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    • 2. 发明授权
    • Impedance matching device
    • 阻抗匹配装置
    • US6100773A
    • 2000-08-08
    • US157245
    • 1998-09-18
    • Masumi NakamichiYoshiyuki Masuda
    • Masumi NakamichiYoshiyuki Masuda
    • H01G7/06H01L27/01H03H7/38
    • H03H7/38
    • An impedance matching device includes a variable capacitor constituted by a non-linear dielectric thin film and an upper electrode disposed on a lower electrode formed on a substrate. The non-linear dielectric thin film is formed by a deposition, screen-printing, electroplating, or other technique, and changes its relative dielectric constant according to applied voltage. Therefore, the capacity of the variable capacitor is controlled and the impedance is matched, by simply controlling the applied voltage across the non-linear dielectric thin film. Consequently, the arrangement makes it possible to cut down the impedance matching device in size and cost, compared to an arrangement incorporating a capacitor and a coil for adjustment, effects a much simpler matching operation, and facilitates a manufacturing process.
    • 阻抗匹配装置包括由非线性电介质薄膜构成的可变电容器和设置在形成于基板上的下电极上的上电极。 非线性电介质薄膜通过沉积,丝网印刷,电镀或其它技术形成,并根据施加的电压改变其相对介电常数。 因此,通过简单地控制跨越非线性电介质薄膜的施加电压来控制可变电容器的容量并且阻抗匹配。 因此,与包括电容器和用于调整的线圈的布置相比,该布置使得可以减小尺寸和成本的阻抗匹配装置,实现了更简单的匹配操作,并且便于制造过程。
    • 4. 发明授权
    • High frequency module
    • 高频模块
    • US06476695B1
    • 2002-11-05
    • US09578691
    • 2000-05-26
    • Masumi Nakamichi
    • Masumi Nakamichi
    • H01P308
    • H05K1/167H05K1/0237H05K1/162H05K1/165H05K3/4614H05K3/4623H05K2201/0179H05K2201/0317H05K2201/09763H05K2201/10045H05K2203/1461
    • A high frequency module is provided with a resistor array layer with interconnections, in which a plurality of resistor elements having a prescribed resistance value are formed as an array, and in which an interconnection pattern for providing electrical connection to each resistor element is formed in advance. Additionally, a capacitor array layer with interconnection in which a plurality of capacitor elements having a prescribed capacitance value are formed as an array and an interconnection pattern for providing electrical connection to each capacitor element is also formed in advance for later use. A desired circuit constant is obtained by providing interconnections among the plurality of resistor elements and among the plurality of capacitor elements, respectively, in any given combination by simply modifying the respective interconnection patterns instead of the entire module. With this configuration, a high frequency module of a more compact and lighter type which facilitates design modification is provided at a low cost.
    • 高频模块设置有具有互连的电阻器阵列层,其中具有规定电阻值的多个电阻元件形成为阵列,并且其中预先形成用于提供与每个电阻器元件的电连接的互连图案 。 此外,具有互连的电容器阵列层,其中具有规定的电容值的多个电容器元件形成为阵列,并且还预先形成用于提供与每个电容器元件的电连接的互连图案供稍后使用。 通过仅通过简单地修改相应的互连图案而不是整个模块,分别在多个电阻元件之间和多个电容器元件之间分别提供互连来获得期望的电路常数。 利用这种配置,以低成本提供了便于设计修改的更紧凑和更轻型的高频模块。