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1. 发明申请

US20090225304A1 ELECTRONIC COMPONENT MOUNTING APPARATUS, HEIGHT DETECTION METHOD FOR ELECTRONIC COMPONENT, AND OPTICAL-AXIS ADJUSTMENT METHOD FOR COMPONENT HEIGHT DETECTION UNIT 有权
标题翻译：电子元件安装设备，电子元件高度检测方法和分量高度检测单元的光轴调整方法
公开(公告)号：US20090225304A1
公开(公告)日：2009-09-10
申请号：US11994618
申请日：2006-06-29
申请人： Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
发明人： Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
IPC分类号： G01B11/02 , G06F15/00
CPC分类号： H05K13/0452 , H05K13/0812
摘要： An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.
摘要翻译：一种电子部件安装装置，包括用于投射激光束的光束投射器，与光束投影仪相对放置并且接收从投影仪投射的激光束的光束接收器，用于调节光的光接收灵敏度设定单元射束接收器的接收灵敏度，设置在射束投影仪中的投影侧孔口，以减小激光束的投影光点直径，以及设置在光束接收器中的接收侧孔口，以缩小光接收光斑直径，其中光束接收机的光接收灵敏度得到改善。结果，可以提供能够通过使用相对便宜的光电传感器来精确地检测小部件的高度尺寸的电子部件安装装置。

2. 发明授权

US07684061B2 Electronic component mounting apparatus, height detection method for electronic component, and optical-axis adjustment method for component height detection unit 有权
标题翻译：电子部件安装装置，电子部件的高度检测方法以及部件高度检测部的光轴调整方法
公开(公告)号：US07684061B2
公开(公告)日：2010-03-23
申请号：US11994618
申请日：2006-06-29
申请人： Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
发明人： Masanori Hiyoshi , Hidehiro Saho , Noboru Yamasaki , Tadashi Endo
IPC分类号： G01B11/06 , G01B11/02
CPC分类号： H05K13/0452 , H05K13/0812
摘要： An electronic component mounting apparatus includes a beam projector for projecting a laser beam, a beam receiver which is placed in opposition to the beam projector and which receives a laser beam projected from the beam projector, a light-reception-sensitivity setting unit for adjusting light-reception sensitivity of the beam receiver, a projection-side orifice provided in the beam projector to narrow a projection spot diameter of the laser beam, and a reception-side orifice provided in the beam receiver to narrow a light-reception spot diameter, where the light-reception sensitivity of the beam receiver is improved. As a result, an electronic component mounting apparatus capable of accurately detecting height size of small components by using a relatively inexpensive photoelectric sensor can be provided.
摘要翻译：一种电子部件安装装置，包括用于投射激光束的光束投射器，与光束投影仪相对放置并且接收从投影仪投射的激光束的光束接收器，用于调节光的光接收灵敏度设定单元射束接收器的接收灵敏度，设置在射束投影仪中的投影侧孔口，以减小激光束的投影光点直径，以及设置在光束接收器中的接收侧孔口，以缩小光接收光斑直径，其中光束接收机的光接收灵敏度得到改善。结果，可以提供能够通过使用相对便宜的光电传感器来精确地检测小部件的高度尺寸的电子部件安装装置。

3. 发明申请

US20090321499A1 ELECTRONIC COMPONENT MOUNTING APPARATUS AND ELECTRONIC COMPONENT MOUNTING METHOD 失效
标题翻译：电子元件安装设备和电子元件安装方法
公开(公告)号：US20090321499A1
公开(公告)日：2009-12-31
申请号：US12439282
申请日：2007-08-23
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
IPC分类号： B23K31/02 , B23K3/06 , B23K37/00
CPC分类号： H05K3/3484 , H05K2201/035 , H05K2201/10674 , H05K2201/10734 , H05K2203/0139 , H05K2203/0338
摘要： The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.
摘要翻译：本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。本发明的电子部件安装装置具有：水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10，从而在转印面13上铺展厚度为相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18，其存储限定凸起高度，糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b，其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。

