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1. 发明申请

US20130242517A1 COMPONENT ASSEMBLY 有权
标题翻译：组件装配
公开(公告)号：US20130242517A1
公开(公告)日：2013-09-19
申请号：US13616879
申请日：2012-09-14
申请人： Masanori FUJIDAI , Kazuo HATTORI , Isamu FUJIMOTO
发明人： Masanori FUJIDAI , Kazuo HATTORI , Isamu FUJIMOTO
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0271 , H01L23/49822 , H01L23/49827 , H01L23/50 , H01L2224/16225 , H05K1/182 , H05K1/185 , H05K3/4602 , H05K2201/068 , H05K2201/10636 , H05K2201/10674 , Y02P70/611
摘要： A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors.
摘要翻译：可以以高精度容易地构建在主基板中的部件组件被形成为使得嵌入多个电容器的组装基板的内置部件层的玻璃化转变温度高于玻璃化转变温度内置组件衬底的内置组件层。因此，例如在回流时，构成部件组件的内置部件基板被加热时，能够防止部件组件的热变形。因此，组件组件可以高度精确地内置在内置组件衬底中。此外，在嵌入有多个电容器的部件组装体内置于内置部件基板中时，嵌入多个电容器的部件组装体的电极焊盘能够电连接到内置的多个电容器的配线层，尽管电容器之间的高度发生变化，仍然通过焊接进行组件衬底。

2. 发明申请

US20130033836A1 CHIP-COMPONENT STRUCTURE 有权
标题翻译：芯片组件结构
公开(公告)号：US20130033836A1
公开(公告)日：2013-02-07
申请号：US13565876
申请日：2012-08-03
申请人： Kazuo HATTORI , Isamu FUJIMOTO
发明人： Kazuo HATTORI , Isamu FUJIMOTO
IPC分类号： H05K7/02
CPC分类号： H01G4/30 , H01G2/065 , H01G4/232
摘要： A chip-component structure includes an interposer and a multilayer capacitor mounted thereon. The interposer includes a substrate, a component connecting electrode, an external connection electrode, and a side electrode. The component connecting electrode and the external connection electrode are electrically connected by the side electrode. The component connecting electrode is joined to an external electrode of the multilayer capacitor. The substrate includes a communication hole that communicates between opposite spaces opening in both principal surfaces of the substrate.
摘要翻译：芯片组件结构包括安装在其上的中介层和层叠电容器。内插件包括基板，部件连接电极，外部连接电极和侧面电极。部件连接电极和外部连接电极通过侧面电极电连接。部件连接电极与多层电容器的外部电极接合。基板包括连通孔，该连通孔在基板的两个主表面中开口的相对空间之间连通。

3. 发明申请

US20130037911A1 CHIP-COMPONENT STRUCTURE AND METHOD OF PRODUCING SAME 有权
标题翻译：芯片组件结构及其生产方法
公开(公告)号：US20130037911A1
公开(公告)日：2013-02-14
申请号：US13569454
申请日：2012-08-08
申请人： Kazuo HATTORI , Isamu FUJIMOTO
发明人： Kazuo HATTORI , Isamu FUJIMOTO
IPC分类号： H01L29/92 , H01L21/02
CPC分类号： H01G4/232 , H01G2/065 , H01G4/12 , H01L23/13 , H01L23/49805 , H01L28/40 , H01L2924/0002 , H05K1/181 , H05K3/3442 , H05K2201/049 , H05K2201/09181 , H05K2201/099 , H05K2201/10015 , Y02P70/613 , H01L2924/00
摘要： In a chip-component structure, a monolithic ceramic capacitor is a structure including a predetermined number of substantially flat internal electrodes stacked on each other. An interposer includes a substrate larger than the outer shape of the monolithic ceramic capacitor. The substrate includes a first major surface on which first front electrodes for use in mounting the monolithic ceramic capacitor are disposed and a second major surface on which first back electrodes for use in connecting to an external circuit board are disposed. The interposer includes a depression in its side surface. The depression includes a wall surface on which a connection conductor is disposed. The front surface of the substrate is overlaid with resist films extending along its edges.
摘要翻译：在芯片部件结构中，单片陶瓷电容器是包括彼此堆叠的预定数量的基本平坦的内部电极的结构。插入器包括比单片陶瓷电容器的外形大的衬底。基板包括第一主表面，第一主表面设置有用于安装单片陶瓷电容器的第一前电极，并且第二主表面设置有用于连接到外部电路板的第一背电极。插入件包括其侧表面上的凹陷。凹陷包括壁表面，连接导体设置在该壁表面上。衬底的前表面与沿其边缘延伸的抗蚀剂膜重叠。

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