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    • 3. 发明授权
    • Method for evaluating photo mask and method for manufacturing semiconductor device
    • 评估光掩膜的方法和制造半导体器件的方法
    • US07229721B2
    • 2007-06-12
    • US10705954
    • 2003-11-13
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • Shoji MimotogiShigeki NojimaOsamu Ikenaga
    • G03F1/00
    • G03F7/70625G03F1/44G03F1/68G03F1/78G03F7/705
    • A method for evaluating a photo mask comprises preparing a photo mask including a unit drawing pattern, finding a dimensional variation relating to the photo mask, the dimensional variation including first and second dimensional variations, the first dimensional variation occurring due to a positional displacement and size mismatch of the unit drawing pattern in the photo mask and the second dimensional variation occurring due to etching and development relating to a manufacturing of the photo mask, estimating a deteriorated amount of an exposure latitude occurring due to the dimensional variation of the photo mask using the dimensional variation and a degree of influence of the dimensional variation for the exposure latitude, and judging quality of the photo mask by comparing the deteriorated amount of the exposure latitude and an allowable deteriorated amount of the exposure latitude.
    • 一种用于评估光掩模的方法包括制备包括单元绘图图案的光掩模,找到与光掩模相关的尺寸变化,包括第一和第二尺寸变化的尺寸变化,由于位置偏移和尺寸而发生的第一尺寸变化 光掩模中的单位绘图图案的不匹配以及由于与光掩模的制造相关的蚀刻和显影而发生的第二尺寸变化,估计由于光掩膜的尺寸变化而产生的曝光宽容度的恶化量, 通过比较曝光宽容度的劣化量和曝光宽容度的允许恶化量来判断曝光宽容度的尺寸变化和影响程度,以及判断光掩模的质量。
    • 6. 发明授权
    • Mask pattern preparation method, semiconductor device manufacturing method and recording medium
    • 掩模图案制备方法,半导体器件制造方法和记录介质
    • US07793252B2
    • 2010-09-07
    • US12222479
    • 2008-08-11
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • G06F17/50G03F9/00
    • G03F7/70433G03F7/705
    • A lithography simulation method includes: taking in design data of a pattern to be formed on a substrate and mask data to prepare a mask pattern used in forming a latent image of the pattern on the substrate by transmission of an energy ray; obtaining the latent image of the pattern by calculation of an intensity of the energy ray; locally changing, at least in a portion corresponding to a pattern to be interested, a relative position in a direction of the intensity of the energy ray between a latent image curve and a reference intensity line in accordance with a distance between the pattern to be interested and a pattern of a neighboring region, the latent image curve being an intensity distribution curve of the energy ray constituting the latent image, the reference intensity line being defined to specify a position of an edge of the pattern to be interested; and calculating a distance between intersections of a portion of the latent image curve corresponding to the pattern to be interested and the reference intensity line in the changed relative position to define an interested line width of the pattern to be interested.
    • 光刻模拟方法包括:获取要在基板上形成的图案的设计数据,并且掩模数据,以通过透射能量线来制备用于在基板上形成图案的潜像所使用的掩模图案; 通过计算能量射线的强度来获得图案的潜像; 至少在与感兴趣的图案对应的部分中,根据感兴趣的图案之间的距离,在潜像图像曲线和参考强度线之间的能量射线的强度的方向上的相对位置 以及相邻区域的图案,所述潜像曲线是构成所述潜像的能量射线的强度分布曲线,所述基准强度线被定义为指定所述图案的边缘的位置; 以及计算与感兴趣的图案对应的潜在图像曲线的一部分的交点与变化的相对位置中的基准强度线之间的距离,以定义感兴趣的图案的感兴趣的线宽。
    • 7. 发明申请
    • Lithography simulation method, mask pattern preparation method, semiconductor device manufacturing method and recording medium
    • 光刻模拟法,掩模图案制备方法,半导体器件制造方法和记录介质
    • US20070019058A1
    • 2007-01-25
    • US11485554
    • 2006-07-13
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • B41J2/385
    • G03F7/70433G03F7/705
    • A lithography simulation method includes: taking in design data of a pattern to be formed on a substrate and mask data to prepare a mask pattern used in forming a latent image of the pattern on the substrate by transmission of an energy ray; obtaining the latent image of the pattern by calculation of an intensity of the energy ray; locally changing, at least in a portion corresponding to a pattern to be interested, a relative position in a direction of the intensity of the energy ray between a latent image curve and a reference intensity line in accordance with a distance between the pattern to be interested and a pattern of a neighboring region, the latent image curve being an intensity distribution curve of the energy ray constituting the latent image, the reference intensity line being defined to specify a position of an edge of the pattern to be interested; and calculating a distance between intersections of a portion of the latent image curve corresponding to the pattern to be interested and the reference intensity line in the changed relative position to define an interested line width of the pattern to be interested.