4. 发明申请

US20140150256A1 TAPE FEEDER, COMPONENT MOUNTING APPARATUS, AND COMPONENT MOUNTING METHOD 有权
标题翻译：胶带进料器，组件安装装置和组件安装方法
公开(公告)号：US20140150256A1
公开(公告)日：2014-06-05
申请号：US14234792
申请日：2012-08-16
申请人： Kazunori Kanai , Masanori Hiyoshi , Shigekazu Yoneyama , Satoshi Kawaguchi
发明人： Kazunori Kanai , Masanori Hiyoshi , Shigekazu Yoneyama , Satoshi Kawaguchi
IPC分类号： H05K13/02
CPC分类号： H05K13/02 , H05K13/0417 , H05K13/0419 , Y10T29/4913 , Y10T29/53174
摘要： A size S1 of each of projections 32b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20, and a size S2 of each of the projections 32b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.
摘要翻译：在带状构件20的行进方向上设置在链轮32的外周上的每个突起32b的每个突起32b的尺寸S1在每个突起32b与带构件20的每个馈送孔22接合的高度处较大比带构件20的每个馈送孔22的直径D和每个突起32b在与带构件20的行进方向垂直的方向上的尺寸S2在每个突起32b为高度的高度处与带构件20的每个供给孔22接合的距离小于带构件20的每个供给孔22的直径D。

5. 发明授权

US08152049B2 Electronic component mounting apparatus and electronic component mounting method 失效
标题翻译：电子元件安装装置和电子元件安装方法
公开(公告)号：US08152049B2
公开(公告)日：2012-04-10
申请号：US12439282
申请日：2007-08-23
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
IPC分类号： B23K35/12 , B23K1/00
CPC分类号： H05K3/3484 , H05K2201/035 , H05K2201/10674 , H05K2201/10734 , H05K2203/0139 , H05K2203/0338
摘要： The present invention aims at providing an electronic component mounting apparatus and an electronic component mounting method that perform automated setting of a thickness of a paste film.The electronic component mounting apparatus of the present invention has a paste transfer unit 10 that horizontally, relatively moves a squeegee 11b and a transfer surface 13 with respect to each other, thereby spreading, over the transfer surface 13, a paste film 3 whose thickness is equivalent to the height of a squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13; a storage unit 18 that stores a database defining correlation among bump heights, paste types, and squeegee-gap heights; a computing unit 20 that derives, from the database, a squeegee-gap height G21 in correspondence with a height H1 of a bump of an electronic component to be mounted and a type P2 of paste to be transferred; and a vertical movement mechanism 16b that adjusts the height of the squeegee gap “c” formed from clearance between the squeegee 11b and the transfer surface 13 to a derived squeegee-gap height.
摘要翻译：本发明的目的在于提供一种执行膏膜厚度的自动设定的电子部件安装装置和电子部件安装方法。本发明的电子部件安装装置具有：水平方向相对于彼此移动刮板11b和转印面13的浆料转印单元10，从而在转印面13上铺展厚度为相当于由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度; 存储单元18，其存储限定凸起高度，糊剂类型和刮刀间隙高度之间的相关性的数据库; 计算单元20从数据库导出与要安装的电子部件的凸起的高度H1相对应的刮板间隙高度G21和待传送的浆料的类型P2; 以及垂直移动机构16b，其将由刮板11b和转印面13之间的间隙形成的刮板间隙“c”的高度调节到衍生的刮刀间隙高度。

6. 发明授权

US07870991B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US07870991B2
公开(公告)日：2011-01-18
申请号：US12377903
申请日：2007-09-06
申请人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
发明人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： H05K3/3484 , H01L2224/81 , H05K3/1216 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
摘要翻译：在具有用于测量印刷在电极上的焊膏的高度的高度测量装置和电子部件放置装置的安装系统中，基于测量焊料的高度的测量结果来确定焊膏的高度是正确还是错误糊状印在电极上。此外，基于判定结果，是否需要焊锡膏向焊料凸块的转印，如果确定需要转印，则将糊剂转印到保持在安装头中的电子部件。由此，可以通过在处理基板上充分地添加一定量的焊料而导致由于印刷失败引起的焊料量的不足而确保安装质量。

7. 发明授权

US07712652B2 Component mounting apparatus and component mounting method 有权
标题翻译：组件安装装置和部件安装方法
公开(公告)号：US07712652B2
公开(公告)日：2010-05-11
申请号：US11743812
申请日：2007-05-03
申请人： Takeshi Morita , Masanori Hiyoshi
发明人： Takeshi Morita , Masanori Hiyoshi
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/743 , H01L24/75 , H01L24/81 , H01L24/95 , H01L25/0657 , H01L25/50 , H01L2224/11822 , H01L2224/13099 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/81011 , H01L2224/81024 , H01L2225/06513 , H01L2225/06517 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01068 , H01L2924/01075 , H01L2924/014 , H05K3/3484 , H05K13/0465 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , Y10T29/4913 , Y10T29/53178 , Y10T29/53183
摘要： First components and second components in which bumps are formed on the lower surface thereof and laminate structures are formed by mounting them to stack with each other on a circuit board 13 are picked up from a component supply unit 1 using a placement head 16, and by lifting and lowering the placement head 16 holding the first components and the second components relative to a paste transfer device 5 supplying a flux 10 in the manner such as coating films having two types of different thicknesses, the flux 10 is supplied to the bumps of the plurality of components in a bundle using a transfer coating method. With such a configuration, it is possible to efficiently perform a component mounting with a satisfactory adhesiveness by ensuring an optimal amount of application quantity of a paste.
摘要翻译：在其下表面上形成凸块的第一部件和第二部件以及通过在电路板13上将它们彼此堆叠而形成的层叠结构通过使用放置头16从部件供应单元1拾取，并且通过提升和降低保持第一部件和第二部件的放置头16相对于以诸如具有两种类型的不同厚度的涂膜的方式供给焊剂10的糊剂传递装置5，将焊剂10供应到使用转印涂布方法的多个组分。通过这样的结构，可以通过确保最佳施用量的浆料来有效地进行具有令人满意的粘合性的部件安装。

