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1. 发明申请

US20090031493A1 WATER DISCHARGE SYSTEM 有权
标题翻译：水排放系统
公开(公告)号：US20090031493A1
公开(公告)日：2009-02-05
申请号：US12182990
申请日：2008-07-30
申请人： Masami TSUJITA , Tomoyuki ABE , Naoki KABE , Hiroshi TSUBOI , Masayuki NAGAISHI , Katsuhisa TSUCHIYA , Shoichi TSUIKI , Kensuke MURATA
发明人： Masami TSUJITA , Tomoyuki ABE , Naoki KABE , Hiroshi TSUBOI , Masayuki NAGAISHI , Katsuhisa TSUCHIYA , Shoichi TSUIKI , Kensuke MURATA
IPC分类号： E03C1/05
CPC分类号： E03C1/057 , G01S13/56 , G01S13/582 , G01S13/88
摘要： There is provided a water discharge system. A water discharge system includes a water discharge portion; a sensor unit which acquires movement information about an object based on a radiated electric wave, and outputs a detecting signal; and a control unit which controls water discharge of the water discharge portion based on the detecting signal. When it is detected that the object is decelerated to a first threshold velocity or less, the control unit controls the water discharge portion to start the water discharge.
摘要翻译：提供排水系统。排水系统包括排水部分; 传感器单元，其基于辐射电波获取关于对象的移动信息，并输出检测信号; 以及控制单元，其基于检测信号来控制排水部的排水。当检测到物体减速到第一阈值速度或更小时，控制单元控制排水部分开始排水。

2. 发明申请

US20090070922A1 Urinal 有权
标题翻译：小便池
公开(公告)号：US20090070922A1
公开(公告)日：2009-03-19
申请号：US12172176
申请日：2008-07-11
申请人： Kensuke MURATA , Masayuki NAGAISHI , Tomoyuki ABE , Hiroshi TSUBOI
发明人： Kensuke MURATA , Masayuki NAGAISHI , Tomoyuki ABE , Hiroshi TSUBOI
IPC分类号： E03D13/00
CPC分类号： G01V3/12 , E03D5/105 , E03D13/00
摘要： A urinal includes: a urinal body; a high-frequency sensor which radiates a radio beam obliquely passing through an upper surface of the urinal body toward a bowl and receives a reflected wave from an object so as to generate a detection signal; and a valve which discharges or stops flushing water to the urinal body in response to the detection signal. An angle formed between a first plane including the upper surface of the urinal body and a second plane including a radiation surface of an antenna of the high-frequency sensor is in a range of more than 0 degree to less than 90 degree. A cross line where the first plane and the second plane intersect with each other is substantially parallel to a horizontal direction of the urinal body. The radio beam is a linearly-polarized wave. An excitation direction of the radio beam intersects with the cross line. An intensity of the radio beam passing through the urinal body is larger than that of the radio beam reflected by the upper surface.
摘要翻译：小便池包括：小便器; 高频传感器，其将倾斜地通过小便器的上表面的无线电束朝向碗体辐射，并从物体接收反射波，以产生检测信号; 以及响应于检测信号而将冲洗水排出或停止到小便器体的阀。在包括小便器的上表面的第一平面和包括高频传感器的天线的辐射表面的第二平面之间形成的角度在大于0度至小于90度的范围内。第一平面和第二平面彼此交叉的交叉线基本上平行于小便器的水平方向。无线电波束是线性偏振波。无线电波束的激发方向与交叉线相交。通过小便器的无线电波的强度大于由上表面反射的无线电波束的强度。

