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1. 发明授权

US5976628A Copper conductor paste and production method of copper conductor film 失效
标题翻译：铜导体胶和铜导体膜的制造方法
公开(公告)号：US5976628A
公开(公告)日：1999-11-02
申请号：US27648
申请日：1998-02-24
申请人： Masahito Kawahara , Toru Noguchi , Yoshio Yamaguchi , Yoshifumi Yamashita , Yoshito Nokami
发明人： Masahito Kawahara , Toru Noguchi , Yoshio Yamaguchi , Yoshifumi Yamashita , Yoshito Nokami
IPC分类号： H01L23/498 , H05K1/09 , B05D3/02
CPC分类号： H01L23/49883 , H05K1/092 , H01L2924/0002
摘要： A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the weight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.
摘要翻译：包含通过将聚合物中的超细粒状氧化铜分散而不聚集而得到的高分子复合体的导体糊料，主要由平均粒径为1〜10μm的碱性铜粉末组成的混合铜粉末加入到至少一种平均粒径小于碱性铜粉末的辅助铜粉末和有机溶剂，其中高分子复合材料中混合铜粉末与氧化铜的重量比为5〜50〜 1的氧化铜，铜氧化物和混合铜粉的总量为导体膏的50〜90重量％，制造方法为：在基板的表面上涂布导电膏，在升温过程中烧结导体糊，烧结导体膏，在基片上形成导体膜。

2. 发明授权

US5807508A Copper conductor paste and production method of copper conductor film 失效
标题翻译：铜导体胶和铜导体膜的制造方法
公开(公告)号：US5807508A
公开(公告)日：1998-09-15
申请号：US569291
申请日：1995-12-08
申请人： Masahito Kawahara , Toru Noguchi , Yoshio Yamaguchi , Yoshifumi Yamashita , Yoshito Nokami
发明人： Masahito Kawahara , Toru Noguchi , Yoshio Yamaguchi , Yoshifumi Yamashita , Yoshito Nokami
IPC分类号： H01B1/00 , H01B1/16 , H01B13/00 , H01L21/48 , H01L23/498 , H05K1/09 , H01B1/20 , H01B1/22
CPC分类号： H05K1/092 , H01L21/4867 , H01L23/49883 , H01L2924/0002
摘要： A conductor paste comprising a high-polymer composite obtained by dispersing super-fine-granulated copper oxide in a polymer without being aggregated, mixed copper powders mainly composed of a base copper powder having a mean particle size of 1 to 10 .mu.m added with at least one kind of an auxiliary copper powder having a mean particle size smaller than that of the base copper powder, and an organic solvent, wherein the wight ratio of the mixed copper powders to copper oxide in the high-polymer composite is 5 to 50 to 1 of copper oxide and the total amount of copper oxide and the mixed copper powders is 50 to 90% by weight of the conductor paste, and a production method a conductor film by coating the conductor paste on the surface of a substrate and after pre-burning the conductor paste under temperature raising, burning the conductor paste to form the conductor film on the substrate.
摘要翻译：包含通过将聚合物中的超细粒状氧化铜分散而不聚集而得到的高分子复合体的导体糊料，主要由平均粒径为1〜10μm的碱性铜粉末组成的混合铜粉末加入到至少一种平均粒径小于基础铜粉末的辅助铜粉末和有机溶剂，其中高分子复合材料中混合铜粉末与氧化铜的比例为5〜50〜 1的氧化铜，铜氧化物和混合铜粉的总量为导体膏的50〜90重量％，制造方法为：在基板的表面上涂布导电膏，在升温过程中烧结导体糊，烧结导体膏，在基片上形成导体膜。

3. 发明授权

US06905990B2 Ceramic color composition and method for bending flat glass 失效
标题翻译：陶瓷颜色组合和弯曲平板玻璃的方法
公开(公告)号：US06905990B2
公开(公告)日：2005-06-14
申请号：US10312188
申请日：2000-12-14
申请人： Shigehiro Sanichi , Yoshito Nokami
发明人： Shigehiro Sanichi , Yoshito Nokami
IPC分类号： C03C4/02 , C03C8/22 , C03C17/04 , C03C1/00
CPC分类号： C03C3/064 , C03C3/089 , C03C3/115 , C03C8/14 , C03C8/16 , C03C8/22 , C03C17/008 , C03C17/04
摘要： The present invention provides a ceramic color composition which comprises, as a solid powder, 50 to 90 wt. % of a mixture containing 5 to 95 parts by weight of a first lead-free glass powder comprising at least SiO2, ZnO, and B2O3 as glass components, and 5 to 95 parts by weight of a second lead-free glass powder comprising at least SiO2, Bi2O3, and B2O3 as glass components, 10 to 40 wt. % of an inorganic pigment, and 0 to 10 wt. % of an inorganic filler.The composition is free of lead and exhibits an excellent mold release property during the heat-molding process of a glass plate having the composition printed thereon. After firing, the composition is excellent in acid resistance, coloration in the bus bar portion, and plating resistance.
摘要翻译：本发明提供一种陶瓷着色组合物，其包含作为固体粉末的50〜90重量％含有5至95重量份至少包含至少SiO 2，ZnO和B 2 O 3的第一无铅玻璃粉末的混合物的％ / SUB>作为玻璃成分，以及5〜95重量份的第二无铅玻璃粉末，其至少包含SiO 2，Bi 2 O 3， / SUB>和B 2 O 3 3作为玻璃成分，10〜40wt。％的无机颜料，和0〜10wt。％的无机填料。该组合物不含铅，并且在其上印刷有组合物的玻璃板的热模制过程中具有优异的脱模性能。烧成后，耐酸性优异，母线部分着色，耐电镀性优异。

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