专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5457072A Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate 失效
标题翻译：使用临时基板对具有电镀散热片的半导体晶片进行切割的工序
公开(公告)号：US5457072A
公开(公告)日：1995-10-10
申请号：US196757
申请日：1994-02-15
申请人： Masahiro Tamaki , Kouji Aono , Sinichi Sakamoto
发明人： Masahiro Tamaki , Kouji Aono , Sinichi Sakamoto
IPC分类号： H01L23/36 , B81C99/00 , H01L21/304 , H01L21/78 , H01L21/302
CPC分类号： B81C1/00214 , H01L21/304 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L2221/68327 , Y10S438/977
摘要： A method for producing semiconductor chips includes preparing a semiconductor wafer having opposite front and rear surfaces and active semiconductor devices disposed in the semiconductor wafer at a part of the front surface, attaching a glass plate to the front surface of the semiconductor wafer, thinning the semiconductor wafer to a desired thickness from the rear surface, forming a first radiating layer over the rear surface of the semiconductor wafer, selectively forming a second radiating layer on the first radiating layer using, as a mask, a photoresist pattern covering portions of the first radiating layer opposite dicing regions, removing the semiconductor wafer from the glass plate, and cutting through the wafer and the first radiating layer with a dicing blade to produce a plurality of semiconductor chips. In this method, since the first radiating layer supports the thin wafer, the glass plate can be removed before the dicing process. Therefore, electrical testing of the semiconductor devices included in the wafer can be carried out before the wafer is divided into chips.
摘要翻译：一种制造半导体芯片的方法包括制备具有相对的前表面和后表面的半导体晶片和在前表面的一部分设置在半导体晶片中的有源半导体器件，将玻璃板附接到半导体晶片的前表面，使半导体从后表面到期望的厚度，在半导体晶片的后表面上形成第一辐射层，在第一辐射层上选择性地形成第二辐射层，使用覆盖第一辐射层的部分的光刻胶图案作为掩模层，相对的切割区域，从玻璃板去除半导体晶片，并用切割刀片切割晶片和第一辐射层，以产生多个半导体芯片。在该方法中，由于第一辐射层支撑薄晶片，因此可以在切割处理之前去除玻璃板。因此，在将晶片分成芯片之前，可以进行包括在晶片中的半导体器件的电气测试。

2. 发明授权

US06537057B2 Mold clamping apparatus for injection molding machine 失效
标题翻译：注塑机模具夹紧装置
公开(公告)号：US06537057B2
公开(公告)日：2003-03-25
申请号：US09906767
申请日：2001-07-18
申请人： Masahiro Tamaki , Jun Koike
发明人： Masahiro Tamaki , Jun Koike
IPC分类号： B29C4564
CPC分类号： B29C45/6707 , B29C45/67 , B29C45/68 , B29C45/683 , B29C2045/1793 , B29C2045/688
摘要： A mold clamping apparatus for an injection molding machine comprises a stationary platen fixedly holding the stationary mold, a movable platen fixedly holding the movable mold and disposed opposite to the stationary platen, tie bars for guiding the movable platen for movement toward and away from the stationary platen, a movable platen driving mechanism for moving the movable platen along the tie bars to close and open the mold, a movable platen fixing mechanism for fixing the movable platen to the tie bars at a set position immediately before a position where the movable mold is joined to the stationary mold, and a clamping force applying mechanism that includes a sealed hydraulic cylinder actuator capable of converting energy of a hydraulic fluid into an intensified mold clamping force and of applying the intensified mold clamping force to the stationary platen. In one embodiment, the apparatus includes an electrically driven toggle mechanism which brings the movable and stationary molds together, at which point the hydraulic clamping force applying means applies significant clamping force to clamp the mold shut.
摘要翻译：用于注射成型机的模具夹紧装置包括固定地固定固定模具的固定压板，固定地保持活动模具并与固定压板相对设置的活动压板，用于引导可动压板以朝向和远离静止状态运动的连杆台板，用于沿着拉杆移动可移动压板以闭合和打开模具的可移动压板驱动机构;可动压板固定机构，用于在可动模具的位置之前的设定位置将可动压板固定到连接杆上连接到固定模具，以及夹紧力施加机构，其包括密封的液压缸致动器，其能够将液压流体的能量转换成强化的合模力并且将增强的合模力施加到固定压板。在一个实施例中，该装置包括电动肘节机构，其将可移动和固定的模具带到一起，此时液压夹紧力施加装置施加显着的夹紧力来夹紧模具闭合。

