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1. 发明申请

US20120247657A1 SUBSTRATE TRANSFER METHOD AND SUBSTRATE TRANSFER APPARATUS 审中-公开
标题翻译：基板传输方法和基板传输装置
公开(公告)号：US20120247657A1
公开(公告)日：2012-10-04
申请号：US13423879
申请日：2012-03-19
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： B32B38/18 , B32B38/10
CPC分类号： H01L21/67132 , Y10T156/17
摘要： A ring frame and a substrate are held on each table via an adhesive tape. An annular separation member presses the adhesive tape between the ring frame and the substrate, thereby separating the adhesive tape from the ring frame. After separation, the adhesive tape hung down is held by a holding member. Surfaces of the ring frame and the substrate are transferred onto a new adhesive tape while the adhesive tape is pressed by a joining roller. Then the separated adhesive tape is held by the holding member. The substrate joined to the new adhesive tape to be integrated with the frame is moved upward and horizontally. Thereby the separated adhesive tape is separated from the surface of the substrate.
摘要翻译：环形框架和基板通过胶带固定在每张桌子上。环形分隔构件将粘合带压在环形框架和基底之间，从而将胶带与环形框架分离。分离后，悬挂的胶带由保持构件保持。当粘合带被接合辊按压时，环形框架和基底的表面被转印到新的胶带上。然后分离的胶带由保持构件保持。连接到新的粘合带以与框架一体化的基板向上和向上移动。由此，分离的胶带与基板的表面分离。

2. 发明申请

US20110048609A1 ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS 失效
标题翻译：粘合胶带接合方法和胶粘带接合装置
公开(公告)号：US20110048609A1
公开(公告)日：2011-03-03
申请号：US12848290
申请日：2010-08-02
申请人： Saburo Miyamoto , Yukitoshi Hase , Masayuki Yamamoto
发明人： Saburo Miyamoto , Yukitoshi Hase , Masayuki Yamamoto
IPC分类号： B32B37/12 , B32B38/04
CPC分类号： B65H35/0013 , B65H37/002 , B65H2301/460186 , Y10T156/108 , Y10T156/1084 , Y10T156/1085 , Y10T156/1195
摘要： A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
摘要翻译：联合检测器检测从带供应部分提供的粘合带中的接头，并且计算单元根据检测结果确定用于移除接头的胶带的适当切割位置。控制器控制每个机构进行操作以满足计算单元确定的结果。此后，将包括接头的胶带切割并除去。

3. 发明授权

US07811899B2 Method for laminating substrate and apparatus using the method 失效
标题翻译：使用该方法层压基板和设备的方法
公开(公告)号：US07811899B2
公开(公告)日：2010-10-12
申请号：US11949593
申请日：2007-12-03
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： H01L23/58 , H01L21/30 , H01L21/46 , B23B41/00 , B23B41/02
CPC分类号： H01L21/67132 , B32B37/003 , B32B37/10 , B32B2457/14 , H01L21/67092 , Y10T156/10
摘要： A supporting substrate is laminated on a wafer in such a manner that the supporting substrate locked in peripheral edges with a plurality of locking claws is disposed in proximity to and facing to an adhering surface of a double-sided adhesive sheet on the workpiece, the supporting substrate is pressed by a pressing member made of an approximately hemispherical elastic body from an approximate center of a non-adhering surface of this supporting substrate, the supporting substrate is laminated by elastically deforming this pressing member on the wafer while making the supporting substrate surface contact in a flat condition.
摘要翻译：将支撑基板层叠在晶片上，使得利用多个锁定爪锁定在周边的支撑基板设置在工件上的双面粘合片的粘附表面附近并面向工件上的双面粘合片的粘合表面，支撑基板基板被由大致半球形的弹性体制成的按压部件从该支撑基板的非粘接面的大致中心压制，支撑基板通过使该按压部件在晶片上弹性变形而层叠，同时使支撑基板表面接触在平坦的条件。

4. 发明申请

US20090272403A1 CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS WELL AS ADHESIVE TAPE JOINING APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：切割刀片清洁方法和切割刀片清洁装置，作为粘合带接合装置，包括它们
公开(公告)号：US20090272403A1
公开(公告)日：2009-11-05
申请号：US12426958
申请日：2009-04-20
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： B08B1/00 , B32B38/00 , B26D7/08
CPC分类号： B26D7/088 , B26F1/3806 , Y10T83/242 , Y10T156/1348
摘要： In a container that retains a wash liquid, a cutter blade having a cutting edge is inserted into a slit formed on a cleaning member impregnated with the wash liquid from an opening side of the slit and is moved horizontally by a predetermined amount with two side faces thereof being brought into contact with the slit. Then, the cutter blade is pulled out upward, so that adherents on the two side faces of the cutter blade are removed from the cuter blade.
摘要翻译：在保持洗涤液的容器中，具有切割刃的切割刀片从狭缝的开口侧插入形成在浸渍有洗涤液的清洁部件上的狭缝中，并且通过两个侧面水平移动预定量其与狭缝接触。然后，将切割刀片向上拉出，从而切割刀片的两个侧面上的附着物从切割刀片上移除。

