专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090034760A1 ELECTRONIC COMPONENT, FABRICATION METHOD FOR THE SAME AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开
标题翻译：电子元件，其制造方法和具有该电子元件的电子器件
公开(公告)号：US20090034760A1
公开(公告)日：2009-02-05
申请号：US12180875
申请日：2008-07-28
申请人： Masanori MINAMIO , Yoshihiro Tomita , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Yoshihiro Tomita , Toshiyuki Fukuda
IPC分类号： H04R1/00
CPC分类号： H04R19/016 , H01G7/02 , H01L2224/48091 , H01L2224/48137 , H01L2924/01322 , H01L2924/1461 , H01L2924/3025 , H04R19/005 , H04R2499/11 , H01L2924/00 , H01L2924/00014
摘要： The electronic component includes: a fixed film; a vibration film facing the fixed film; a first electrode formed on the fixed film and having at least one first through hole in the center portion; and a second electrode formed on a portion of the vibration film corresponding to the first electrode and having at least one second through hole in the peripheral portion. An air gap communicating with the first and second through holes is formed between the fixed film and the vibration film and surrounded with a rib. At least one side hole is provided to extend in the rib surrounding the air gap from the air gap toward outside.
摘要翻译：电子部件包括：固定膜; 面向固定膜的振动膜; 第一电极，形成在所述固定膜上并且在所述中心部分中具有至少一个第一通孔; 以及第二电极，形成在所述振动膜的与所述第一电极对应的部分上，并且在所述周边部分中具有至少一个第二通孔。在固定膜和振动膜之间形成有与第一和第二通孔连通的气隙，并且被肋条包围。至少一个侧孔设置成在从气隙朝向外侧的气隙周围的肋中延伸。

2. 发明申请

US20100190287A1 SEMICONDUCTOR IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：半导体图像传感器及其制造方法
公开(公告)号：US20100190287A1
公开(公告)日：2010-07-29
申请号：US12717513
申请日：2010-03-04
申请人： Masanori MINAMIO , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Toshiyuki Fukuda
IPC分类号： H01L31/0232 , H01L21/78 , H01L21/50 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor image sensor includes: a semiconductor imaging element including an imaging area, a peripheral circuit area, and an electrode area; cylindrical electrodes provided on electrode terminals so as to be electrically connected with an external device; and a transparent resin layer provided on the upper surface of the semiconductor imaging element. The upper surface of each cylindrical electrode and the upper surface of the transparent resin layer are substantially of the same height.
摘要翻译：半导体图像传感器包括：半导体成像元件，包括成像区域，外围电路区域和电极区域; 设置在电极端子上以与外部装置电连接的圆柱形电极; 以及设置在半导体摄像元件的上表面上的透明树脂层。每个圆柱形电极的上表面和透明树脂层的上表面基本上具有相同的高度。

3. 发明申请

US20080304790A1 OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：光学装置及其制造方法
公开(公告)号：US20080304790A1
公开(公告)日：2008-12-11
申请号：US12191639
申请日：2008-08-14
申请人： Masanori MINAMIO , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Toshiyuki Fukuda
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , Y10T29/49172 , H01L2924/00014
摘要： An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member (window member). A wire is buried within the base, and the wire has an internal terminal portion, an external terminal portion, and a midpoint terminal portion. A pad electrode of the optical element chip is connected to the internal terminal portion through a bump, and a pad electrode of the integrated circuit chip is connected to the midpoint terminal portion through a fine metal wire.
摘要翻译：光学装置包括基座，附接到基座的光学元件芯片，附接到光学元件芯片的背面上的集成电路芯片以及透光构件（窗口构件）。电线埋设在基座内，电线具有内部端子部分，外部端子部分和中点端子部分。光学元件芯片的焊盘电极通过凸块连接到内部端子部分，并且集成电路芯片的焊盘电极通过细金属线连接到中点端子部分。