3. 发明授权

US06332355B1 Method of estimating a life of ball screw included in electric injection molding machine and life estimating system 有权
标题翻译：评估电动注射成型机中使用的滚珠丝杆寿命的方法和寿命评估系统
公开(公告)号：US06332355B1
公开(公告)日：2001-12-25
申请号：US09506681
申请日：2000-02-18
申请人： Tsuginobu Totani , Kiyoshi Sasaki , Akira Kanda , Yukio Iimura , Jun Koike , Fumiyuki Katoh , Masahiro Tamaki , Yutaka Yamaguchi
发明人： Tsuginobu Totani , Kiyoshi Sasaki , Akira Kanda , Yukio Iimura , Jun Koike , Fumiyuki Katoh , Masahiro Tamaki , Yutaka Yamaguchi
IPC分类号： G01M500
CPC分类号： F16H57/01 , B29C45/5008 , B29C45/76 , B29C45/7666 , B29C2945/7602 , B29C2945/76083 , B29C2945/7611 , B29C2945/76187 , B29C2945/76214 , B29C2945/76568 , B29C2945/76595 , B29C2945/76665 , B29C2945/76692 , B29C2945/76943 , F16H2057/012 , G01N17/00
摘要： An injection unit including a heating barrel and an injection screw rotationally and axially movable and placed in the heating barrel is disposed on one side of a clamping mechanism for clamping a mold. The injection screw is driven and controlled for operation through a ball screw by an electric motor. Products, each of a moving speed of the ball screw and an operating current supplied to the electric motor in a unit time, are accumulated to calculate a total energy value indicating the amount of total energy supplied to the ball screw. A life energy value is predetermined on the basis of products, each of force generated by the ball screw and a moving speed of the ball screw. It is decided that a life of the ball screw has terminated when the total energy value A is equal to or greater than the life energy B (A≧B).
摘要翻译：包括加热筒和可旋转和轴向移动并放置在加热筒中的注射螺杆的注射单元设置在夹紧机构的一侧以夹紧模具。注射螺杆通过电动机通过滚珠丝杠被驱动和控制操作。在单位时间内，产生滚珠丝杠的移动速度和供给到电动机的动作电流的产品，计算出表示向滚珠丝杠供给的总能量的总能量值。基于产品，由滚珠丝杠产生的力和滚珠丝杠的移动速度来预先确定寿命值。当总能量值A等于或大于寿命B（A> = B）时，决定滚珠丝杆的寿命终止。

