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1. 发明授权

US5717803A Coupling structure of optical fiber and optical semiconductor element 失效
标题翻译：光纤和光学半导体元件的耦合结构
公开(公告)号：US5717803A
公开(公告)日：1998-02-10
申请号：US747817
申请日：1996-11-13
申请人： Isao Yoneda , Junichi Sasaki , Masataka Itoh , Hiroshi Honmou
发明人： Isao Yoneda , Junichi Sasaki , Masataka Itoh , Hiroshi Honmou
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/60 , H01L33/62 , G02B6/36
CPC分类号： G02B6/4224 , G02B6/4214 , G02B6/4232 , G02B6/4249
摘要： The optical fibers are arranged in a V groove formed at the surface of a silicon substrate and a cover is provided thereon. An electrode for solder bump is respectively formed at the position opposed with each other to the substrate and cover. These substrate and cover are deposited with solder in order to fix the optical fibers. The substrate or cover is previously provided, at the end point part of the optical fibers, with the mark for the positioning in the longitudinal direction of the optical fibers. The optical fibers are positioned with this mark. Here, the side surface of the optical fibers is provided with the metallized area at the position located in the predetermined distance from the end point thereof. Before fixing with the cover, the optical fibers can be deposited automatically to the predetermined position without alignment due to the self-alignment effect between the mark and metallized area. Meanwhile, the optical element can be deposited with the solder bump without adjustment to the area near the end point of the optical fiber by utilizing the self-alignment. Here, it is also possible to form the mark to the substrate for measuring the mounting position of the optical element after deposition thereof.
摘要翻译：光纤布置在形成在硅衬底表面上的V沟槽中，并且在其上设置盖。用于焊料凸点的电极分别形成在与基板和盖相对的位置上。这些基板和盖子用焊料沉积以固定光纤。预先在光纤的端点部分设置有用于在光纤的纵向上定位的标记的基板或盖。光纤用这个标记定位。这里，光纤的侧表面设置有位于距其端点预定距离的位置处的金属化区域。在用盖子固定之前，由于标记和金属化区域之间的自对准效应，光纤可以自动沉积到预定位置而不进行对准。同时，通过利用自对准，光学元件可以沉积有焊料凸块而不调整到光纤端点附近的区域。这里，也可以在用于测量光学元件的沉积后的安装位置的基板上形成标记。

2. 发明授权

US5573170A Bump forming apparatus 失效
标题翻译：凹凸成型装置
公开(公告)号：US5573170A
公开(公告)日：1996-11-12
申请号：US353134
申请日：1994-12-09
申请人： Junichi Sasaki , Masataka Itoh , Hiroshi Honmou , . Yoshinobu Kaneyama
发明人： Junichi Sasaki , Masataka Itoh , Hiroshi Honmou , . Yoshinobu Kaneyama
IPC分类号： H01L21/60 , B23K20/02 , B26D7/10 , B26D7/34 , B23K28/02
CPC分类号： H01L24/11 , B23K20/023 , B26D7/10 , B26D7/34 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014
摘要： In an apparatus for punching a metallic sheet to stamp out a bump and bonding it to a substrate, an AuSn sheet is heated to above a softening point thereof by a heater. A solenoid is energized to cause a punch and a die to stamp out a bump from the AuSn sheet. The bump is directly bonded to a substrate. The punch is made up of a shank portion and a punch portion. A punch holder for guiding the shank portion and punch portion with high accuracy molded integrally with the die. The punch is connected to the solenoid with the intermediary of a damper spring. When the bump hits against the substrate, the damper spring prevents it from chipping off or cracking due to an impact. Subsequently, another solenoid is energized to move the punch further downward, thereby pressing the bump against the substrate for a sufficient period of time.
摘要翻译：在金属片冲压装置中冲压凸块并将其粘合到基板上时，通过加热器将AuSn片材加热到其软化点以上。螺线管通电，使冲头和模具从AuSn板上冲出凸块。凸块直接结合到基板上。冲头由柄部和冲头部组成。用于以与模具一体成型的高精度引导柄部和冲头部的冲头保持架。冲头与阻尼弹簧中间的螺线管连接。当凸块撞击基板时，阻尼弹簧防止其由于冲击而破裂或开裂。随后，另一个螺线管被通电以使冲头进一步向下移动，从而将凸块压靠在基板上足够长的时间。

