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    • 4. 发明申请
    • SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 固态成像装置及其制造方法
    • US20100084728A1
    • 2010-04-08
    • US12573276
    • 2009-10-05
    • Tohru YAMADA
    • Tohru YAMADA
    • H01L31/0232H01L31/18
    • H01L27/14868H01L27/14621H01L27/14623H01L27/14627H01L27/14632H01L27/14685
    • A solid-state imaging device according to the present invention includes light-receiving units formed on a surface in a substrate, a photo-shield film formed above the substrate and having openings above the light-receiving units, a light-transmissive insulating film formed above the photo-shield film and in the openings in the photo-shield film, downwardly convex in-layer lenses made of a material having a refractive index different from that of the light-transmissive insulating film and formed above the light-transmissive insulating film, an OCCF formed above the in-layer lenses and having a first filter and a second filter which are positioned above different ones of the light-receiving units and transmit lights of different wavelengths, and OCLs formed above the in-layer lenses. The width of the openings in the photo-shield film and the curvature of the in-layer lenses provided under the first filter and those under the second filter are different from each other, respectively.
    • 根据本发明的固体摄像装置包括形成在基板的表面上的受光单元,形成在基板上方并且在光接收单元上方具有开口的光屏蔽膜,形成的透光绝缘膜 在光屏蔽膜的上方和光屏蔽膜的开口中,由具有与透光绝缘膜的折射率不同的材料制成的向下凸出的层内透镜形成在透光性绝缘膜的上方 形成在层内透镜上方的OCCF,并且具有位于不同波长的光接收单元和透射光之间的第一滤光器和第二滤光器,以及形成在层内透镜上方的OCL。 光屏蔽膜中的开口的宽度和设置在第一滤光器下面的内层透镜的曲率和第二滤光片下面的内层透镜的曲率分别彼此不同。