4. 发明授权

US6050804A Clamping apparatus for injection molding machine 失效
标题翻译：注塑机夹紧装置
公开(公告)号：US6050804A
公开(公告)日：2000-04-18
申请号：US149103
申请日：1998-09-08
申请人： Masahiro Tamaki , Jun Koike
发明人： Masahiro Tamaki , Jun Koike
IPC分类号： B22D17/26 , B29C33/22 , B29C45/17 , B29C45/66 , B29C45/64
CPC分类号： B29C45/66 , B29C45/1751
摘要： A threaded shaft (52) for operating toggle joint (44) is driven for rotation by a first servomotor (46). A bevel gear (56) is mounted on the threaded shaft (52) for rotation relative to the threaded shaft (52). The bevel gear (56) is driven for rotation by a second servomotor (57). Bevel gears (60) each having a threaded bore are supported on a rear plate (42) are engaged with threaded sections (40A) of tie bars (40), respectively. Power is transmitted from the bevel gear (56) through power transmitting mechanisms (61) to the bevel gears (60). Each power transmitting mechanism (61) comprises bevel gears (62, 63) engaged with the bevel gears (56, 60), respectively, and a clutch (64) interposed between the bevel gears (62, 63). The clutches (64) are engaged and disengaged selectively to adjust the parallelism of a movable mold (36) with respect to a stationary mold (32).
摘要翻译：用于操作肘节（44）的螺纹轴（52）由第一伺服电机（46）驱动旋转。伞形齿轮（56）安装在螺纹轴（52）上以相对于螺纹轴（52）旋转。锥齿轮（56）由第二伺服电机（57）驱动旋转。分别在后板（42）上支撑有螺纹孔的锥齿轮（60）分别与连杆（40）的螺纹部分（40A）接合。动力通过动力传递机构（61）从伞齿轮（56）传递到伞齿轮（60）。每个动力传递机构（61）分别包括与锥齿轮（56,60）啮合的锥齿轮（62,63）和插入在锥齿轮（62,63）之间的离合器（64）。离合器（64）被选择性地接合和分离以调节可动模具（36）相对于固定模具（32）的平行度。

5. 发明授权

US6033540A Plating apparatus for plating a wafer 失效
标题翻译：电镀电镀电镀装置
公开(公告)号：US6033540A
公开(公告)日：2000-03-07
申请号：US972969
申请日：1997-11-19
申请人： Katsuya Kosaki , Masahiro Tamaki
发明人： Katsuya Kosaki , Masahiro Tamaki
IPC分类号： C25D5/08 , C25D7/12 , C25D17/00 , C25D17/12 , H01L21/288 , C25B11/00
CPC分类号： C25D7/12 , C25D17/001 , H01L21/288 , Y10S204/07
摘要： The present invention provides for a plating apparatus and a method of plating, which improve the uniformity of a plated coating thickness without changing the flow velocity of a feed plating solution. An aperture can be provided at a center of a meshed anode electrode of the plating apparatus to obtain an electric field density distribution between the meshed anode electrode and a wafer that is lower in the central portion of the wafer than in the edge portion of the wafer.
摘要翻译：本发明提供一种电镀装置和电镀方法，其不改变供电电镀液的流速来提高电镀层厚度的均匀性。可以在电镀装置的网状阳极电极的中心处设置孔径，以获得在晶片的中心部分的网状阳极电极和晶片之间的电场密度分布比在晶片的边缘部分。

6. 发明授权

US5472974A Benzimidazole derivatives, agricultural and horticultural fungicides containing the same as an active ingredient and intermediate compounds thereof 失效
标题翻译：苯并咪唑衍生物，含有与活性成分相同的农业和园艺杀真菌剂及其中间体化合物
公开(公告)号：US5472974A
公开(公告)日：1995-12-05
申请号：US175763
申请日：1993-12-30
申请人： Masayuki Enomoto , Junya Takahashi , Tomoyuki Kusaba , Masayo Sugano , Rei Matsunaga , Masahiro Tamaki
发明人： Masayuki Enomoto , Junya Takahashi , Tomoyuki Kusaba , Masayo Sugano , Rei Matsunaga , Masahiro Tamaki
IPC分类号： A01N43/90 , C07D491/04 , C07D491/044
CPC分类号： C07D491/04 , A01N43/90
摘要： A benzimidazole derivative having the formula, ##STR1## wherein R is cyano or thiocarbamoyl; Q is lower alkyl or a group represented by the formula NQ.sup.1 Q.sup.2, in which Q.sup.1 and Q.sup.2 are independently lower alkyl, lower alkyl substituted with phenyl, lower alkenyl or lower alkynyl, or they form a lower alkylene ring when taken together at their ends which ring may include a hereto atom; X is hydrogen or halogen; and Z is a group which consists of (a) one oxygen atom or two non-adjacent oxygen atom, (b) --CF.sub.2 -- group and (c) any one of a single bond, --CF.sub.2 --, --CFH--, CFCl-- and --CH.sub.2 -- groups and forms a five-membered or six membered ring together with two adjacent carbon atoms of the benzene ring; is obtained by reacting a corresponding 2-cyanobenzimidazole compound and a sulfamoyl chloride derivative. The benzimidazole derivative is incorporated into agricultural and horticultural fungicides as an active ingredient.
摘要翻译：具有下式的苯并咪唑衍生物，其中R是氰基或硫代氨基甲酰基; Q是低级烷基或由式NQ1Q2表示的基团，其中Q1和Q2独立地是低级烷基，被苯基，低级链烯基或低级炔基取代的低级烷基，或者当它们的末端相互结合时，它们形成低级亚烷基环可能包括一个原子; X是氢或卤素; Z为由（a）一个氧原子或两个不相邻氧原子组成的基团，（b）-CF2-基团和（c）单键，-CF2-，-CFH-，CFCl- 和-CH 2 - 基团，并与苯环的两个相邻碳原子一起形成五元或六元环; 是通过使相应的2-氰基苯并咪唑化合物和氨磺酰氯衍生物反应得到的。苯并咪唑衍生物作为活性成分掺入农业和园艺杀真菌剂中。