    • 光刻模拟方法包括:获取要在基板上形成的图案的设计数据,并且掩模数据,以通过透射能量线来制备用于在基板上形成图案的潜像所使用的掩模图案; 通过计算能量射线的强度来获得图案的潜像; 至少在与感兴趣的图案对应的部分中,根据感兴趣的图案之间的距离,在潜像图像曲线和参考强度线之间的能量射线的强度的方向上的相对位置 以及相邻区域的图案,所述潜像曲线是构成所述潜像的能量射线的强度分布曲线,所述基准强度线被定义为指定所述图案的边缘的位置; 以及计算与感兴趣的图案对应的潜在图像曲线的一部分的交点与变化的相对位置中的基准强度线之间的距离,以定义感兴趣的图案的感兴趣的线宽。
    • 8. 发明授权
    • Lithography simulation method and recording medium
    • 平版印刷模拟方法和记录介质
    • US07426712B2
    • 2008-09-16
    • US11485554
    • 2006-07-13
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • Toshiya KotaniShigeki NojimaShoji Mimotogi
    • G06F17/50G03F9/00
    • G03F7/70433G03F7/705
    • A lithography simulation method includes: taking in design data of a pattern to be formed on a substrate and mask data to prepare a mask pattern used in forming a latent image of the pattern on the substrate by transmission of an energy ray; obtaining the latent image of the pattern by calculation of an intensity of the energy ray; locally changing, at least in a portion corresponding to a pattern of interest, a relative position in a direction of the intensity of the energy ray between a latent image curve and a reference intensity line in accordance with a distance between the pattern of interest and a pattern of a neighboring region , the latent image curve being an intensity distribution curve of the energy ray constituting the latent image, the reference intensity line being defined to specify a position of an edge of the pattern of interest; and calculating a distance between intersections of a portion of the latent image curve corresponding to the pattern of interest and the reference intensity line in the changed relative position to define a line width of interest of the pattern of interest.
    • 光刻模拟方法包括:获取要在基板上形成的图案的设计数据,并且掩模数据,以通过透射能量线来制备用于在基板上形成图案的潜像所使用的掩模图案; 通过计算能量射线的强度来获得图案的潜像; 至少在与感兴趣的图案相对应的部分中,根据感兴趣的图案和图像之间的距离,在潜像图像曲线和参考强度线之间的能量射线的强度的方向上的相对位置, 所述潜像曲线是构成所述潜像的能量射线的强度分布曲线,所述参考强度线被定义为指定所述感兴趣图案的边缘的位置; 以及计算与感兴趣的图案相对应的潜在图像曲线的一部分的交点与改变的相对位置中的参考强度线之间的距离,以限定感兴趣的图案的感兴趣的线宽。
    • 10. 发明申请
    • Critical pattern extracting method, critical pattern extracting program, and method of manufacturing semiconductor device
    • 关键模式提取方法,关键模式提取程序以及制造半导体器件的方法
    • US20050166172A1
    • 2005-07-28
    • US11006532
    • 2004-12-08
    • Daisuke KawamuraShigeki NojimaShoji Mimotogi
    • Daisuke KawamuraShigeki NojimaShoji Mimotogi
    • G03F1/36G03F1/68G03F1/70G03F7/00G03F9/00G06F17/50H01L21/027
    • G03F1/36
    • According to a aspect of the present invention, there is provided a critical pattern extracting method which extracts critical patterns from mask data for manufacturing a photomask used in a lithography step, comprising at least: extracting mask data of a peripheral region within a predetermined range from an interested portion to be decided in the mask data; defining portions constituting the peripheral region as reference portions and calculating process generation amounts generated from the each reference portion in the lithography step by simulation; performing a predetermined arithmetic operation by using the process generation amounts and distances between the interested portion and the each reference portion; performing multiple integral of an arithmetic operation value obtained by the predetermined arithmetic operation in the peripheral region or an arithmetic operation equivalent to the multiple integral to calculate a process affecter amount; and comparing the process affecter amount with a predetermined threshold value.
    • 根据本发明的一个方面,提供了一种临界图案提取方法,其从用于制造光刻步骤中使用的光掩模的掩模数据中提取临界图案,该方法至少包括:从预定范围内提取外围区域的掩模数据, 在掩模数据中确定的感兴趣部分; 将构成周边区域的部分作为参考部分,并通过模拟计算从光刻步骤中的每个参考部分产生的处理生成量; 通过使用感兴趣部分和每个参考部分之间的处理产生量和距离来执行预定的算术运算; 执行通过周边区域中的预定算术运算获得的算术运算值的多项积分或与多项积分相当的算术运算来计算加工效果量; 以及将所述过程影响器量与预定阈值进行比较。