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    • 1. 发明授权
    • Method of manufacturing a MOS device wherein an insulating film is
deposited in a field region
    • 在场区域中淀积绝缘膜的MOS器件的制造方法
    • US4651411A
    • 1987-03-24
    • US744899
    • 1985-06-17
    • Masami KonakaNaoyuki ShigyoRyo Dang
    • Masami KonakaNaoyuki ShigyoRyo Dang
    • H01L29/78H01L21/76H01L21/762
    • H01L21/76216Y10S148/05
    • A method of manufacturing a MOS device wherein a semiconductor substrate is selectively etched to form a groove in a field region and an element formation region surrounded by the groove such that an angle .theta. is formed between a wall of the groove and a first imaginary extension of a top surface of the element formation region, the angle .theta. satisfying the relation, 70.degree..ltoreq..theta..ltoreq.90.degree.. Then, a field insulating film is deposited in the groove, and a MOS transistor is formed in the element formation region. The element formation region has source, drain and channel regions of a field effect transistor therein and a gate electrode formed on a gate insulating film on the channel region. The gate electrode extends onto the surface portion of the field insulating film. The thickness of an upper portion of the field insulating film above a first imaginary extension of an interface between the gate insulating film and the gate electrode is formed smaller than that of a lower portion of the field insulating film below the first imaginary extension.
    • 一种制造MOS器件的方法,其中选择性地蚀刻半导体衬底以在场区域中形成沟槽,并且所述元件形成区域被所述沟槽包围,使得在所述沟槽的壁和所述沟槽的第一假想延伸部之间形成角度θ 元件形成区域的顶面,角度θ满足关系,70°θ= 90°。 然后,在沟槽中沉积场绝缘膜,并且在元件形成区域中形成MOS晶体管。 元件形成区域具有其中的场效应晶体管的源极,漏极和沟道区,以及形成在沟道区上的栅极绝缘膜上的栅电极。 栅电极延伸到场绝缘膜的表面部分上。 栅极绝缘膜和栅电极之间的界面的第一假想延伸部上方的场绝缘膜的上部的厚度形成为比第一假想延伸部以下的场绝缘膜的下部的厚度小。