3. 发明申请

US20100018762A1 BUILDUP PRINTED CIRCUIT BOARD 审中-公开
标题翻译： BUILDUP印刷电路板
公开(公告)号：US20100018762A1
公开(公告)日：2010-01-28
申请号：US12502268
申请日：2009-07-14
申请人： Hideaki YOSHIMURA , Norikazu OZAKI , Kenji IIDA , Tomoyuki ABE
发明人： Hideaki YOSHIMURA , Norikazu OZAKI , Kenji IIDA , Tomoyuki ABE
IPC分类号： H05K1/11 , H05K3/36 , B23P23/00
CPC分类号： H05K1/036 , H05K1/0366 , H05K3/06 , H05K3/107 , H05K3/108 , H05K3/421 , H05K3/426 , H05K3/4644 , H05K2201/0195 , H05K2201/0355 , H05K2201/0376 , H05K2201/0394 , H05K2201/09563 , H05K2201/096 , H05K2203/0278 , H05K2203/1476 , Y10T29/49126 , Y10T29/51
摘要： A printed circuit board includes a first insulation layer that is formed of a resin material into which fiber cloth is embedded. A second insulation layer is formed of a resin material, and is stacked on a front surface of the first insulation layer on which a heating process has been performed. A conductive land is formed on a front surface of the second insulation layer. A via is provided in a through hole penetrating through the first insulation layer and the second insulation layer. The through hole is filled with a conductive material, and the via is connected to the conductive land.
摘要翻译：印刷电路板包括由嵌入有纤维布的树脂材料形成的第一绝缘层。第二绝缘层由树脂材料形成，并且堆叠在已经进行了加热处理的第一绝缘层的前表面上。导电焊盘形成在第二绝缘层的前表面上。通孔设置在穿过第一绝缘层和第二绝缘层的通孔中。通孔填充有导电材料，并且通孔连接到导电焊盘。

4. 发明申请

US20090308651A1 WIRING SUBSTRATE INCLUDING CONDUCTIVE CORE SUBSTRATE, AND MANUFACTURING METHOD THEREOF 有权
标题翻译：包括导电核心基板的接线基板及其制造方法
公开(公告)号：US20090308651A1
公开(公告)日：2009-12-17
申请号：US12331113
申请日：2008-12-09
申请人： Tomoyuki ABE , Kazumasa SAITO , Shin HIRANO , Kenji IlDA
发明人： Tomoyuki ABE , Kazumasa SAITO , Shin HIRANO , Kenji IlDA
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/445 , H05K3/42 , H05K3/4608 , H05K2201/0323 , H05K2201/0347 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2203/135 , Y10T29/49165
摘要： A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.
摘要翻译：布线基板包括具有第一主表面和相互相对的第二主表面的芯基板，第二主表面具有导电性能。第一通孔穿透芯基板。第一导电层经由第一通孔从第一主表面延伸到第二主表面。绝缘层形成在第一导电层上。第二通孔具有作为内壁的绝缘层。并且第二导电层形成在第二通孔的内部。

5. 发明申请

US20090098391A1 CORE MEMBER AND METHOD OF PRODUCING THE SAME 审中-公开
标题翻译：核心成员及其生产方法
公开(公告)号：US20090098391A1
公开(公告)日：2009-04-16
申请号：US12188759
申请日：2008-08-08
申请人： Takashi NAKAGAWA , Kenji IIDA , Yasutomo MAEHARA , Shin HIRANO , Tomoyuki ABE , Hideaki YOSHIMURA , Seigo YAMAWAKI , Norikazu OZAKI
发明人： Takashi NAKAGAWA , Kenji IIDA , Yasutomo MAEHARA , Shin HIRANO , Tomoyuki ABE , Hideaki YOSHIMURA , Seigo YAMAWAKI , Norikazu OZAKI
IPC分类号： B32B5/28 , B32B37/04
CPC分类号： H05K9/00 , H05K1/036 , H05K1/0366 , H05K1/056 , H05K3/429 , H05K2201/0281 , H05K2201/0323 , H05K2201/0959 , H05K2201/09809
摘要： The core member constitutes a core substrate of a circuit board. The core member comprises: a carbon fiber-reinforced core section, in which prepregs including carbon fibers are thermocompression-bonded; and copper foils being respectively thermocompression-bonded on the both side faces of the carbon fiber-reinforced core section with prepregs including glass fibers. The pregregs including glass fibers are composed of resin, whose melting temperature range is higher than that of resin composing the pregregs including carbon fibers.
摘要翻译：芯构件构成电路板的芯基板。芯构件包括：碳纤维增强芯部，其中包括碳纤维的预浸料被热压粘合; 并且在包括玻璃纤维的预浸料坯的碳纤维增强芯部的两个侧面上分别热压粘合铜箔。包括玻璃纤维的预浸料由树脂组成，其熔融温度范围高于构成包括碳纤维的预浸料的树脂。

