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1. 再颁专利

USRE38878E1 Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：USRE38878E1
公开(公告)日：2005-11-15
申请号：US08993893
申请日：1997-12-18
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B7/22 , B24B37/04
CPC分类号： B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

2. 发明授权

US5476414A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5476414A
公开(公告)日：1995-12-19
申请号：US124550
申请日：1993-09-22
申请人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
发明人： Masayoshi Hirose , Manabu Tsujimura , Seiji Ishikawa , Norio Kimura , You Ishii
IPC分类号： B24B37/10 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： H01L21/02024 , B24B37/107 , B24B37/30
摘要： A workpiece such as a semiconductor wafer is supported on a top ring and polished by an abrasive cloth on a turntable while the top ring is being pressed against the turntable and the turntable and the top ring are being rotated. The top ring is coupled to a top ring drive shaft, coupled to a pressure cylinder for pressing the top ring, and to a motor for rotating the top ring. A spherical bearing is interposed between the top ring and the top ring drive shaft for allowing the top ring to align with the upper surface of the moving turntable. A torque transmitting mechanism is operatively coupled between the top ring and the top ring drive shaft for rotating the top ring in synchronization with the top ring drive shaft.
摘要翻译：诸如半导体晶片的工件被支撑在顶环上并且通过研磨布在转盘上抛光，同时顶环被压靠在转台上，并且转台和顶环正在旋转。顶环联接到顶环驱动轴，联接到用于按压顶环的压力缸，以及用于旋转顶环的电动机。在顶环和顶环驱动轴之间插入有球面轴承，用于允许顶环与活动转台的上表面对准。扭矩传递机构可操作地联接在顶环和顶环驱动轴之间，用于与顶环驱动轴同步地旋转顶环。

3. 再颁专利

USRE38228E1 Polishing apparatus 失效
标题翻译：抛光设备和方法
公开(公告)号：USRE38228E1
公开(公告)日：2003-08-19
申请号：US08789304
申请日：1997-01-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

4. 发明授权

US5384986A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5384986A
公开(公告)日：1995-01-31
申请号：US124648
申请日：1993-09-22
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Kiyotaka Kawashima , You Ishii
IPC分类号： B24B37/26 , B24B53/007 , B24B53/017 , B41J11/62
CPC分类号： B24B53/017 , B24B37/26
摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereof for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.
摘要翻译：安装有研磨布的转盘和位于转盘上方的顶环可独立地可旋转地设置。顶环保持要抛光的工件，并将工件压在研磨布上。转盘和顶环旋转以将工件的表面抛光到研磨布上的平整镜面上。压在研磨布上的可旋转刷子围绕基本上垂直于研磨布平面的轴线旋转，并且在磨料布的径向内部和外部位置之间基本径向摆动。将清洁溶液从喷嘴喷射到研磨布上。转台沿其外圆周边缘具有一个堤，用于防止当转台静止时供给磨料以保持磨料湿润并防止磨损的保护溶液流出转台。

5. 发明授权

US5643056A Revolving drum polishing apparatus 失效
标题翻译：滚筒抛光装置
公开(公告)号：US5643056A
公开(公告)日：1997-07-01
申请号：US550117
申请日：1995-10-30
申请人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
发明人： Masayoshi Hirose , Seiji Ishikawa , Norio Kimura , Yoshimi Sasaki , Kouki Yamada , Fujio Aoyama , Noburu Shimizu , Katsuya Okumura
IPC分类号： B24B7/22 , B24B29/02 , B24B37/07 , B24B37/10 , H01L21/304 , B24B1/00
CPC分类号： B24B7/228 , B24B29/02 , B24B37/04
摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.
摘要翻译：用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和设备成本

6. 发明授权

US5616063A Polishing apparatus 失效
标题翻译：抛光设备
公开(公告)号：US5616063A
公开(公告)日：1997-04-01
申请号：US309193
申请日：1994-09-20
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Masako Kodera , Shirou Mishima , Atsushi Shigeta , Masayoshi Hirose , Norio Kimura , Seiji Ishikawa
IPC分类号： H01L21/302 , B08B1/04 , B24B27/00 , B24B37/04 , B24B37/34 , B24B51/00 , B24B55/12 , H01L21/00 , H01L21/677 , B24B49/00
CPC分类号： H01L21/67167 , B08B1/04 , B08B13/00 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67161 , H01L21/67219 , H01L21/67745
摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.
摘要翻译：抛光装置是具有执行各种操作的多个单元的集群类型的装置。抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。离散机构分别在单元之间传送清洁的工件和脏工件。

7. 发明申请

US20080090501A1 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 审中-公开
公开(公告)号：US20080090501A1
公开(公告)日：2008-04-17
申请号：US11980663
申请日：2007-10-31
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
IPC分类号： B24B1/00
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

8. 发明授权

US06439971B2 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 有权
公开(公告)号：US06439971B2
公开(公告)日：2002-08-27
申请号：US09804233
申请日：2001-03-13
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
IPC分类号： B24B100
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

9. 发明授权

US06273802B1 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 有权
公开(公告)号：US06273802B1
公开(公告)日：2001-08-14
申请号：US09233039
申请日：1999-01-20
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
IPC分类号： B24B500
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/4401 , H04N5/455
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

10. 发明授权

US5885138A Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device 失效
公开(公告)号：US5885138A
公开(公告)日：1999-03-23
申请号：US767060
申请日：1996-12-16
申请人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
发明人： Katsuya Okumura , Riichirou Aoki , Hiromi Yajima , Seiji Ishikawa , Manabu Tsujimura
IPC分类号： B08B1/04 , B24B27/00 , B24B37/04 , B24B51/00 , B24B55/12 , F24F3/16 , H01L21/00 , H01L21/677 , H03M13/39 , H04L1/00 , H04N5/44 , H04N5/455 , B24B5/00 , B24B7/00 , B24B9/00 , B24B29/00
CPC分类号： H01L21/67161 , B08B1/04 , B24B27/0023 , B24B37/04 , B24B37/345 , B24B51/00 , B24B55/12 , F24F3/161 , H01L21/67028 , H01L21/67046 , H01L21/67057 , H01L21/67167 , H01L21/67219 , H01L21/67745 , H01L21/67778 , H03M13/39 , H04N5/455 , H04N5/4401
摘要： A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

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