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    • 1. 发明申请
    • WAFER PROCESSING APPARATUS WITH WAFER ALIGNMENT DEVICE
    • 具有水平对准装置的波浪加工设备
    • US20090252580A1
    • 2009-10-08
    • US12062419
    • 2008-04-03
    • Masahiro TakizawaMasaei SuwadaMasayuki Akagawa
    • Masahiro TakizawaMasaei SuwadaMasayuki Akagawa
    • H01L21/67
    • H01L21/68707H01L21/681Y10S414/135Y10S414/136
    • A semiconductor-processing apparatus includes: a wafer handling chamber; a wafer processing chamber; a wafer handling device; a first photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer partially blocks light received by the first photosensor at a ready-to-load position and substantially entirely blocks light received by the first photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and a second photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer does not block light received by the second photosensor at the ready-to-load position and partially blocks light received by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction.
    • 一种半导体处理装置,包括:晶片处理室; 晶圆处理室; 晶片处理装置; 第一光电传感器,其设置在晶片处理室前面的晶片处理室中,在晶片处理室的位置处,晶片部分地阻挡由第一光电传感器接收的光在准备加载位置,并且当基板完全阻挡由第一光电传感器接收的光时 晶片从准备位置朝向晶片处理室在x轴方向移动; 以及第二光电传感器,其在所述晶片处理室的前方设置在所述晶片处理室的位置处,所述晶片处理室在所述晶片不会阻挡由所述第二光电传感器在所述准备加载位置接收的光的位置,并且部分地阻挡由所述第二光电传感器接收的光 晶片在准备加载位置朝向晶片处理室沿x轴方向移动。
    • 2. 发明授权
    • Wafer processing apparatus with wafer alignment device
    • 具有晶圆对准装置的晶片处理装置
    • US07963736B2
    • 2011-06-21
    • US12062419
    • 2008-04-03
    • Masahiro TakizawaMasaei SuwadaMasayuki Akagawa
    • Masahiro TakizawaMasaei SuwadaMasayuki Akagawa
    • H01L21/677
    • H01L21/68707H01L21/681Y10S414/135Y10S414/136
    • A semiconductor-processing apparatus includes: a wafer handling chamber; a wafer processing chamber; a wafer handling device; a first photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer partially blocks light received by the first photosensor at a ready-to-load position and substantially entirely blocks light received by the first photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction; and a second photosensor disposed in the wafer handling chamber in front of the wafer processing chamber at a position where the wafer does not block light received by the second photosensor at the ready-to-load position and partially blocks light received by the second photosensor when the wafer moves from the ready-to-load position toward the wafer processing chamber in the x-axis direction.
    • 一种半导体处理装置,包括:晶片处理室; 晶圆处理室; 晶片处理装置; 第一光电传感器,其设置在晶片处理室前面的晶片处理室中,在晶片处理室的位置处,晶片部分地阻挡由第一光电传感器接收的光在准备加载位置,并且当基板完全阻挡由第一光电传感器接收的光时 晶片从准备位置朝向晶片处理室在x轴方向移动; 以及第二光电传感器,其在所述晶片处理室的前方设置在所述晶片处理室的位置处,所述晶片处理室在所述晶片不会阻挡由所述第二光电传感器在所述准备加载位置接收的光的位置,并且部分地阻挡由所述第二光电传感器接收的光 晶片在准备加载位置朝向晶片处理室沿x轴方向移动。
    • 4. 发明授权
    • Optical apparatus, exposure apparatus using the same, and gas introduction method
    • 光学装置,使用其的曝光装置和气体引入方法
    • US06762412B1
    • 2004-07-13
    • US09564632
    • 2000-05-03
    • Masayuki AkagawaTaichi Taniuchi
    • Masayuki AkagawaTaichi Taniuchi
    • H01K126
    • G03F7/70833G03F7/70933
    • The optical apparatus of the present invention comprises; an optical member such as a lens; a casing containing the optical member; a gas supply device that supplies gas at a predetermined flow rate to inside the casing; and a gas introduction mechanism that reduces the flow rate of the gas supplied to inside the casing to below the predetermined flow rate. The casing has an inlet through which gas is supplied from the gas supply device to the inside. The gas introduction mechanism comprises an impingement member which is disposed between the inlet and a surface of the optical member, and the gas introduced from the inlet impinges against the impingement member. As a result, contamination of the optical member due to gas introduced to inside the casing can be reduced.
    • 本发明的光学装置包括: 诸如透镜的光学构件; 容纳光学构件的壳体; 气体供给装置,其以规定的流量向外部供给气体; 以及将供给到壳体内部的气体的流量降低到规定流量以下的气体导入机构。 壳体具有从气体供应装置向内部供应气体的入口。 气体引入机构包括设置在光学构件的入口和表面之间的冲击构件,并且从入口引入的气体撞击冲击构件。 结果,可以减少由引入到壳体内部的气体引起的光学部件的污染。