7. 发明授权

US6132198A Clamping apparatus for injection molding machine 失效
标题翻译：注塑机夹紧装置
公开(公告)号：US6132198A
公开(公告)日：2000-10-17
申请号：US140346
申请日：1998-08-26
申请人： Masahiro Tamaki , Jun Koike
发明人： Masahiro Tamaki , Jun Koike
IPC分类号： B22D17/26 , B29C45/17 , B29C45/64 , B29C45/66
CPC分类号： B29C45/4005 , B29C45/1761 , B29C45/64 , B29C2045/1768 , B29C2045/1793 , Y10S100/917
摘要： A tie-bar less clamping apparatus is intended for use in combination with an injection molding machine. A stationary platen (24) is fixed to a first support section (20B) of a support frame (20), and linear motors (30) are incorporated into the second support section (20C) of the support frame (20). One end of an armature (34) included in each linear motor (30) and having the shape of a rod is connected to a movable platen (28).
摘要翻译：一个连接条较少的夹紧装置旨在与注塑机结合使用。固定压板（24）固定在支撑框架（20）的第一支撑部分（20B）上，并且线性电动机（30）被结合到支撑框架（20）的第二支撑部分（20C）中。包括在每个线性电动机（30）中并且具有杆形状的电枢（34）的一端连接到可动压板（28）。

8. 发明授权

US6059556A Injection apparatus for injection molding machine 失效
标题翻译：注塑机注塑机
公开(公告)号：US6059556A
公开(公告)日：2000-05-09
申请号：US116585
申请日：1998-07-16
申请人： Jun Koike , Masahiro Tamaki
发明人： Jun Koike , Masahiro Tamaki
IPC分类号： B29C45/03 , B29C45/50 , B29C45/58 , B29C45/76 , B29C45/54
CPC分类号： B29C45/5008 , B29C2045/5028 , B29C2045/504 , B29C2045/5048
摘要： An injection apparatus of an injection molding machine, for easy control of the charging motor and the injection motor and highly precise control of the back pressure of a screw thereby enabling performance of the proper charging operation, has an injection motor with a rotor adapted to act as a ball screw nut and which is secured to an injection carriage having mounted thereon a heating barrel of the injection apparatus. The injection motor has a shaft forming a ball screw in one end portion of the shaft connected to a screw of the injection molding machine. The ball screw is screwed into the rotor of the injection motor. The other end of the shaft forms a spline portion, and is connected to a charging motor that has a hollow drive shaft whose inside-diameter portion is spline-fitted onto the spline portion of the shaft.
摘要翻译：一种注射成型机的注射装置，用于容易地控制充电马达和注射马达，并且高精度地控制螺杆的背压，从而使得能够执行适当的充电操作，具有注射马达，其具有适于作用的转子作为滚珠丝杠螺母，并且固定到注射装置上，注射装置安装有注射装置的加热筒。注射马达具有在连接到注射成型机的螺杆的轴的一个端部中形成滚珠丝杠的轴。滚珠丝杠拧入注射马达的转子。轴的另一端形成花键部，并且连接到具有中空驱动轴的充电电动机，其内径部分花键配合到轴的花键部分上。