6. 发明申请

US20100024963A1 MULTILEVEL INTERCONNECTION BOARD AND METHOD OF FABRICATING THE SAME 有权
标题翻译：多层互连板及其制作方法
公开(公告)号：US20100024963A1
公开(公告)日：2010-02-04
申请号：US12576500
申请日：2009-10-09
申请人： Keishiro OKAMOTO , Mamoru KURASHINA , Tomoyuki ABE
发明人： Keishiro OKAMOTO , Mamoru KURASHINA , Tomoyuki ABE
IPC分类号： B29C70/08 , H01L23/48
CPC分类号： B32B5/26 , B32B3/02 , B32B5/024 , B32B7/02 , B32B27/08 , B32B27/12 , B32B27/281 , B32B2250/05 , B32B2255/10 , B32B2255/205 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2262/106 , B32B2307/308 , B32B2307/734 , B32B2457/00 , H01L2924/0002 , H05K1/036 , H05K1/0366 , H05K3/429 , H05K3/4641 , H05K2201/0323 , H05K2201/068 , Y10T428/24149 , Y10T428/24942 , Y10T428/249923 , Y10T428/24994 , Y10T428/249945 , Y10T442/643 , Y10T442/659 , Y10T442/668 , Y10T442/696 , Y10T442/697 , H01L2924/00
摘要： A stack of 50 layers of a first pitch-base carbon fiber sheet is formed, two sets of stack each having two second pitch-base carbon fiber sheets stacked therein are fabricated. At this time, the second carbon fiber sheets have a thermal expansion coefficient larger than that of the first carbon fiber sheet. Next, the stack of the first carbon fiber sheet is then held between two sets of stack of the second carbon fiber sheets. The stack of the first and second carbon fiber sheets are then impregnated with an epoxy-base resin composition and the resin is solidified. As a result a prepreg composed of the first and second carbon fiber sheets and the resin component composed of the epoxy-base resin composition is obtained. Thereafter, interconnections and the like are then formed on the prepreg, to thereby complete a multilevel interconnection board.
摘要翻译：形成50层第一沥青基碳纤维片的叠层，制成两组堆叠在其中的两个第二沥青基碳纤维片。此时，第二碳纤维片的热膨胀系数大于第一碳纤维片的热膨胀系数。接下来，将第一碳纤维片的叠层保持在两组第二碳纤维片之间。然后将第一和第二碳纤维片材的叠层用环氧树脂基树脂组合物浸渍，并使树脂固化。结果得到由第一和第二碳纤维片材构成的预浸料和由环氧基树脂组合物构成的树脂组分。此后，在预浸料坯上形成互连等，从而完成多层互连板。

7. 发明申请

US20090294161A1 CORE SUBSTRATE AND PRINTED WIRING BOARD 有权
标题翻译：核心基板和印刷电路板
公开(公告)号：US20090294161A1
公开(公告)日：2009-12-03
申请号：US12390010
申请日：2009-02-20
申请人： Hideaki YOSHIMURA , Kenji IIDA , Tomoyuki ABE , Yasutomo MAEHARA , Takashi NAKAGAWA , Shin HIRANO
发明人： Hideaki YOSHIMURA , Kenji IIDA , Tomoyuki ABE , Yasutomo MAEHARA , Takashi NAKAGAWA , Shin HIRANO
IPC分类号： H05K1/00 , B32B5/00
CPC分类号： H05K3/4641 , H05K3/445 , H05K3/4608 , H05K2201/0281 , H05K2201/0323 , H05K2201/09536 , H05K2201/09809 , Y10T428/24331
摘要： The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.
摘要翻译：核心基材的芯层由浸渍有树脂的碳纤维制成。当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。芯层夹在包含玻璃纤维的绝缘层之间。绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。核心基板中的热应力被抑制。

