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    • 2. 发明申请
    • Simulation model making method
    • 仿真模型制作方法
    • US20080134131A1
    • 2008-06-05
    • US11976025
    • 2007-10-19
    • Masafumi AsanoMasaki SatakeSatoshi Tanaka
    • Masafumi AsanoMasaki SatakeSatoshi Tanaka
    • G06F17/50
    • G03F7/70425G03F7/70491G03F7/705G03F7/70616
    • A method of making a simulation model, includes specifying a feature factor which characterizes a pattern layout of a mask pattern, specifying a control factor which affects a dimension of a resist pattern to be formed on a substrate by means of a lithography process using the mask pattern, determining a predicted dimension of the resist pattern to be formed on the substrate by means of the lithography process using the mask pattern through the use of a model based on the feature and control factors, obtaining an actual dimension of the resist pattern actually formed on the substrate by means of the lithography process using the mask pattern, and setting the feature and control factors and the predicted dimension as input layers and setting the actual dimension as an output layer to construct a neural network.
    • 一种制作仿真模型的方法包括指定表征掩模图案的图案布局的特征因子,通过使用掩模的光刻工艺指定影响待形成在抗蚀剂图案的尺寸的控制因素 通过使用基于特征和控制因子的模型通过使用掩模图案的光刻处理来确定要在基板上形成的抗蚀剂图案的预测尺寸,获得实际形成的抗蚀剂图案的实际尺寸 通过使用掩模图案的光刻工艺在衬底上,并将特征和控制因子和预测尺寸设置为输入层,并将实际尺寸设置为输出层以构建神经网络。
    • 5. 发明授权
    • Exposure control method and method of manufacturing a semiconductor device
    • 曝光控制方法及制造半导体器件的方法
    • US07396621B2
    • 2008-07-08
    • US11819375
    • 2007-06-27
    • Tadahito FujisawaSoichi InoueSatoshi TanakaMasafumi Asano
    • Tadahito FujisawaSoichi InoueSatoshi TanakaMasafumi Asano
    • G03F7/16G03F7/20G03F7/38G03F1/14
    • G03F1/44
    • A method of manufacturing a semiconductor device includes preparing a projection exposure apparatus and a photomask, the photomask having a transparent substrate and a light shield film arranged in patterns to be transferred to a resist film on a wafer. The patterns include a circuit mask pattern, and first and second mark mask patterns having dimensions which change in accordance with exposure of the resist film. The method further includes forming first and second exposure monitor marks by causing phasing differences of 180 degrees and zero degrees, respectively, of light passing through the corresponding first and second mark mask patterns; measuring the first and second exposure monitor marks; calculating first and second effective exposures based on measured dimensions of the first and second exposure monitor marks; comparing variations of the first and second effective exposures; and changing at least one of a deposit condition of a front-end film formed under the resist film or a resist film coating condition if a variation of the first effective exposure differs from a variation of the second effective exposure.
    • 制造半导体器件的方法包括制备投影曝光设备和光掩模,所述光掩模具有透明基板和以图案排列的光屏蔽膜,以转印到晶片上的抗蚀剂膜。 图案包括电路掩模图案,以及具有根据抗蚀剂膜的曝光而变化的尺寸的第一和第二标记掩模图案。 该方法还包括通过分别通过相应的第一和第二标记掩模图案的光180度和零度的相位差来形成第一和第二曝光监视标记; 测量第一和第二曝光监视标记; 基于第一和第二曝光监视标记的测量尺寸来计算第一和第二有效曝光; 比较第一和第二有效曝光的变化; 以及如果第一有效曝光的变化与第二有效曝光的变化不同,则改变形成在抗蚀剂膜下方的前端膜的沉积条件或抗蚀剂膜涂覆条件中的至少一个。