9. 发明授权

US6008537A Semiconductor device with heat dissipation metal layer and metal projections 有权
标题翻译：具有散热金属层和金属突起的半导体器件
公开(公告)号：US6008537A
公开(公告)日：1999-12-28
申请号：US134331
申请日：1998-08-14
申请人： Katsuya Kosaki , Masahiro Tamaki , Hiroshi Matsuoka
发明人： Katsuya Kosaki , Masahiro Tamaki , Hiroshi Matsuoka
IPC分类号： B23K26/00 , B23K26/40 , H01L21/301 , H01L21/304 , H01L21/78 , H01L23/367 , H01L23/34 , H01L23/48
CPC分类号： H01L21/78 , H01L23/3677 , H01L2924/0002
摘要： A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second matal layers are prevented from separating from each other, and a semiconductor device produced by the method. The number of patterning steps is reduced by employing a flat exposure step for photoresist with mask alignment, A better appearance is obtained by forming the metal layers which connect the semiconductor devices with each other from a first metal layer having a lower melting point and a second metal layer having a higher melting point and severing the first metal layer and the second metal layer successively, from the first metal layer side. A second metal layer is prevented from peeling by preventing oxidation of the plated feeder layer through plating of the second metal layer.
摘要翻译：一种制造具有散热金属层的半导体器件的方法，其中图案化步骤的数量减少，激光切割产生更好的轮廓，并且防止第一和第二金属层彼此分离，并且制造由方法。通过对具有掩模对准的光致抗蚀剂采用平坦曝光步骤来减少图案化步骤的数量。通过形成将半导体器件彼此连接的金属层从具有较低熔点的第一金属层和第二金属层具有较高熔点的金属层，并且从第一金属层侧连续切断第一金属层和第二金属层。通过第二金属层的镀覆防止电镀料层的氧化，防止第二金属层剥离。

10. 发明授权

US5853559A Apparatus for electroplating a semiconductor substrate 失效
标题翻译：用于电镀半导体衬底的装置
公开(公告)号：US5853559A
公开(公告)日：1998-12-29
申请号：US891870
申请日：1997-07-09
申请人： Masahiro Tamaki , Katsuya Kosaki
发明人： Masahiro Tamaki , Katsuya Kosaki
IPC分类号： C25D5/00 , C25D5/08 , C25D7/12 , C25D17/00 , B05B5/025 , C25B9/00
CPC分类号： C25D7/123 , C25D17/02 , C25D21/04 , C25D5/003 , C25D5/08
摘要： An electroplating apparatus includes an electroplating tank having a generally flat base on which a semiconductor substrate may be placed with a surface to be electroplated oriented upwardly. A first seal seals a tank body to the flat base and a second seal seals the tank body to a peripheral portion of the surface of the semiconductor substrate. A substantially sealed volume adjacent the surface of the semiconductor substrate is produced. A gas supply tube for pressurizing the volume and an electrolyte discharge arrangement for discharging electrolyte from the volume when pressurized by a gas introduced through the gas supply tube are also provided. The discharge tube extends through a wall of the tank body to a position immediately above the surface of the semiconductor substrate within the volume.
摘要翻译：电镀设备包括具有大致平坦的基底的电镀槽，半导体衬底可以放置在其上，电镀表面向上取向。第一密封件将罐体密封到平坦基部，并且第二密封件将罐体密封到半导体基板的表面的周边部分。产生与半导体衬底的表面相邻的基本上密封的体积。还提供了用于对体积加压的气体供给管和用于通过气体供给管引入的气体加压时从体积排出电解质的电解液排出装置。放电管延伸穿过容器本体的壁直到体积内的半导体衬底的表面上方的位置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式