4. 发明申请

US20090242940A1 SENSOR DEVICE AND FABRICATION METHOD FOR THE SAME 有权
标题翻译：传感器装置及其制造方法
公开(公告)号：US20090242940A1
公开(公告)日：2009-10-01
申请号：US12404923
申请日：2009-03-16
申请人： Masanori MINAMIO , Yoshihiro Tomita
发明人： Masanori MINAMIO , Yoshihiro Tomita
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： H01L21/67248 , H01L21/67063
摘要： The sensor device includes: a converter body made of silicon in the shape of a rhombus in plan, the converter body having an opening in the shape of a hexagon in plan; a substrate for holding the converter body; a movable film formed on the opening; a converter electrode formed on the converter body; and a substrate electrode formed on the substrate, the substrate electrode being electrically connected with the converter electrode. The opening is placed so that four of the six sides of the hexagon extend along the four sides of the rhombus of the converter body.
摘要翻译：该传感器装置包括：平面内呈菱形形状的硅转换体，该转换体具有平面形状的六边形开口; 用于保持转换器主体的基板; 形成在开口上的可动膜; 形成在所述转换器主体上的转换器电极; 以及形成在所述基板上的基板电极，所述基板电极与所述转换器电极电连接。放置开口使得六边形的六个边中的四个沿着转换器主体的菱形的四边延伸。

5. 发明申请

US20090086769A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20090086769A1
公开(公告)日：2009-04-02
申请号：US12186979
申请日：2008-08-06
申请人： Masanori MINAMIO , Noriyuki Yoshikawa , Shinichi Ijima , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Noriyuki Yoshikawa , Shinichi Ijima , Toshiyuki Fukuda
IPC分类号： H01S3/30
CPC分类号： B82Y20/00 , G11B7/127 , H01L2224/48091 , H01S5/0021 , H01S5/0071 , H01S5/02212 , H01S5/02216 , H01S5/02224 , H01S5/02248 , H01S5/02292 , H01S5/024 , H01S5/02476 , H01S5/028 , H01S5/34333 , H01L2924/00014
摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.
摘要翻译：半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。

6. 发明申请

US20080303107A1 OPTICAL DEVICE AND METHOD FOR FABRICATING THE SAME, CAMERA MODULE USING OPTICAL DEVICE, AND ELECTRONIC EQUIPMENT MOUNTING CAMERA MODULE 有权
标题翻译：光学装置及其制造方法，使用光学装置的相机模块和电子设备安装相机模块
公开(公告)号：US20080303107A1
公开(公告)日：2008-12-11
申请号：US12045522
申请日：2008-03-10
申请人： Masanori MINAMIO , Yoshiki Takayama , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Yoshiki Takayama , Toshiyuki Fukuda
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14627 , H01L27/14632 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/13 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48464 , H01L2924/00014 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.
摘要翻译：光学装置包括：光接收元件芯片，其具有：形成在基板的主平面上并通过布置多个光接收像素而制成的有源区; 设置在所述有源区域的外周的电路区域; 穿透导体，其设置成在所述基板的厚度方向上穿透所述基板; 以及外部连接端子，其设置在所述基板的与所述基板的主面相对的背面，并与所述贯通导体连接。光学器件还包括形成在平坦化膜上的微透镜，平坦化膜和透明保护膜。

7. 发明申请

US20100048017A1 BONDED STRUCTURE AND BONDING METHOD 有权
标题翻译：粘结结构和粘结方法
公开(公告)号：US20100048017A1
公开(公告)日：2010-02-25
申请号：US12614170
申请日：2009-11-06
申请人： Masanori MINAMIO , Hiroaki FUJIMOTO , Atsuhito MIZUTANI , Hisaki FUJITANI , Toshiyuki FUKUDA
发明人： Masanori MINAMIO , Hiroaki FUJIMOTO , Atsuhito MIZUTANI , Hisaki FUJITANI , Toshiyuki FUKUDA
IPC分类号： H01L21/60
CPC分类号： H01L24/85 , H01L21/2007 , H01L21/563 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/45 , H01L24/48 , H01L24/81 , H01L2224/0401 , H01L2224/04042 , H01L2224/05644 , H01L2224/13099 , H01L2224/13124 , H01L2224/16225 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48455 , H01L2224/4847 , H01L2224/48599 , H01L2224/48644 , H01L2224/48699 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83102 , H01L2224/85 , H01L2224/85205 , H01L2224/92125 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2224/78 , H01L2924/00 , H01L2224/48744 , H01L2924/00015
摘要： An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.
摘要翻译：通过将铝线压靠在硅电极上的楔形工具将铝线结合到硅电极。以这种方式，通过依次层叠铝，氧化铝，氧化硅和硅来获得牢固结合的结构。

8. 发明申请

US20110083322A1 OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20110083322A1
公开(公告)日：2011-04-14
申请号：US12970407
申请日：2010-12-16
申请人： Masanori MINAMIO , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译：光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。密封剂位于比半透明组件的顶表面更低的位置。半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

