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    • 10. 发明授权
    • Carrier for a double-side polishing apparatus, double-side polishing apparatus using this carrier, and double-side polishing method
    • 用于双面抛光装置的载体,使用该载体的双面抛光装置和双面抛光方法
    • US09327382B2
    • 2016-05-03
    • US12863674
    • 2009-02-16
    • Junichi UenoKazuya SatoSyuichi Kobayashi
    • Junichi UenoKazuya SatoSyuichi Kobayashi
    • B24B37/04B24B37/08B24B37/28B24B37/32
    • B24B37/28B24B37/042B24B37/08
    • A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.
    • 一种用于双面抛光装置的载体,至少包括:金属载体基座,其布置在上下转台之间,具有安装在其上的抛光垫,并具有形成在其中的保持孔,以夹持夹在上下转台之间的晶片 抛光时; 以及环状树脂插入件,其沿着所述承载基座的保持孔的内周部配置并与所述保持晶片的周边部分接触,其中,所述承载器基座的所述保持孔的内周端部 具有向上开口的锥形表面,环形插入件的外周部分相对于承载器基座的保持孔的锥形表面具有倒锥形表面,并且树脂插入件装配在载体的保持孔中 基部通过锥形表面。