3. 发明授权

US06393171B2 Optical module for optical transmission and manufacturing process therefor 有权
标题翻译：用于光传输及其制造工艺的光模块
公开(公告)号：US06393171B2
公开(公告)日：2002-05-21
申请号：US09885518
申请日：2001-06-20
申请人： Junichi Sasaki , Masataka Itoh , Naoki Kitamura
发明人： Junichi Sasaki , Masataka Itoh , Naoki Kitamura
IPC分类号： G02B612
CPC分类号： G02B6/42 , G02B6/423 , G02B6/4232
摘要： The integrity of a solder jointing pad, which is used to mount an optical module, is enhanced by avoiding exposure to high temperatures used in the formation of an accompanying optical wave guide. The enhanced integrity of the solder jointing pad permits a mounting solder bump to be evenly distributed on the pad, which improves mounting position characteristics. The solder jointing pads are elongated in shape and arranged in parallel and perpendicular orientation with respect to an optical transmission path in the optical module. The enhanced integrity of the solder jointing pads permits a precise amount of solder to be introduced to the pads when mounting the optical module. The optical module can then be precisely positioned simply by varying the amount of solder introduced to the solder jointing pads. The optical device can be positioned with high accuracy by taking advantage of the self-alignment action which occurs between the molten solder bumps and the solder jointing pads. The optical module can thus be precisely positioned during manufacturing, without the need for additional adjustments.
摘要翻译：用于安装光学模块的焊接焊盘的完整性通过避免暴露于形成伴随的光波导的高温来增强。焊接焊盘的增强的完整性允许将焊料凸块均匀分布在焊盘上，这改善了安装位置特性。焊接焊盘的形状是细长的，并且相对于光学模块中的光传输路径平行且垂直定向布置。焊接接头焊盘的增强的完整性允许在安装光学模块时将精确量的焊料引入焊盘。然后可以简单地通过改变引入焊接焊盘的焊料的量来精确地定位光学模块。通过利用在熔融焊料凸块和焊接焊盘之间发生的自对准作用，可以高精度地定位光学装置。因此，光学模块可以在制造期间精确地定位，而不需要额外的调整。

4. 发明授权

US06238100B1 Optical module and a method for fabricating a same 有权
标题翻译：光模块及其制造方法
公开(公告)号：US06238100B1
公开(公告)日：2001-05-29
申请号：US09421041
申请日：1999-10-20
申请人： Junichi Sasaki , Tomoaki Kato , Masataka Itoh
发明人： Junichi Sasaki , Tomoaki Kato , Masataka Itoh
IPC分类号： G02B638
CPC分类号： G02B6/4292 , G02B6/421 , G02B6/4215 , G02B6/423 , G02B6/4245 , G02B6/4249 , G02B6/4257 , G02B6/4274
摘要： A semiconductor optical amplifier is mounted on a substrate which is provided for a package. Fiber blocks in which plural parallel internal optical fibers are supported are fitted to the package. The optical fibers are optically coupled with the semiconductor optical amplifier via optical waveguides formed on the substrate. V grooves for supporting the optical fibers which protrude out from the fiber block are formed on the substrate. Positionings of the optical fibers are performed by fitting the fiber blocks to the package so that end faces of the optical fibers butt against end walls of the V grooves.
摘要翻译：半导体光放大器安装在为封装提供的基板上。其中多个平行的内部光纤被支撑的纤维块被装配到包装上。光纤通过形成在基板上的光波导与半导体光放大器光学耦合。在基板上形成用于支撑从纤维块突出的光纤的V形槽。光纤的定位是通过将光纤块装配到封装上来实现的，使得光纤的端面对接V沟槽的端壁。