8. 发明申请

US20100020973A1 TRANSMISSION DEVICE AND RECEPTION DEVICE FOR CIPHERING PROCESS 审中-公开
标题翻译：传输设备和接收过程的接收设备
公开(公告)号：US20100020973A1
公开(公告)日：2010-01-28
申请号：US12502309
申请日：2009-07-14
申请人： Tomoyuki ABE , Masayuki HARA , Yasuhiro FURUMAKI
发明人： Tomoyuki ABE , Masayuki HARA , Yasuhiro FURUMAKI
IPC分类号： H04L9/00
CPC分类号： H04W12/02 , H04L63/0428 , H04L63/068 , H04W12/04
摘要： In a wireless communication system, a transmission device includes: a generation section configured to encrypt information shared between the transmission device and a reception device using first encryption information which changes in accordance with the sequence information, and to generate encrypted data for the shared information; a transmission section configured to transmit, to the reception device, the encrypted data for the shared information; a reception section configured to receive, from the reception device, information about a result of a comparison between the shared information and a result of decrypting the encrypted data for the shared information using second encryption information which changes in accordance with the sequence information assigned to the encrypted ciphering-process-target data at the reception device; and a determination section configured to determine, based on the comparison result, whether the first and second encryption information matches or not.
摘要翻译：在无线通信系统中，发送装置包括：生成部，被配置为使用根据所述序列信息而变化的第一加密信息，对发送装置与接收装置之间共享的信息进行加密，生成所述共享信息的加密数据; 发送部，被配置为向所述接收装置发送所述共享信息的加密数据; 接收部件，被配置为从所述接收装置接收关于所述共享信息之间的比较结果的信息和所述共享信息的加密数据的解密结果的信息，所述第二加密信息根据分配给所述共享信息的序列信息而变化在接收装置处的加密加密处理目标数据; 以及确定部，被配置为基于所述比较结果来确定所述第一和第二加密信息是否匹配。

9. 发明申请

US20090294166A1 PRINTED WIRING BOARD 失效
标题翻译：印刷线路板
公开(公告)号：US20090294166A1
公开(公告)日：2009-12-03
申请号：US12390168
申请日：2009-02-20
申请人： Hideaki YOSHIMURA , Kenji IIDA , Tomoyuki ABE , Yasutomo MAEHARA , Shin HIRANO
发明人： Hideaki YOSHIMURA , Kenji IIDA , Tomoyuki ABE , Yasutomo MAEHARA , Shin HIRANO
IPC分类号： H05K1/11
CPC分类号： H05K3/445 , H05K3/4608 , H05K2201/0323 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , H05K2201/09609 , H05K2201/09809
摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.
摘要翻译：在印刷电路板的芯层中形成大尺寸的通孔。大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。填充材料填充大尺寸通孔的内部空间。小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

10. 发明申请

US20070186414A1 MULTILAYER WIRING BOARD INCORPORATING CARBON FIBERS AND GLASS FIBERS 有权
标题翻译：多层接线板，包括碳纤维和玻璃纤维
公开(公告)号：US20070186414A1
公开(公告)日：2007-08-16
申请号：US11737340
申请日：2007-04-19
申请人： Tomoyuki ABE , Nobuyuki Hayashi , Motoaki Tani
发明人： Tomoyuki ABE , Nobuyuki Hayashi , Motoaki Tani
IPC分类号： H05K1/11
CPC分类号： H01L23/49822 , H01L2924/0002 , H01L2924/09701 , H05K1/0366 , H05K1/056 , H05K1/09 , H05K3/429 , H05K3/4608 , H05K3/4641 , H05K3/4688 , H05K2201/0281 , H05K2201/0323 , H05K2201/0355 , H05K2201/09536 , H05K2203/1105 , Y10S428/901 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49162 , Y10T428/24917 , H01L2924/00
摘要： A multilayer wiring board (X1) comprises a core portion (100) and out-core wiring portion (30). The core portion (100) comprises a carbon fiber reinforced portion (10) composed of a carbon fiber material (11) and resin composition (12), and an in-core wiring portion (20) which has a laminated structure of at least one insulating layer (21) containing a glass fiber material (21a) and a wiring pattern (22) composed of a conductor having an elastic modulus of 10 to 40 GPa and which is bonded to the carbon fiber reinforced portion (10). The out-core wiring portion (30) has a laminated structure of at least one insulating layer (31) and a wiring pattern (32) and is bonded to the core portion (100) at the in-core wiring portion (20).
摘要翻译：多层布线板（X 1）包括芯部（100）和外芯布线部（30）。芯部（100）包括由碳纤维材料（11）和树脂组合物（12）构成的碳纤维增强部（10），以及具有层叠结构的芯内配线部（20）包含玻璃纤维材料（21a）的绝缘层（21）和由弹性模量为10〜40GPa的导体构成并与碳纤维增强部（10）接合的布线图案（22）。外芯接线部（30）具有至少一个绝缘层（31）和布线图案（32）的叠层结构，并且在芯部布线部（20）处与芯部（100）接合。

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