiency of heat radiation can thus be enhanced.
    • 电子部件在电子设备中产生热量。 电子元件的热量被传送到液体冷却单元中的热接收器的导热板。 热量从导热板传递到冷却剂。 冷却液的温度升高。 热交换器吸收冷却剂的热量。 冷却液冷却。 电子部件的热也传递到印刷电路板。 印刷电路板上的布线图案散布在印刷电路板上。 由于罐或/和泵被放置在印刷线路板外部的位置,因此不能将热量传递到罐或泵。 这导致防止罐或/和泵中的冷却剂的温度升高。 因此可以提高散热效率。