5. 发明授权

US6115515A Optical device mounting board 有权
标题翻译：光学装置安装板
公开(公告)号：US6115515A
公开(公告)日：2000-09-05
申请号：US154714
申请日：1998-09-17
申请人： Masataka Itoh , Junichi Sasaki
发明人： Masataka Itoh , Junichi Sasaki
IPC分类号： G02B6/42 , G02B6/43 , H01L27/14 , H01L31/10 , H01L33/62 , H01S5/00 , H05K1/02 , G02B6/12
CPC分类号： G02B6/4232 , G02B6/423 , G02B6/4249 , G02B6/4245 , G02B6/428 , G02B6/43
摘要： An optical device mounting board with electrodes mounted on the surface of the mounting board and separated from one another by grooves dividing the surface of the mounting board includes printed circuit boards having distribution lines for connecting the divided electrodes and spanning the grooves.
摘要翻译：具有安装在安装板的表面上并且通过分隔安装板的表面的凹槽彼此分离的电极的光学装置安装板包括印刷电路板，其具有用于连接分割电极并横跨槽的分配线。

6. 发明授权

US5929500A Light receiving device for use in optical fiber communications and the like 失效
标题翻译：用于光纤通信的光接收装置等
公开(公告)号：US5929500A
公开(公告)日：1999-07-27
申请号：US802560
申请日：1997-02-19
申请人： Isao Yoneda , Kiyoshi Fukushima , Junichi Sasaki , Hiroshi Honmou , Masataka Itoh
发明人： Isao Yoneda , Kiyoshi Fukushima , Junichi Sasaki , Hiroshi Honmou , Masataka Itoh
IPC分类号： H01L21/60 , G02B6/42 , H01L31/02 , H01L31/0232 , H01L31/10
CPC分类号： G02B6/4214 , G02B6/4224 , G02B6/4249 , H01L2224/16
摘要： A light receiving element is comprised of a light sensitive surface on a semiconductor substrate and a positive electrode (anode), a negative electrode (cathode), a mounting precision test mask, a conductive electrode wire, and solder resist on the same substrate surface. A metal thin film, a mounting alignment mark, and a mounting precision mark window are provided on the back side of the substrate. Two or more electrode surfaces having either the anode or the cathode used as the common electrode are provided. The light sensitive surface is positioned approximately in the center between these two electrode surfaces. A highly precise mounting can therefore be achieved with the solder bump, even when mounting single light receiving elements. High precision mounting is also obtained when mounting light receiving element arrays. This type of light receiving element can be precisely positioned and bonded by solder bumps to a substrate having an optical fiber fitted in the V groove.
摘要翻译：光接收元件由半导体衬底上的光敏表面和同一衬底表面上的正极（阳极），负电极（阴极），安装精密测试掩模，导电电极线和阻焊剂组成。金属薄膜，安装对准标记和安装精密标记窗设置在基板的背面。提供具有用作公共电极的阳极或阴极的两个或更多个电极表面。光敏表面大致位于这两个电极表面之间的中心。因此，即使安装单个光接收元件，也可以通过焊料凸块实现高精度的安装。安装光接收元件阵列时也可获得高精度的安装。这种类型的光接收元件可以通过焊料凸块精确定位和结合到具有安装在V沟槽中的光纤的基板。

7. 发明授权

US08322933B2 Optical connection structure between optical backplane and circuit substrate 有权
标题翻译：光背板与电路基板之间的光连接结构
公开(公告)号：US08322933B2
公开(公告)日：2012-12-04
申请号：US12534622
申请日：2009-08-03
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/36 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/3897 , G02B6/43
摘要： Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.
摘要翻译：信息处理设备包括设置在电路基板上的光电转换模块，通过多个第一光纤连接到光电转换模块并且设置在电路基板的边缘部分的第一光学连接器，以及设置在电路基板上的第二光学连接器光学背板并且光学连接到第一光学连接器。光电转换模块中的光纤的布置方向与电路基板的主表面不平行，第一光连接器中的光纤的布置方向和第二光连接器中的光纤的布置方向为与电路基板的主表面不平行。

