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1. 发明申请

US20080076276A1 Printed Board And Manufacturing Method Thereof 失效
标题翻译：印刷板及其制造方法
公开(公告)号：US20080076276A1
公开(公告)日：2008-03-27
申请号：US11792611
申请日：2005-02-28
申请人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
发明人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
IPC分类号： H01R12/00
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/056 , H05K3/4069 , H05K3/4641 , H05K2201/0323 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
摘要： A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
摘要翻译：印刷电路板能够高效率地冷却电子部件，而不需要散热器来冷却电子部件，同时防止电子装置的大型化。还公开了一种高效率地制造印刷电路板的方法。由于主要由碳制成并且具有优异的导热性的碳层以层叠形式设置在绝缘体内或绝缘体的表面上，所以当电子部件通电时由电子部件产生的热量被传导到碳层，扩散通过碳层，然后辐射到外面。因此，电子部件产生的热量可以通过热传导到碳层而被可靠地辐射，并且通过碳层进行热扩散，从而以高效率冷却电气部件。

2. 发明授权

US07479013B2 Printed board and manufacturing method thereof 失效
标题翻译：印刷电路板及其制造方法
公开(公告)号：US07479013B2
公开(公告)日：2009-01-20
申请号：US11792611
申请日：2005-02-28
申请人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
发明人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
IPC分类号： H01R12/00
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/056 , H05K3/4069 , H05K3/4641 , H05K2201/0323 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
摘要： A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
摘要翻译：印刷电路板能够高效率地冷却电子部件，而不需要散热器来冷却电子部件，同时防止电子装置的大型化。还公开了一种高效率地制造印刷电路板的方法。由于主要由碳制成并且具有优异的导热性的碳层以层叠形式设置在绝缘体内或绝缘体的表面上，所以当电子部件通电时由电子部件产生的热量被传导到碳层，扩散通过碳层，然后辐射到外面。因此，电子部件产生的热量可以通过热传导到碳层而被可靠地辐射，并且通过碳层进行热扩散，从而以高效率冷却电气部件。

3. 发明申请

US20080282538A1 Print board and manufacturing method thereof 审中-公开
标题翻译：印刷板及其制造方法
公开(公告)号：US20080282538A1
公开(公告)日：2008-11-20
申请号：US12157455
申请日：2008-06-11
申请人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
发明人： Masanori Takezaki , Masayuki Komaru , Haruki Nitta , Takafumi Yagi , Yoshiyuki Mizuno
IPC分类号： H01K3/10
CPC分类号： H05K1/0207 , H05K1/0206 , H05K1/056 , H05K3/4069 , H05K3/4641 , H05K2201/0323 , H05K2203/1152 , Y10T29/49128 , Y10T29/49165
摘要： A method for manufacturing such a printed board with high efficiency is disclosed. The printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
摘要翻译：公开了一种高效率地制造印刷电路板的方法。印刷电路板能够高效率地冷却电子部件，而不需要散热器来冷却电子部件，同时防止电子装置的大型化。由于主要由碳制成并且具有优异的导热性的碳层以层叠形式设置在绝缘体内或绝缘体的表面上，所以当电子部件通电时由电子部件产生的热量被传导到碳层，扩散通过碳层，然后辐射到外面。因此，电子部件产生的热量可以通过热传导到碳层而被可靠地辐射，并且通过碳层进行热扩散，从而以高效率冷却电气部件。

4. 发明申请

US20100032484A1 Card Identification Device, Card Identification Method, Program, and Information Recording Medium 有权
标题翻译：卡识别装置，卡识别方法，程序和信息记录介质
公开(公告)号：US20100032484A1
公开(公告)日：2010-02-11
申请号：US12445178
申请日：2007-10-12
申请人： Haruki Nitta
发明人： Haruki Nitta
IPC分类号： G06F3/041
CPC分类号： G06K19/063 , A63F1/18 , A63F2001/025 , A63F2009/241 , A63F2009/2422 , G06F3/041 , G06K2019/06271
摘要： Aimed is easy locating of a card placed on a touch panel, when identifying card type by sliding a touch pen, etc. along card slits. When a reference slit determining unit (404) of a card identification device (401) determines that a locus input from a touch panel unit (402) matches a reference slit, a slit region display control unit (405) displays longest slit regions images in which value slits are to be included on an image display unit (403). When a value slit determining unit (406) determines that a locus input thereafter matches any value slit, an input-finished slit display control unit (409) displays the image of the identified value slit on the image display unit (403), overlaying it on the longest slit region. When all value slits are identified, a card identifying unit (407) identifies the card type based on types of the identified value slits, and outputs it.
摘要翻译：通过沿着卡片狭缝滑动触摸笔等来识别卡类型时，易于定位放置在触摸面板上的卡。当卡识别装置（401）的基准狭缝确定单元（404）确定从触摸面板单元（402）输入的轨迹与参考狭缝相匹配时，狭缝区域显示控制单元（405）将最长的狭缝区域图像显示在这些值将被包括在图像显示单元（403）中。当值狭缝确定单元（406）确定其后输入的轨迹匹配任何值狭缝时，输入完成狭缝显示控制单元（409）在图像显示单元（403）上显示识别值狭缝的图像，将其重叠在最长的狭缝区域。当识别出所有值狭缝时，卡识别单元（407）基于识别的值狭缝的类型来识别卡类型，并将其输出。

5. 发明授权

US08157170B2 Card identification device, card identification method, program, and information recording medium 有权
标题翻译：卡识别装置，卡识别方法，程序和信息记录介质
公开(公告)号：US08157170B2
公开(公告)日：2012-04-17
申请号：US12445178
申请日：2007-10-12
申请人： Haruki Nitta
发明人： Haruki Nitta
IPC分类号： G06K7/00
CPC分类号： G06K19/063 , A63F1/18 , A63F2001/025 , A63F2009/241 , A63F2009/2422 , G06F3/041 , G06K2019/06271
摘要： Aimed is easy locating of a card placed on a touch panel, when identifying card type by sliding a touch pen, etc. along card slits. When a reference slit determining unit (404) of a card identification device (401) determines that a locus input from a touch panel unit (402) matches a reference slit, a slit region display control unit (405) displays longest slit regions images in which value slits are to be included on an image display unit (403). When a value slit determining unit (406) determines that a locus input thereafter matches any value slit, an input-finished slit display control unit (409) displays the image of the identified value slit on the image display unit (403), overlaying it on the longest slit region. When all value slits are identified, a card identifying unit (407) identifies the card type based on types of the identified value slits, and outputs it.
摘要翻译：通过沿着卡片狭缝滑动触摸笔等来识别卡类型时，易于定位放置在触摸面板上的卡。当卡识别装置（401）的基准狭缝确定单元（404）确定从触摸面板单元（402）输入的轨迹与参考狭缝相匹配时，狭缝区域显示控制单元（405）将最长的狭缝区域图像显示在这些值将被包括在图像显示单元（403）中。当值狭缝确定单元（406）确定其后输入的轨迹匹配任何值狭缝时，输入完成狭缝显示控制单元（409）在图像显示单元（403）上显示识别值狭缝的图像，将其重叠在最长的狭缝区域。当识别出所有值狭缝时，卡识别单元（407）基于识别的值狭缝的类型来识别卡类型，并将其输出。

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