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    • 8. 发明授权
    • Room temperature-curable organopolysiloxane composition
    • 室温可固化的有机聚硅氧烷组合物
    • US4695617A
    • 1987-09-22
    • US837588
    • 1986-03-07
    • Yoshio InoueMasatoshi AraiShinichi SatoKoji Yokoo
    • Yoshio InoueMasatoshi AraiShinichi SatoKoji Yokoo
    • C08L83/00C08K5/5425C08K5/5465C08L83/04C08L83/06H01B3/46C08G77/20
    • C08K5/5465C08K5/54C08G77/14C08G77/16C08G77/20C08G77/26Y10S528/901
    • The room temperature-curable organopolysiloxane composition of the invention capable of giving a cured rubber can be used advantageously as an insulating material in electric and electronic instruments without causing troubles in contact points which is unavoidable with conventional compositions. The inventive composition is formulated with (a) a diorganopolysiloxane terminated at the molecule molecular chain ends each with a silanolic hydroxy group, (b) an alkenyloxy, e.g. isopropenyloxy, containing silane and (c) a guanidino-substituted organosilicon compound and these components are specified either by the upper limit of the content of low molecular constituents having a specified vapor pressure or higher or the upper limit of the vapor pressure of the compound per se so that the electric contact points near the insulation with the composition are free from exposure to the vapor of organosilicon compounds which may be deposited as an oxide of silicon by sparks.
    • 能够提供固化橡胶的本发明的室温可固化的有机基聚硅氧烷组合物可以有利地用作电气和电子仪器中的绝缘材料,而不会在常规组合物中不可避免地引起接触点的麻烦。 本发明的组合物配制成(a)在分子分子链处终止的二有机聚硅氧烷,每个末端具有硅烷醇羟基,(b)链烯氧基,例如, 含有硅烷的异丙烯氧基和(c)胍基取代的有机硅化合物,并且这些组分由具有特定蒸气压或更高的低分子量成分的含量的上限或化合物的蒸气压的上限规定 使得与组合物绝缘附近的电接触点不会暴露于有机硅化合物的蒸气中,有机硅化合物可以通过火花作为硅的氧化物沉积。