5. 发明申请

US20090095418A1 ULTRAVIOLET IRRADIATION METHOD AND APPARATUS USING THE SAME 审中-公开
标题翻译：超紫外线照射方法和使用该方法的装置
公开(公告)号：US20090095418A1
公开(公告)日：2009-04-16
申请号：US12242453
申请日：2008-09-30
申请人： Masayuki Yamamoto , Yukitoshi Hase , Takao Matsushita , Yasuji Kaneshima
发明人： Masayuki Yamamoto , Yukitoshi Hase , Takao Matsushita , Yasuji Kaneshima
IPC分类号： B29C71/04
CPC分类号： H01L21/67132 , Y10T156/1158 , Y10T156/19
摘要： The ultraviolet ray is applied on the surface of the protective tape from an ultraviolet ray generator. In addition, the ultraviolet ray having intensity higher than that from the ultraviolet ray generator is applied on spot on the wafer edge by an irradiation gun. In this case, the ultraviolet ray intensity and the rotation speed of the holding table are controlled by a controller so that the ultraviolet irradiation amount per unit area of the wafer edge portion becomes equal to that to the joining surface of the protective tape.
摘要翻译：紫外线从紫外线发生器施加在保护带的表面上。此外，通过照射枪在晶片边缘上点上施加强度高于紫外线发生器的紫外线。在这种情况下，通过控制器控制保持台的紫外线强度和旋转速度，使得晶片边缘部的每单位面积的紫外线照射量与保护带的接合面相等。

6. 发明申请

US20120132412A1 SEMICONDUCTOR WAFER TRANSPORT METHOD AND SEMICONDUCTOR WAFER TRANSPORT APPARATUS 有权
标题翻译：半导体波导传输方法和半导体波导传输装置
公开(公告)号：US20120132412A1
公开(公告)日：2012-05-31
申请号：US13304135
申请日：2011-11-23
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： G05D23/00 , F28F9/00
CPC分类号： H01L21/6776 , H01L21/67109 , H01L21/67132 , H01L21/67784
摘要： A semiconductor wafer joined to a carrier via a double-faced adhesive tape having an adhesive layer of a heating separation property is heated for removal from the carrier. The double-faced adhesive tape is separated from the semiconductor wafer on a holding table. Thereafter, an air nozzle preliminarily cools the semiconductor wafer for a given time during transportation with a wafer transport section. Upon completion of the preliminary cooling, the semiconductor wafer is placed on a cooling stage to cool it to a target temperature.
摘要翻译：通过具有加热分离性的粘合剂层的双面胶带连接到载体的半导体晶片被加热以从载体移除。双面胶带与保持台上的半导体晶片分离。此后，空气喷嘴在晶片输送部分运输期间预先冷却半导体晶片一定时间。在初步冷却完成后，将半导体晶片放置在冷却台上以将其冷却至目标温度。

7. 发明申请

US20090133551A1 METHOD FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER AND PROTECTIVE TAPE CUTTING DEVICE 有权
标题翻译：切割半导体波形保护带和保护带切割装置的方法
公开(公告)号：US20090133551A1
公开(公告)日：2009-05-28
申请号：US12272586
申请日：2008-11-17
申请人： Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
发明人： Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
IPC分类号： B26D3/00 , B26D5/00
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S83/922 , Y10T83/05 , Y10T83/0524 , Y10T83/0586 , Y10T83/141 , Y10T83/148 , Y10T83/541 , Y10T156/1348
摘要： A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer.
摘要翻译：切割刀片通过相对于晶片的外周沿向前方向移动而从切口的一个开口端向凹槽的深部移动而被切入。在叶片边缘到达切口的深部之前，切割刀片的切割运动一旦停止，反向移动到初始穿刺位置，然后切割刀片从另一个开口移动到切口的深部在相对于晶片的外周沿相反方向移动的同时切口的端部。

