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    • 1. 发明授权
    • Bipolar transistor and method of producing the same
    • 双极晶体管及其制造方法
    • US4965650A
    • 1990-10-23
    • US420656
    • 1989-10-11
    • Masanori InadaKazuo EdaYorito OtaAtsushi NakagawaManabu Yanagihara
    • Masanori InadaKazuo EdaYorito OtaAtsushi NakagawaManabu Yanagihara
    • H01L21/331H01L29/08H01L29/417H01L29/737
    • H01L29/66318H01L29/0804H01L29/41708H01L29/7371Y10S148/01Y10S148/072
    • A dummy emitter (a dummy collector, in an inverted type) is formed in the portion corresponding to an emitter (a collector, in the inverted type) region, on a multiplayer structural material including layers for forming emitter, base and collector, and using it as mask, an external base region is exposed by etching, and a projection of the emitter (the collector, in the inverted type) region is formed, while the dummy emitter (the dummy collector, in the inverted type) is inverted into an emitter (a collector, in the inverted type) electrode, thereby forming an emitter (a collector, in the inverted type) electrode metal layer covering the whole upper surface of the emitter (the collector, in the inverted type). Using the thus formed emitter (the collector, in the inverted type) electrode metal layer, a base electrode metal layer is formed, by self-alignment, adjacent to the emitter (the collector, in the inverted type). In another method, on a multilayer structural material, impurities are introduced outside the portion corresponding to the base region of a bipolar transistor in order to insulate, at least, a portion of the layer forming the base, and if necessary a portion of the layer forming the emitter and a portion of the layer forming the collector. Further, an extension layers and the layer forming the collector, and an extension type dummy emitter (a dummy collector, in the inverted type) is formed which extends from the emitter (the collector, in the inverted type) on the base portion to the insulating region formed by transforming from the semiconductor material forming the base, and using it as mask, the external base region is exposed to form an emitter-including layer and the dummy emitter (the dummy collector, in the inverted type) is replaced by an emitter (a collector, in the inverted type) electrode metal layer covering the whole upper surface of the emitter-including layer.
    • 3. 发明授权
    • Method of manufacturing semiconductor device
    • 制造半导体器件的方法
    • US5037769A
    • 1991-08-06
    • US330956
    • 1989-03-28
    • Masanori InadaKazuo EdaYorito Ota
    • Masanori InadaKazuo EdaYorito Ota
    • H01L29/36H01L29/737
    • H01L29/36H01L29/7371Y10S148/01Y10S148/072
    • A semiconductor device of a multilayer structure comprising semiconductor materials of different properties manufactured by using at least a step of epitaxially forming a semiconductor material layer on a substrate and a passivation film layer thereover, a step of introducing impurities into specific portions of the epitaxially formed semiconductor material layer and a step of removing the passivation film layer formed directly above the epitaxially formed semiconductor material layer within an epitaxial device and then applying epitaxial growing. Impurities introduced additionally to specific portions of the layer inside are substantially eliminated at the boundary adjacent the layer above the region introduced with impurities and the properties of the thus-produced semiconductors vary abruptly at the boundary between the layer in which the impurities are introduced and the layer thereabove. The material used for the passivation film layer comprises one that can be epitaxially formed and easily removed at a temperature and in a atmosphere under which the epitaxially formed layer below the passivation film are not decomposed or evaporized.
    • 一种多层结构的半导体器件,包括通过至少在衬底上外延形成半导体材料层的步骤和其上的钝化膜层而制造的具有不同性质的半导体材料,将杂质引入外延形成的半导体的特定部分 材料层和去除在外延装置内的外延形成的半导体材料层正上方形成的钝化膜层,然后施加外延生长的步骤。 在与内部区域相邻的边界处附近引入的层的特定部分的杂质基本上消除,并且由此产生的半导体的性质在其中引入杂质的层与其之间的边界处突然变化 层以上。 用于钝化膜层的材料包括可以在外部形成的并且在钝化膜下面的外延形成层不分解或蒸发的温度和气氛中容易除去的材料。
    • 10. 发明授权
    • Balanced type surface acoustic wave device
    • 平衡型声表面波装置
    • US5892418A
    • 1999-04-06
    • US898769
    • 1997-07-23
    • Keiji OnishiKazuo EdaYutaka TaguchiShunichi Seki
    • Keiji OnishiKazuo EdaYutaka TaguchiShunichi Seki
    • H03H9/25H03H9/00H03H9/64
    • H03H9/6436H03H9/0038H03H9/0042H03H9/1071H03H9/6433
    • The present invention provides surface acoustic wave devices which do not require a balanced-to-unbalanced transformer circuit regardless of the type of the peripheral circuits of the balanced type surface acoustic wave filter, i.e. a balanced type device or an unbalanced type. A transmitting interdigital transducer and a receiving interdigital transducer are formed on a substrate comprising 41.degree. Y cut-X propagation lithium niobate. A balanced type surface acoustic wave filter is formed on a substrate comprising 36.degree. Y cut-X propagation lithium tantalate. The balanced type surface acoustic wave filter comprises two series-arm surface acoustic wave resonators and two crossed-arm surface acoustic wave resonators connected in a lattice. The substrate on which the transmitting interdigital transducer and the receiving interdigital transducer are formed and the substrate on which the balanced type surface acoustic wave filter is formed are located in a ceramic package. One of the input terminals of the transmitting interdigital transducer is grounded. The output terminals of the receiving interdigital transducer are connected to the input terminals of the balanced type surface acoustic wave filter.
    • 本发明提供了不需要平衡型不平衡变压器电路的表面声波装置,而不管平衡型表面声波滤波器的外围电路的类型,即平衡型装置或不平衡型。 在包含41°Y切割X传播铌酸锂的基板上形成发射叉指式换能器和接收叉指式换能器。 在包含36°Y切割X传播的钽酸锂的基板上形成平衡型表面声波滤波器。 平衡型表面声波滤波器包括两个串联臂表面声波谐振器和两个以格子连接的交叉臂表面声波谐振器。 其上形成有发送叉指式换能器和接收叉指式换能器的基板和形成有平衡型表面声波滤波器的基板位于陶瓷封装中。 发射叉指式换能器的输入端之一接地。 接收叉指式换能器的输出端连接到平衡型声表面波滤波器的输入端。