9. 发明申请

US20100014262A1 MODULE WITH EMBEDDED ELECTRONIC COMPONENTS 有权
标题翻译：嵌入式电子元件组件
公开(公告)号：US20100014262A1
公开(公告)日：2010-01-21
申请号：US12566186
申请日：2009-09-24
申请人： Masanori MINAMIO , Hideki TAKEHARA , Yoshiyuki ARAI , Toshiyuki FUKUDA
发明人： Masanori MINAMIO , Hideki TAKEHARA , Yoshiyuki ARAI , Toshiyuki FUKUDA
IPC分类号： H05K1/16 , H05K5/00 , H05K1/18
CPC分类号： H05K3/284 , H05K3/3442 , H05K2201/0191 , H05K2201/10636 , Y02P70/611
摘要： In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.
摘要翻译：在具有嵌入式电子部件的模块中，在基板的部件安装面上形成有连接电极。每个电子部件的电极部分被放置在各个连接电极上，并通过使用焊料与固定的关系连接。电子部件被封装在封装树脂中。当将每个电子部件的主体部分的下表面与部件安装表面之间的距离假设为a，并且封装树脂的位于电子部件的主体部分上方的部分的厚度假定为b，如果b / a设定为不大于6的值，则当具有嵌入式电子部件的模块被回流安装在印刷布线基板等上时，可以防止发生由焊料的熔化和流动导致的短路故障，这导致两个电极部分之间的短路。

10. 发明申请

US20090130801A1 RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：树脂封装的半导体器件和引线框架及其制造方法
公开(公告)号：US20090130801A1
公开(公告)日：2009-05-21
申请号：US12355075
申请日：2009-01-16
申请人： Toshiyuki FUKUDA , Masanori MINAMIO , Hiroaki FUJIMOTO , Ryuichi SAHARA , Kenichi ITOU
发明人： Toshiyuki FUKUDA , Masanori MINAMIO , Hiroaki FUJIMOTO , Ryuichi SAHARA , Kenichi ITOU
IPC分类号： H01L21/768 , B32B37/00
CPC分类号： H01L23/3107 , H01L21/565 , H01L21/566 , H01L23/495 , H01L23/49503 , H01L23/4952 , H01L23/49548 , H01L23/645 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/105 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16245 , H01L2224/16257 , H01L2224/16258 , H01L2224/32145 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73253 , H01L2224/73265 , H01L2224/81385 , H01L2224/95001 , H01L2224/97 , H01L2225/1029 , H01L2225/1058 , H01L2924/00011 , H01L2924/00014 , H01L2924/01037 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/12042 , H01L2924/15331 , H01L2924/15787 , H01L2924/181 , H01L2924/18161 , H01L2924/19104 , Y10T156/10 , H01L2924/00012 , H01L2224/81 , H01L2224/48145 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/01033
摘要： There are provided a lead frame including a plurality of first external terminal portions 5 provided on a plane, inner lead portions 6 formed of back surfaces of the respective first external terminal portions and arranged so as to surround a region inside the inner lead portions, and second external terminal portions 7 formed of uppermost surfaces of convex portions positioned outside the respective inner lead portions; a semiconductor element 2 flip-chip bonded to the inner lead portions via bumps 3; and an encapsulating resin 4 encapsulating surroundings of the semiconductor element and the inner lead portions. The first external terminal portions are arranged in a lower surface region of the encapsulating resin along a periphery of the region, and the second external terminal portions are exposed on an upper surface of the encapsulating resin. A plurality of terminals 8 for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.
摘要翻译：设置有引线框架，该引线框架包括设置在平面上的多个第一外部端子部分5，由各个第一外部端子部分的后表面形成的内部引线部分6，其布置成围绕内部引线部分内的区域; 由位于相应的内部引线部分外部的凸起部分的最上表面形成的第二外部端子部分7; 半导体元件2通过凸块3接合到内引线部分; 以及封装树脂4，其封装半导体元件和内引线部分的周围。第一外部端子部分沿着该区域的周边布置在封装树脂的下表面区域中，并且第二外部端子部分暴露在封装树脂的上表面上。用于电连接的多个端子8以第一外部端子部分内的区域中的网格图案设置并暴露在封装树脂的下表面上。可以并入多个半导体元件或线圈和电阻器，并且可以堆叠另外的半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式