8. 发明授权

US08109185B2 Method for cutting protective tape of semiconductor wafer and protective tape cutting device 有权
标题翻译：切割半导体晶片保护带和保护带切割装置的方法
公开(公告)号：US08109185B2
公开(公告)日：2012-02-07
申请号：US12272586
申请日：2008-11-17
申请人： Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
发明人： Masayuki Yamamoto , Yukitoshi Hase , Yasuji Kaneshima
IPC分类号： B32B38/04
CPC分类号： H01L21/67132 , H01L21/67092 , Y10S83/922 , Y10T83/05 , Y10T83/0524 , Y10T83/0586 , Y10T83/141 , Y10T83/148 , Y10T83/541 , Y10T156/1348
摘要： A cutter blade is cut-in by being moved towards a deep part of a notch from one open end of the notch while being moved in a forward direction with respect to an outer periphery of a wafer. Immediately before a blade edge reaches the deep part of the notch, cutting movement of the cutter blade is once stopped, reversely moved to a initial piercing position, and thereafter, the cutter blade is moved towards the deep part of the notch from the other open end of the notch while being moved in a reverse direction with respect to the outer periphery of the wafer.
摘要翻译：切割刀片通过相对于晶片的外周沿向前方向移动而从切口的一个开口端向凹槽的深部移动而被切入。在叶片边缘到达切口的深部之前，切割刀片的切割运动一旦停止，反向移动到初始穿刺位置，然后切割刀片从另一个开口移动到切口的深部在相对于晶片的外周沿相反方向移动的同时切口的端部。

9. 发明授权

US07807004B2 Method for joining adhesive tape 失效
标题翻译：胶带接合方法
公开(公告)号：US07807004B2
公开(公告)日：2010-10-05
申请号：US11966941
申请日：2007-12-28
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： B29C65/48
CPC分类号： H01L21/67132 , B29C63/02 , B32B37/10 , B32B2457/14 , Y10T156/12
摘要： This invention is directed to a method for joining an adhesive tape having the steps (1) separating, from a first adhesion face of a double-sided adhesive tape having first and second separators attached to front and back adhesion faces thereof, the first separator, and joining the double-sided adhesive tape to a surface of a substrate; (2) joining the double-sided adhesive tape to the substrate while a joining roller provided in a tape joining unit presses the second separator with rolling, and taking up the second separator wound and turned around by the joining roller and separated from a second adhesion face of the double-sided adhesive tape in a second separator collecting unit provided in the tape joining unit while rolling the joining roller synchronously; and (3) cutting the double-sided adhesive tape joined to the substrate with the adhesion faces thereof being exposed along with a contour of the substrate.
摘要翻译：本发明涉及一种粘合带的方法，所述粘合带具有以下步骤（1）：从具有附接到其前和后粘合面的第一和第二分隔物的双面胶带的第一粘合面上分离第一分离器，并将所述双面胶带接合到基板的表面; （2）将双面胶带接合到基板上，同时设置在带接合单元中的接合辊将第二分离器压下，并且卷绕第二分离器并且由接合辊旋转并与第二粘合分离在设置在带接合单元中的第二分离器收集单元中同时滚动接合辊的双面胶带的表面; 和（3）将其粘合面与基材的轮廓一起露出而切割与基材接合的双面胶带。

10. 发明申请

US20090205679A1 CUTTER BLADE CLEANING METHOD AND CUTTER BLADE CLEANING DEVICE, AS WELL AS ADHESIVE TAPE JOINING APPARATUS INCLUDING THE SAME 审中-公开
标题翻译：切割刀片清洁方法和切割刀片清洁装置，作为粘合带接合装置，包括它们
公开(公告)号：US20090205679A1
公开(公告)日：2009-08-20
申请号：US12368228
申请日：2009-02-09
申请人： Masayuki Yamamoto , Yukitoshi Hase
发明人： Masayuki Yamamoto , Yukitoshi Hase
IPC分类号： B08B7/00 , B08B1/00
CPC分类号： H01L21/67132 , H01L21/67092
摘要： A cutter blade cuts an adhesive tape and then returns to its standby position. Thereafter, a cleaning unit moves to a position below the cutter blade, and the cutter blade moves downward to a predetermined height. Herein, a cleaning member impregnated with a wash liquid is pierced with the cutter blade in order to clean an adherent on the cutter blade. Each time the cutter blade cleaning process is executed, the pierced position of the cleaning member with the cutter blade is changed.
摘要翻译：刀片切割胶带，然后返回到其待机位置。此后，清洁单元移动到切割刀片下方的位置，并且切割刀片向下移动到预定高度。这里，用切割刀片刺穿浸渍有洗涤液体的清洁部件，以清洁刀片上的粘附剂。每次执行切割刀片清洁处理时，改变具有切割刀片的清洁部件的穿孔位置。

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