8. 发明授权

US08267597B2 Mounting of optical device on mounting board to at least provide heat radiation 有权
标题翻译：将光学装置安装在安装板上至少提供热辐射
公开(公告)号：US08267597B2
公开(公告)日：2012-09-18
申请号：US12545204
申请日：2009-08-21
申请人： Junichi Sasaki
发明人： Junichi Sasaki
IPC分类号： G02B6/00 , G02B6/36
CPC分类号： G02B6/4214 , G02B6/325 , G02B6/4228 , H05K1/141 , H05K1/182
摘要： An optical module includes: an optical device mounting board including a first surface, a second surface on the reverse side, and a light transparent part allowing an emitted light traveling from the first surface to the second surface and a received light traveling in the opposite direction to pass through the transparent part; an optical device mounted on the first surface, which is a light emitting device or a light receiving device; a first terminal mounted on a surface except the first surface of the optical device mounting board; a wiring connecting a second terminal of a component mounted on the first surface including the optical device with the first terminal; and a transmission medium connector connecting a light transmission medium transmitting the emitted light traveling from the second surface to an outside of the optical module or the received light traveling in the opposite direction.
摘要翻译：光学模块包括：光学装置安装板，包括第一表面，反面上的第二表面和允许从第一表面到第二表面传播的发射光的透光部分和沿相反方向行进的接收光透过透明部分; 安装在第一表面上的光学器件，其是发光器件或光接收器件; 第一端子，其安装在除了所述光学装置安装板的第一表面之外的表面上; 连接安装在包括光学装置的第一表面的部件的第二端子与第一端子的布线; 以及传输介质连接器，其连接将从第二表面传播的发射光传输到光学模块的外部的光传输介质或沿相反方向传播的接收光。

9. 发明授权

US07732340B2 Method for adjusting a critical dimension in a high aspect ratio feature 失效
标题翻译：用于调整高宽高比特征中临界尺寸的方法
公开(公告)号：US07732340B2
公开(公告)日：2010-06-08
申请号：US11463133
申请日：2006-08-08
申请人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
发明人： Toshifumi Nagaiwa , Junichi Sasaki , Stefan Sawusch
IPC分类号： H01I21/302
CPC分类号： H01L21/31116 , H01L21/31122 , H01L21/31144
摘要： A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.
摘要翻译：一种用于使用干蚀刻工艺调节在衬底上形成的特征的横向临界尺寸（即，长度和宽度）的方法。将一个或多个薄的中间子层插入其中要形成特征的层中。一旦在蚀刻过程中达到中间子层，则在蚀刻通过中间子层并继续层蚀刻之前，执行蚀刻工艺以校正和/或调整横向临界尺寸。

10. 发明授权

US07561762B2 Semiconductor device having optical signal input-output mechanism 有权
标题翻译：具有光信号输入输出机构的半导体装置
公开(公告)号：US07561762B2
公开(公告)日：2009-07-14
申请号：US11575482
申请日：2005-09-20
申请人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
发明人： Kazunori Miyoshi , Kazuhiko Kurata , Takanori Shimizu , Ichiro Hatakeyama , Junichi Sasaki
IPC分类号： G02B6/12 , G02B6/26 , G02B6/42
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4232 , H05K1/141 , H05K1/147 , H05K1/189
摘要： A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).
摘要翻译：半导体装置具有印刷电路板（11），其中形成连接到LSI芯片（17）和平面光学元件（21）的电线（18），并且其中传输输入到平面光学元件的光的光波导（25） 21）和/或从平面光学元件（21）输出的光是固定的。平面光学元件（21）安装在小基板（13）的一端，小基板（13）的另一端通过焊料凸块（26）与印刷电路板（11）连接。安装平面光学元件（21）的小基板（13）的一端通过固定机构固定到印刷电路板（11）。小基板（13）具有柔性部分（15），其与印刷电路板（11）和小基板（13）的其它部分相比容易变形，在平面光学元件（21）的一端之间的至少一部分区域中，并且另一端电连接到印刷线路板（11）。

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