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    • 2. 发明授权
    • Jet cooling apparatus for cooling electronic equipment and computer
having the same mounted thereon
    • 用于冷却电子设备的喷射冷却装置和安装在其上的计算机
    • US5428503A
    • 1995-06-27
    • US317614
    • 1994-09-26
    • Hitoshi MatsushimaToshihiro KomatuYoshihiro KondouToshio HatadaSusumu IwaiTetsuro HonmaToshiki IinoTakao OhbaAkira Yamagiwa
    • Hitoshi MatsushimaToshihiro KomatuYoshihiro KondouToshio HatadaSusumu IwaiTetsuro HonmaToshiki IinoTakao OhbaAkira Yamagiwa
    • H05K7/20
    • H05K7/20154Y10S165/908
    • A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.
    • 一种用于电子设备的冷却装置,用于通过使安装在电子设备上的发热装置的温度分布均匀,更具体地在计算机上,并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道,并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此,冷却空气可以集中以局部冷却印刷电路板,包括产生大热值的热的装置。 因此,能够使发热元件的温度上升均匀。
    • 3. 发明申请
    • SUBSTRATE INSPECTION DEVICE AND SUBSTRATE INSPECTION METHOD
    • 基板检查装置和基板检查方法
    • US20100060889A1
    • 2010-03-11
    • US12540825
    • 2009-08-13
    • Susumu IwaiNoboru Kato
    • Susumu IwaiNoboru Kato
    • G01N21/88
    • G01N21/896
    • A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.
    • 基板检查方法包括以下步骤。 基板依次移动,同时包括投光系统和光接收系统的光学系统在与每个基板的移动方向正交的方向上移动,以便通过检查来改变扫描的每个基板的扫描区域 光从与投影系统的基板的移动方向正交的方向上具有特定宽度的光; 对于每个扫描区域存储扫描区域中的基板的检查缺陷的数据; 并且利用对每个基板的相同扫描区域中的基板的缺陷的新检查数据更新存储的扫描区域中的基板的缺陷数据,并且基于缺陷的数据产生一个基板的缺陷数据 的多个扫描区域中的基板。
    • 5. 发明授权
    • Substrate inspection device and substrate inspection method
    • 基板检查装置和基板检查方法
    • US07830502B2
    • 2010-11-09
    • US12540825
    • 2009-08-13
    • Susumu IwaiNoboru Kato
    • Susumu IwaiNoboru Kato
    • G01N21/88
    • G01N21/896
    • A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.
    • 基板检查方法包括以下步骤。 基板依次移动,同时包括投光系统和光接收系统的光学系统在与每个基板的移动方向正交的方向上移动,以便通过检查来改变扫描的每个基板的扫描区域 光从与投影系统的基板的移动方向正交的方向上具有特定宽度的光; 对于每个扫描区域存储扫描区域中的基板的检查缺陷的数据; 并且利用对每个基板的相同扫描区域中的基板的缺陷的新检查数据更新存储的扫描区域中的基板的缺陷数据,并且基于缺陷的数据产生一个基板的缺陷数据 的多个扫描区域中的基板。
    • 7. 发明授权
    • Electronic equipment and lap-top type electronic equipment
    • 电子设备和膝上型电子设备
    • US5646824A
    • 1997-07-08
    • US489623
    • 1995-06-12
    • Shigeo OhashiToshio HatadaTakeo TanakaSusumu Iwai
    • Shigeo OhashiToshio HatadaTakeo TanakaSusumu Iwai
    • F28D15/02G06F1/20H01L23/473H05K7/20
    • G06F1/203F28D15/00F28D15/0266H01L23/473G06F2200/201H01L2924/0002
    • A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.
    • 具有热接收侧的扁平头部安装在安装在电路板上的半导体元件上。 具有热接收侧的集管连接到具有附接到多个散热片的热接收侧的另一个集管,以形成散热片安装在电子设备主体的周边部分的散热片。 由半导体元件产生的热量通过液体通过柔性管在集管之间移动,然后传递到散热片,热量被排放到设备本体外部。 由于使用扁平形的集管和柔性管,因此即使在许多半导体元件安装在小空间内的情况下,高发热半导体元件和散热片也容易热连接而不受设备的结构条件的影响。