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    • 3. 发明授权
    • Power supply apparatus
    • 电源设备
    • US5831240A
    • 1998-11-03
    • US554529
    • 1995-11-07
    • Masao KatookaToru AraiShigeru OkamotoKenzo DanjoMasaharu Tanaka
    • Masao KatookaToru AraiShigeru OkamotoKenzo DanjoMasaharu Tanaka
    • B23K9/32B23K9/10
    • B23K9/323
    • A power supply apparatus includes first and second spaced-apart, substantially parallel panels, and a chassis disposed in substantially perpendicular to and between the first and second panels. Opposite edges of the chassis are coupled to the respective ones of the first and second panels to thereby partition the space between the first and second panels into upper and lower regions. A power supply circuit includes heat-generating electric components disposed in the lower region, and non-heat-generating components disposed in the upper region. The chassis has an opening therein and a heat sink is mounted to close the opening in the chassis. A semiconductor module of the power supply circuit is mounted on the surface facing to the upper region of the heat sink.
    • 电源装置包括第一和第二间隔开的基本上平行的面板,以及基本上垂直于第一和第二面板之间且在其之间设置的底架。 底盘的相对边缘联接到第一和第二面板中的相应边缘,从而将第一和第二面板之间的空间分隔成上部和下部区域。 电源电路包括设置在下部区域中的发热电气部件和设置在上部区域中的非发热部件。 底盘在其中具有开口,并且安装散热器以关闭底盘中的开口。 电源电路的半导体模块安装在面向散热器上部区域的表面上。