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    • 5. 发明申请
    • Method for manufacturing semiconductor laser
    • 制造半导体激光器的方法
    • US20100151611A1
    • 2010-06-17
    • US12591286
    • 2009-11-16
    • Tsuyoshi FujimotoNozomi OhashiMasaru KuramotoEiji Nakayama
    • Tsuyoshi FujimotoNozomi OhashiMasaru KuramotoEiji Nakayama
    • H01L21/28
    • H01S5/34333B82Y20/00H01S5/22
    • A method for manufacturing a semiconductor laser includes the steps of forming a mask layer having a stripe-shaped mask portion corresponding to a ridge stripe to be formed on a nitride-based group III-V compound semiconductor layer, etching the nitride-based group III-V compound semiconductor layer to a predetermined depth using the mask layer to form the ridge stripe, forming a resist to cover the mask layer and the nitride-based group III-V compound semiconductor layer, etching-back the resist until the stripe-shaped mask portion of the mask layer is exposed, removing the exposed mask portion of the mask layer by etching to expose the upper surface of the ridge stripe, forming a metal film on the resist and the exposed ridge stripe to form an electrode on the ridge stripe, removing the resist together with the metal film formed thereon, and removing the mask layer by etching.
    • 一种制造半导体激光器的方法包括以下步骤:形成具有对应于氮化物基III-V族化合物半导体层上形成的脊条的条形掩模部分的掩模层,蚀刻氮化物基III族 -V化合物半导体层到预定深度,使用掩模层形成脊条,形成抗蚀剂以覆盖掩模层和基于氮化物的III-V族化合物半导体层,将抗蚀剂刻蚀至条状 掩模层的掩模部分被暴露,通过蚀刻去除掩模层的暴露的掩模部分以暴露脊条的上表面,在抗蚀剂和暴露的脊条上形成金属膜,以在脊条上形成电极 与形成在其上的金属膜一起除去抗蚀剂,并通过蚀刻去除掩模层。
    • 10. 发明授权
    • Method for manufacturing semiconductor laser
    • 制造半导体激光器的方法
    • US07943407B2
    • 2011-05-17
    • US12591286
    • 2009-11-16
    • Tsuyoshi FujimotoNozomi OhashiMasaru KuramotoEiji Nakayama
    • Tsuyoshi FujimotoNozomi OhashiMasaru KuramotoEiji Nakayama
    • H01L21/00
    • H01S5/34333B82Y20/00H01S5/22
    • A method for manufacturing a semiconductor laser includes the steps of forming a mask layer having a stripe-shaped mask portion corresponding to a ridge stripe to be formed on a nitride-based group III-V compound semiconductor layer, etching the nitride-based group III-V compound semiconductor layer to a predetermined depth using the mask layer to form the ridge stripe, forming a resist to cover the mask layer and the nitride-based group III-V compound semiconductor layer, etching-back the resist until the stripe-shaped mask portion of the mask layer is exposed, removing the exposed mask portion of the mask layer by etching to expose the upper surface of the ridge stripe, forming a metal film on the resist and the exposed ridge stripe to form an electrode on the ridge stripe, removing the resist together with the metal film formed thereon, and removing the mask layer by etching.
    • 一种制造半导体激光器的方法包括以下步骤:形成具有对应于氮化物基III-V族化合物半导体层上形成的脊条的条形掩模部分的掩模层,蚀刻氮化物基III族 -V化合物半导体层到预定深度,使用掩模层形成脊条,形成抗蚀剂以覆盖掩模层和基于氮化物的III-V族化合物半导体层,将抗蚀剂刻蚀至条状 掩模层的掩模部分被暴露,通过蚀刻去除掩模层的暴露的掩模部分以暴露脊条的上表面,在抗蚀剂和暴露的脊条上形成金属膜,以在脊条上形成电极 与形成在其上的金属膜一起除去抗蚀剂,并通过蚀刻去除掩模层。