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    • 1. 发明授权
    • Polymer removing apparatus and method
    • 聚合物去除装置及方法
    • US08506718B2
    • 2013-08-13
    • US12857938
    • 2010-08-17
    • Takehiro ShindouMasaki Kondo
    • Takehiro ShindouMasaki Kondo
    • B08B5/00
    • H01L21/31138H01L21/0209H01L21/67069
    • A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.
    • 用于去除环状地附着到目标基板的周边部分上的聚合物的聚合物去除装置包括:处理室,用于容纳具有环状粘附到其周边部分上的聚合物的目标基板; 用于将目标基板安装在其上的安装台; 以及激光照射单元,其用于将环状激光一次照射到环状地粘附到目标基板的整个聚合物上。 聚合物除去装置还包括臭氧气体供给单元,其用于将臭氧气体供给到环状粘附到目标基板上的聚合物,以及用于排出臭氧气体的排气单元。
    • 2. 发明申请
    • POLYMER REMOVING APPARATUS AND METHOD
    • 聚合物去除装置和方法
    • US20110041874A1
    • 2011-02-24
    • US12857938
    • 2010-08-17
    • Takehiro ShindouMasaki Kondo
    • Takehiro ShindouMasaki Kondo
    • B08B7/00B23K26/16
    • H01L21/31138H01L21/0209H01L21/67069
    • A polymer removing apparatus for use in removing polymer annularly adhered to a peripheral portion of a target substrate includes a processing chamber for accommodating the target substrate having the polymer annularly adhered to the peripheral portion thereof; a mounting table for mounting the target substrate thereon; and a laser irradiation unit for irradiating ring-shaped laser light at once to the whole polymer annularly adhered to the target substrate. The polymer removing apparatus further includes an ozone gas supply unit for supplying an ozone gas to the polymer annularly adhered to the target substrate and a gas exhaust unit for exhausting the ozone gas.
    • 用于去除环状地附着到目标基板的周边部分上的聚合物的聚合物去除装置包括:处理室,用于容纳具有环状粘附到其周边部分上的聚合物的目标基板; 用于将目标基板安装在其上的安装台; 以及激光照射单元,其用于将环状激光一次照射到环状地粘附到目标基板的整个聚合物上。 聚合物除去装置还包括臭氧气体供给单元,其用于将臭氧气体供给到环状粘附到目标基板上的聚合物,以及用于排出臭氧气体的排气单元。