8. 发明授权

US09686894B2 Component mounting method using a tape feeder 有权
公开(公告)号：US09686894B2
公开(公告)日：2017-06-20
申请号：US14234792
申请日：2012-08-16
申请人： Kazunori Kanai , Masanori Hiyoshi , Shigekazu Yoneyama , Satoshi Kawaguchi
发明人： Kazunori Kanai , Masanori Hiyoshi , Shigekazu Yoneyama , Satoshi Kawaguchi
IPC分类号： H05K13/02 , H05K13/04
CPC分类号： H05K13/02 , H05K13/0417 , H05K13/0419 , Y10T29/4913 , Y10T29/53174
摘要： A size S1 of each of projections 32b provided on an outer perimeter of a sprocket 32 in a proceeding direction of a tape member 20 at a height where each of the projections 32b is engaged with each of feed holes 22 of the tape member 20 is larger than a diameter D of each of the feed holes 22 of the tape member 20, and a size S2 of each of the projections 32b in a direction perpendicular to the proceeding direction of the tape member 20 at a height where each of the projections 32b is engaged with each of the feed holes 22 of the tape member 20 is smaller than the diameter D of each of the feed holes 22 of the tape member 20.

9. 发明申请

US20100230472A1 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US20100230472A1
公开(公告)日：2010-09-16
申请号：US12377903
申请日：2007-09-06
申请人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
发明人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
IPC分类号： B23K31/12 , B23K3/06 , B23K1/20
CPC分类号： H05K3/3484 , H01L2224/81 , H05K3/1216 , H05K3/3436 , H05K2201/035 , H05K2201/10734 , H05K2203/0338 , H05K2203/163 , Y02P70/613
摘要： In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.
摘要翻译：在具有用于测量印刷在电极上的焊膏的高度的高度测量装置和电子部件放置装置的安装系统中，基于测量焊料的高度的测量结果来确定焊膏的高度是正确还是错误糊状印在电极上。此外，基于判定结果，是否需要焊锡膏向焊料凸块的转印，如果确定需要转印，则将糊剂转印到保持在安装头中的电子部件。由此，可以通过在处理基板上充分地添加一定量的焊料而导致由于印刷失败引起的焊料量的不足而确保安装质量。

10. 发明授权

US07793817B2 Electronic component placing apparatus and electronic component mounting method 有权
标题翻译：电子元件放置装置和电子元件安装方法
公开(公告)号：US07793817B2
公开(公告)日：2010-09-14
申请号：US12438099
申请日：2007-09-06
申请人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
发明人： Kazuo Okamoto , Syoichi Nishi , Takeshi Morita , Masanori Hiyoshi , Kazuhiko Tomoyasu
IPC分类号： B23K31/02 , B23K37/00
CPC分类号： H05K3/3484 , B23K3/0623 , B23K2101/40 , H01L2224/81 , H05K3/3436 , H05K2201/035 , H05K2201/094 , H05K2203/0139 , H05K2203/0338 , Y02P70/613
摘要： To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.
摘要翻译：提供一种电子部件放置装置和电子部件安装方法，其可以通过焊接来安装可能导致翘曲变形的电子部件时发生冷接头。在电子部件放置装置中，电子部件16配置有形成在基板的下表面上的多个焊料凸块16a，具有膜厚分布的膜7a，其根据状态基于表示电子部件的回流工序中的翘曲变形的状态的部件翘曲信息，在糊状物转印部24中形成多个焊料凸块各自的翘曲变形。由此，当通过向每个焊料凸块16a额外提供足够量的焊料，通过焊接来安装可能引起翘曲变形的电子部件时，可以防止发生冷接头。

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